Miscellaneous Materials

Miscellaneous Materials

Ampacet Couples New Photoluminescent Masterbatches with Services to Use them Effectively

Tarrytown, NY, May 1, 2006 - Many fire laws call for long-lasting photoluminescent signs, strips and other markings to guide people out of enclosed spaces in a fire. These life-safety markings are generally made of plastic compounded with strontium aluminate, a difficult-to-process material. In light of this, Ampacet Corporation has introduced a line of improved strontium aluminate color...

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GaN-on-Diamond Wafer has gallium facing surface.
Wafers

GaN-on-Diamond Wafer has gallium facing surface.

Gallium-facing GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience. Measuring 10 mmÂ-², wafer has atomically smooth...

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Gallium Nitride-on-Diamond® Wafer has 2 in. diameter.
Wafers

Gallium Nitride-on-Diamond® Wafer has 2 in. diameter.

GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience for high-power, high-frequency electronic, solid-state white lighting,...

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Miscellaneous Materials

Rogers Corp. to Introduce RO4450B(TM)-dx Bondply at IEEE MTT- S

High frequency performance and low cost circuit fabrication Show: IEEE MTT-S (International Microwave Symposium) Dates: June 13 - 15, 2006 Venue: Moscone Convention Center San Francisco, CA Booth #: 1441 Rogers, CT, April 7, 2006: Rogers Corporation (NYSE: ROG) will be introducing its new RO4450B(TM)-dx Bondply, a high fill/flow version of the industry standard RO4450B(TM) High Frequency Circuit...

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Semiconductors

Semiconductor Wafer addresses classic heat problems.

Available in 10 x 10 mm square pieces, GaN-on-diamond Xero Wafer(TM) consists of gallium nitride layer atomically attached to freestanding, polycrystalline chemical-vapor-deposited diamond substrate measuring 25 microns thick. GaN that is exposed offers atomically smooth surface finish that is epi-ready for further epitaxial deposition. Sub-nanometer proximity of chip's active region to diamond...

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Photo-polymer Modeling Material has rubber-like properties.
Prototyping Systems

Photo-polymer Modeling Material has rubber-like properties.

Designed for Eden333 PolyJet(TM) rapid prototyping systems, FullCure(TM) Tango line provides flexible rubber-like 3D models early in design stage. Line includes TangoBlack(TM), with 61 Shore A hardness, and TangoGray(TM), with 75 Shore A hardness. Both products provide high elongation at break and can stretch to mate with other components. Tango products are suited for prototyping of products...

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Solder Pallet Material enhances electronics assembly.
Miscellaneous Materials

Solder Pallet Material enhances electronics assembly.

Suited for high-temperature solder pallets, WaveMax(TM) 5000 thermoset composite material supports continuous operating temperature of 260°C and withstands exposures to heat up to 360°C. Construction combines non-woven random glass mat substrate and static dissipative epoxy resin system. Machineable material has flexural strength of 30,000 psi and maintains flexural strength to 13,600...

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Paste

Die Attach Material bonds same size die stack packages.

Hysol® QMI600 semiconductor packaging material provides CTE and modulus to match existing mold compound properties, enabling wirebonds in same size die stack packages to survive thermal cycling. Silica-filled, non-conductive die attach paste exhibits stability at elevated temperatures as well as hydrophobic properties and produces void-free bond lines. Enhanced with pliable polymeric...

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Miscellaneous Materials

Semiconductor Packaging Material meets industry standards.

Hysol® GR828 green molding compound is designed for SO packages with nickel palladium gold or copper silver spot lead frames that require JEDEC Level 1, 260°C reflow and green flame retardant technology. Also suited for SO, SOP, SSOP, and TSSOP package types, non-antimony/non-bromine/non-phosphorous material is flame-retardant and conforms to UL 94 V-O at 1/8-inch thickness.

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