Ampacet Couples New Photoluminescent Masterbatches with Services to Use them Effectively
Tarrytown, NY, May 1, 2006 - Many fire laws call for long-lasting photoluminescent signs, strips and other markings to guide people out of enclosed spaces in a fire. These life-safety markings are generally made of plastic compounded with strontium aluminate, a difficult-to-process material. In light of this, Ampacet Corporation has introduced a line of improved strontium aluminate color...
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GaN-on-Diamond Wafer has gallium facing surface.
Gallium-facing GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience. Measuring 10 mmÂ-², wafer has atomically smooth...
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Gallium Nitride-on-Diamond® Wafer has 2 in. diameter.
GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience for high-power, high-frequency electronic, solid-state white lighting,...
Read More »Rogers Corp. to Introduce RO4450B(TM)-dx Bondply at IEEE MTT- S
High frequency performance and low cost circuit fabrication Show: IEEE MTT-S (International Microwave Symposium) Dates: June 13 - 15, 2006 Venue: Moscone Convention Center San Francisco, CA Booth #: 1441 Rogers, CT, April 7, 2006: Rogers Corporation (NYSE: ROG) will be introducing its new RO4450B(TM)-dx Bondply, a high fill/flow version of the industry standard RO4450B(TM) High Frequency Circuit...
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Fastener Technical Resource Guide
This fastener technical resource guide will show you how to specify nuts, points, heads, washers and more.
Read More »Semiconductor Wafer addresses classic heat problems.
Available in 10 x 10 mm square pieces, GaN-on-diamond Xero Wafer(TM) consists of gallium nitride layer atomically attached to freestanding, polycrystalline chemical-vapor-deposited diamond substrate measuring 25 microns thick. GaN that is exposed offers atomically smooth surface finish that is epi-ready for further epitaxial deposition. Sub-nanometer proximity of chip's active region to diamond...
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Photo-polymer Modeling Material has rubber-like properties.
Designed for Eden333 PolyJet(TM) rapid prototyping systems, FullCure(TM) Tango line provides flexible rubber-like 3D models early in design stage. Line includes TangoBlack(TM), with 61 Shore A hardness, and TangoGray(TM), with 75 Shore A hardness. Both products provide high elongation at break and can stretch to mate with other components. Tango products are suited for prototyping of products...
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Solder Pallet Material enhances electronics assembly.
Suited for high-temperature solder pallets, WaveMax(TM) 5000 thermoset composite material supports continuous operating temperature of 260°C and withstands exposures to heat up to 360°C. Construction combines non-woven random glass mat substrate and static dissipative epoxy resin system. Machineable material has flexural strength of 30,000 psi and maintains flexural strength to 13,600...
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Epoxy Compound offers set time of 5-7 minutes.
High-viscosity TRA-BOND 216R01 exhibits lap shears of 3,600 psi with room temperature cure and 4,500 psi with 65°C heat cure. Product is tested and certified to requirements of UL94 V-O and is RoHS compliant.
Read More »Die Attach Material bonds same size die stack packages.
Hysol® QMI600 semiconductor packaging material provides CTE and modulus to match existing mold compound properties, enabling wirebonds in same size die stack packages to survive thermal cycling. Silica-filled, non-conductive die attach paste exhibits stability at elevated temperatures as well as hydrophobic properties and produces void-free bond lines. Enhanced with pliable polymeric...
Read More »Semiconductor Packaging Material meets industry standards.
Hysol® GR828 green molding compound is designed for SO packages with nickel palladium gold or copper silver spot lead frames that require JEDEC Level 1, 260°C reflow and green flame retardant technology. Also suited for SO, SOP, SSOP, and TSSOP package types, non-antimony/non-bromine/non-phosphorous material is flame-retardant and conforms to UL 94 V-O at 1/8-inch thickness.
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TPA Motion Introduces New Curved Linear Rail Guides: the CR40 Series
For the ultimate in precision open and closed loop guided motion systems, TPA Motion is the leader in curved rail, liner guides. We specialize in engineering excellence, with products that exhibit an elevated level of precision, delivering robust performance, even under the most challenging conditions. See our video to learn more.
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