Miscellaneous Materials

Flip Chip Services

Henkel Develops Accelerated Cooling Process to Streamline Pb-Free Flip-Chip Assembly

Irvine, California, July 10, 2006--New Technology Utilizes Hysol® FP5000 and Hysol® FP5001 Non-conductive Paste Materials and Process Advantages to Reduce Warpage, Eliminate Voids and Dramatically Cut Cycle Time The electronics group of Henkel has introduced a new process, termed Accelerated Cooling (AC), to be used in conjunction with the company's two premiere, flip-chip in package...

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Wedge Material protects power generator stator coils.
Phenolic

Wedge Material protects power generator stator coils.

NP342LS low-shrink material for Class B generators functions at up to 130°C and features strengths of 23,000 psi flexural, 12,700 psi tensile, and 37,000 psi compressive. Wedge can withstand impact force during installation as well as centrifugally and magnetically induced stresses during operation. Designed with non-abrasive phenolic-cotton composite, material can be machined to tight...

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Photoluminescent Material emits safe passage illumination.
Miscellaneous Materials

Photoluminescent Material emits safe passage illumination.

Suited for security lighting applications and use with CCD video surveillance cameras, Acriglo® glow-in-the-dark acrylic provides 1 Â-½-2 hr of illumination without back-up power source during loss of electricity. It charges completely by luminosity emitted during normal operation, and glow emitted from fixture provides lighting capacity equivalent to moonlight. Sheets are available in...

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Miscellaneous Materials

OTC-Compliant Products cure and seal concrete.

VOC-compliant in areas affected by Ozone Transport Commission (OTC) regulations, solvent-based A team products cannot freeze, will not settle out, and are not susceptible to bacteria growth. Products included in series are styrenated acrylic sealer; non-yellowing acrylic cure and seal; and high-gloss, non-yellowing sealer. Also included, Silencure-A offers long-term silane protection, while...

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Composites

Prepreg suits automotive PCB applications.

Offering high temperature and voltage properties, thermally conductive and electrically insulating T-preg(TM) HTD is used to isolate copper circuit layers from aluminum or copper base plate when making metal-based PCBs. RoHS-compliant product has UL relative temperature index rating of 150°C. HTD boards and substrates are compatible with Sn-Pb and Pb-free solders as well as surface mount...

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Miscellaneous Materials

Prototyping Materials feature rubber-like properties.

By expanding mechanical properties of prototypes, photo-polymer FullCure(TM) Tango line offers feel of rubber or silicon and stretch to mate with other components. TangoBlack(TM) and TangoGray(TM) offer 61 and 75 Shore A hardness, respectively. Materials are suitable for manufacturers of products with pliable features, such as tires, toys, shoes, gaskets, keypads, over-molding, and flexible...

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Miscellaneous Materials

Ampacet Couples New Photoluminescent Masterbatches with Services to Use them Effectively

Tarrytown, NY, May 1, 2006 - Many fire laws call for long-lasting photoluminescent signs, strips and other markings to guide people out of enclosed spaces in a fire. These life-safety markings are generally made of plastic compounded with strontium aluminate, a difficult-to-process material. In light of this, Ampacet Corporation has introduced a line of improved strontium aluminate color...

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GaN-on-Diamond Wafer has gallium facing surface.
Wafers

GaN-on-Diamond Wafer has gallium facing surface.

Gallium-facing GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience. Measuring 10 mmÂ-², wafer has atomically smooth...

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Gallium Nitride-on-Diamond® Wafer has 2 in. diameter.
Wafers

Gallium Nitride-on-Diamond® Wafer has 2 in. diameter.

GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience for high-power, high-frequency electronic, solid-state white lighting,...

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Miscellaneous Materials

Rogers Corp. to Introduce RO4450B(TM)-dx Bondply at IEEE MTT- S

High frequency performance and low cost circuit fabrication Show: IEEE MTT-S (International Microwave Symposium) Dates: June 13 - 15, 2006 Venue: Moscone Convention Center San Francisco, CA Booth #: 1441 Rogers, CT, April 7, 2006: Rogers Corporation (NYSE: ROG) will be introducing its new RO4450B(TM)-dx Bondply, a high fill/flow version of the industry standard RO4450B(TM) High Frequency Circuit...

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Precision Machining Solutions with Over 25 Years of Experience
Sponsored

Precision Machining Solutions with Over 25 Years of Experience

Quality, customer service, and unbeatable value are the hallmarks of Hogge Precision. Since 1989 we have built a reputation as the go-to precision machining source, servicing many demanding industries. For CNC machining and screw machining, there are few manufacturers that can match our capabilities and expertise. See our video to learn more.

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