Miscellaneous Materials

Miscellaneous Barriers

Perforated Barrier blocks up to 97% of radiant heat.

Solar-SNAP(TM) Radiant Heat Barrier employs built-in spring steel battens every 24 in. to secure it in place without harming roofing components and prevent drooping. Available with 16 and 24 in. widths in 500 ft rolls, heavy-duty barrier fits effortlessly in between the trusses on underside of roof decking and can also be easily removed and reinstalled for inspection, cleaning, and repair. It...

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Hydraulic / Pneumatic / Radial Shaft Seals

Perfluoroelastomer Parts suit semiconductor manufacturing.

Offering low outgassing and thermal stability with maximum continuous service temperature of 325°C, Kalrez® 8900 Perfluoroelastomer Parts are suitable for static and dynamic sealing applications in thermal processes such as oxidation, diffusion furnace, metal CVD, ALD, and LPCVD. Suggested uses include quartz tube seals, plenum seals, chamber seals, and center ring seals.

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Coatings

Floor Coatings provide accident-proof protection.

Available in clear or colors for indoor and outdoor use, Non-Slip and Non-Skid Coatings will resist chemicals and caustics. Products are designed for both foot and vehicle traffic and are packed in 1 and 5 gallon pails. Applied by roller, permanent epoxy and rubber-based coatings are suited for use on cement, concrete, metal, steel, wood, fiberglass, aluminum, and tile, as well as ceramic and...

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Refractories

Wafer Backside Coating facilitates die attach processes.

Utilizing materials deposition techniques of stencil printing, screen printing, and spin coating, Ablestik 8000(TM) Wafer Backside Coating(TM) technology allows packaging specialists to efficiently coat back of wafers with die attach materials down to 20 microns in thickness. It comes in conductive and non-conductive formulations and is engineered to address requirements of die sizes less than 3...

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Miscellaneous Materials

Perfluroinated Elastomer withstands high temperatures.

Formulated for high-purity semiconductor processing up to 608°F, Parofluor ULTRA material FF370-75 is suited for aggressive oxygen and fluorine plasma applications requiring minimal erosions and particle generation. Purity and unique properties of this opaque black, non-filled FFKM minimize potential for particle generation in oxygen- and fluorine-rich plasmas. Through unique compounding...

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Machinable Sheet is suited for electronics test applications.
Miscellaneous Materials

Machinable Sheet is suited for electronics test applications.

With flexural modulus in excess of 1,400,000 psi and moisture absorption of .10%, Semitron MDS 100 is suited for sockets for semiconductor test and package equipment and fixtures for electronics testing. Offered in thicknesses from .04-.236 in. in sheet sizes of 9.84 and 19.68 in. square, it features coefficient of linear thermal expansion of 1.1 x 10-5, and heat deflection, or softening...

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Prototyping Systems

Photopolymer Material has polypropylene-like properties.

Addressing broad range of applications, DurusWhite FullCure430 gives same milky-white look and feel of final products made of polypropylene. It simulates toughness (Izod notched impact of 44.22 J/m), flexibility (elongation at break of 44.2%) and strength (modulus of elasticity of 1,135 MPa) of polypropylene. Available in environmental friendly, sealed 3.6 kg cartridges, DurusWhite works with...

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Alumina (Aluminum Oxide)

Ultra-High Purity Alumina suits semiconductor applications.

PlasmaPure(TM)-UC Alumina offers extreme purity (99.9%) critical for semiconductor, electronic, and optical industries. Able to extend component life and reduce contamination, ultra-high-purity ceramic material exhibits etch resistance in corrosive chemistries, minimal sodium content, and dielectric loss tangent under 0.00002. Fine-grained material also exhibits corrosion resistance and minimal...

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Coatings

Bonding Material accommodates ultrathin wafers.

Exhibiting bonded pair rigidity and thermal stability, Brewer Science WaferBOND(TM) HT-10.10 bonds fragile device wafers to rigid carriers to allow thinning and subsequent processing to create through-silicon vias (TSVs). This spin-on polymeric temporary wafer bonding material is resistant to solvents, acids, and bases. Device structure planarization with total thickness variation of less than...

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Miscellaneous Compounds

Polyamide-Based Compounds withstand heat in electronics.

Xtreme LNP(TM) Starflam(TM) compounds withstand high temperatures encountered in lead-free soldering processes. Based on technology that forms chemical bonds between PA macromolecules under E-beam radiation, they are available in 2 grades featuring non-brominated, non-chlorinated flame retardants, suited for contactors, connectors, and circuit breakers. They are also available in 2 non...

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