Henkel Develops Accelerated Cooling Process to Streamline Pb-Free Flip-Chip Assembly
Irvine, California, July 10, 2006--New Technology Utilizes Hysol® FP5000 and Hysol® FP5001 Non-conductive Paste Materials and Process Advantages to Reduce Warpage, Eliminate Voids and Dramatically Cut Cycle Time The electronics group of Henkel has introduced a new process, termed Accelerated Cooling (AC), to be used in conjunction with the company's two premiere, flip-chip in package...
Read More »
Wedge Material protects power generator stator coils.
NP342LS low-shrink material for Class B generators functions at up to 130°C and features strengths of 23,000 psi flexural, 12,700 psi tensile, and 37,000 psi compressive. Wedge can withstand impact force during installation as well as centrifugally and magnetically induced stresses during operation. Designed with non-abrasive phenolic-cotton composite, material can be machined to tight...
Read More »
Photoluminescent Material emits safe passage illumination.
Suited for security lighting applications and use with CCD video surveillance cameras, Acriglo® glow-in-the-dark acrylic provides 1 Â-½-2 hr of illumination without back-up power source during loss of electricity. It charges completely by luminosity emitted during normal operation, and glow emitted from fixture provides lighting capacity equivalent to moonlight. Sheets are available in...
Read More »OTC-Compliant Products cure and seal concrete.
VOC-compliant in areas affected by Ozone Transport Commission (OTC) regulations, solvent-based A team products cannot freeze, will not settle out, and are not susceptible to bacteria growth. Products included in series are styrenated acrylic sealer; non-yellowing acrylic cure and seal; and high-gloss, non-yellowing sealer. Also included, Silencure-A offers long-term silane protection, while...
Read More »
How Manufacturing Automation Can Reduce Workplace Injuries and Improve Morale
To learn more about how automation can solve your workplace issues, download the full white paper.
Read More »Prepreg suits automotive PCB applications.
Offering high temperature and voltage properties, thermally conductive and electrically insulating T-preg(TM) HTD is used to isolate copper circuit layers from aluminum or copper base plate when making metal-based PCBs. RoHS-compliant product has UL relative temperature index rating of 150°C. HTD boards and substrates are compatible with Sn-Pb and Pb-free solders as well as surface mount...
Read More »Prototyping Materials feature rubber-like properties.
By expanding mechanical properties of prototypes, photo-polymer FullCure(TM) Tango line offers feel of rubber or silicon and stretch to mate with other components. TangoBlack(TM) and TangoGray(TM) offer 61 and 75 Shore A hardness, respectively. Materials are suitable for manufacturers of products with pliable features, such as tires, toys, shoes, gaskets, keypads, over-molding, and flexible...
Read More »Ampacet Couples New Photoluminescent Masterbatches with Services to Use them Effectively
Tarrytown, NY, May 1, 2006 - Many fire laws call for long-lasting photoluminescent signs, strips and other markings to guide people out of enclosed spaces in a fire. These life-safety markings are generally made of plastic compounded with strontium aluminate, a difficult-to-process material. In light of this, Ampacet Corporation has introduced a line of improved strontium aluminate color...
Read More »
GaN-on-Diamond Wafer has gallium facing surface.
Gallium-facing GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience. Measuring 10 mmÂ-², wafer has atomically smooth...
Read More »
Gallium Nitride-on-Diamond® Wafer has 2 in. diameter.
GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience for high-power, high-frequency electronic, solid-state white lighting,...
Read More »Rogers Corp. to Introduce RO4450B(TM)-dx Bondply at IEEE MTT- S
High frequency performance and low cost circuit fabrication Show: IEEE MTT-S (International Microwave Symposium) Dates: June 13 - 15, 2006 Venue: Moscone Convention Center San Francisco, CA Booth #: 1441 Rogers, CT, April 7, 2006: Rogers Corporation (NYSE: ROG) will be introducing its new RO4450B(TM)-dx Bondply, a high fill/flow version of the industry standard RO4450B(TM) High Frequency Circuit...
Read More »
Eliminate Expensive Repairs with the Hot-Shot Pipe Thawing Machine
The new Hot Shot Pipe Thawing Machine delivers an innovative and highly effective approach to thawing frozen pipes. Easy to use and versatile, it is loaded with robust features that further suit it to many challenging environments. To learn all about it, see our video.
Read More »
