Miscellaneous Materials

Miscellaneous Materials

Thermal Interface Materials suit heat sink assembly.

Isostrate® J-Series dielectric thermal interface materials provide low thermal impedance of .48°C-inÂ-²/W, high cut-through resistance, and dielectric ratings of 4000 V/mil. Volumetric expansion at 60°C phase change temperature aids wetting action and eliminates voids and gaps due to mounting surface irregularities. Thixotropic properties prevent problems associated with...

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Substrates

GaN Substrates are offered in 2 in. diameters.

Free-standing gallium nitride (GaN) substrates have uniform dislocation density of 106cm-2 and are available with diameters of 2 in. and smaller. As solid-state blue light emitter, GaN is suited for blue laser diodes, which quadruple data storage on DVDs and print resolution in laser printers, make biomedical laser surgery safer, and double effective range for radar and satellites while...

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Miscellaneous Materials

Stereolithography Material provides long-term stability.

RenShape® SL 7580 offers ABS-like mechanical properties over extended periods of time. It exhibits rigid flexural modulus of 2,400 MPa and retains high elongation, even after aging for several months. Photopolymer produces opaque white parts that look as if they were injection molded from thermoplastic ABS. Formulated for use on solid-state SLA platforms, RenShape SL 7580 features...

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Material System produces plastic prototypes.
Prototyping Systems

Material System produces plastic prototypes.

System zp®250 includes powder, binder, and Z-Snap(TM) flexible epoxy infiltrant for use with proprietary 3D printers. Prototypes made from system are extremely tough and display flexible properties of plastic, allowing them to be used in variety of functional testing applications. Material is best suited for making parts that will be aggressively handled during testing or assembly process.

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Prototyping Systems

Materials are offered in varying densities for design work.

Medium Density Epoxy SRP boards, used for creating design models, have 42 lb/ftÂ-³ density and 68 Shore D hardness. Resistant to organic solvents, they offer heat resistance greater than 284ºF. Used for creating styling models or negative molds for casting, Ultra Low Density Urethane SRP boards have 15 lb/ft³ density and 27 Shore D hardness. Suited for milling foundry...

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Hardsurfacing Alloy suits high-impact/abrasion applications.
Miscellaneous Materials

Hardsurfacing Alloy suits high-impact/abrasion applications.

Developed for application with efficient PTA (Plasma Transferred Arc) deposition equipment, Colmonoy 80PTA is supplied as powder with uniform size distribution. Composite material contains high volume (60%) of abrasion resistant tungsten carbide particles (3500 DPH) in soft (HRC 30) impact-resistant nickel base matrix alloy. Tungsten carbide provides abrasion resistance while nickel matrix offers...

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Micro-Porous Materials suit material handling applications.
Composites

Micro-Porous Materials suit material handling applications.

METAPOR materials are based on formulation of metal or ceramic powders and epoxy binders. They are highly machinable and produced in plate form in range of standard sizes. METAPOR BF 100 AL is aluminum based and offers temperature resistance up to 230°F. METAPOR BF 210 AL is aluminum based and can be used in temperatures up to 460°F. METAPOR MC 100 AL is aluminum based and highly...

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Dielectrics offer low loss characteristics for RF modules.
Miscellaneous Materials

Dielectrics offer low loss characteristics for RF modules.

MICROLAM® 610 dielectric minimizes dielectric cracking and provides PCB mechanical reliability. Reinforced microvia material consists of FR-4 epoxy resin and continuous toughening matrix. MICROLAM® 620 dielectric suits chip package substrates. It consists of thermoset resin in reinforcing matrix with moisture resistance and mechanical reliability. MICROLAM® 630 dielectric...

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Polyimide Parts meet outgassing and ionic purity standards.
Polyimide

Polyimide Parts meet outgassing and ionic purity standards.

Pyropel HD thermoset polyimide machining stock, suitable for manufacturing parts subject to high temperatures or chemical attack, offers temperature resistance to 550 deg F. It is available machined to print or in standard 12 x 12 in. plates in thicknesses up to 1 in. Applications include metal welding and cutting equipment; wafer processing equipment; soldering fixtures; high-pressure thermal...

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