3M ESPE Introduces a Unique to the Market Temporization Solution
September 01, 2008 08:00 AM - New 3M(TM) ESPE(TM) Protemp Plus Temporization Material offers record breaking toughness and unique no-polish technique - ST. PAUL, Minn.-- 3M ESPE announces the launch of Protemp(TM) Plus Temporization Material, the first nanotechnology-based bis-acrylic material that includes a new generation of sophisticated fillers, offering easy handling and eliminating the need...
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Impregnation Process addresses complex porosity challenges.
IMPCO impregnation process utilizes combination of resins, cleaning technologies, and process controls, which collectively prevent spotting, bleedout, and other plating defects to minimize reject rates for manufacturers and platers of powder metal parts. PoreSeal(TM) resins are formulated for unique sponge-like attributes of P/M porosity, and impregnation process employs thorough rinsing...
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Solid Surface Material has eco-friendly composition.
Composed of bio-based resin, pre-consumer recycled granule fillers, and other natural materials, Terreon® RE is suited for high-volume, high-abuse washrooms and industrial applications. Environmentally friendly solution, constructed with 25% pre-consumer recycled content and 8% rapidly renewable material, resists stains, burns, chemicals, and impact. It comes in 8 colors and is certified to...
Read More »3D Systems Announces Availability of Industry's First Polypropylene Material
Parts From New Duraform® PP 100 Plastic Offer the Toughness and Durability of Molded Polypropylene ROCK HILL, S.C., Oct. 16, 2008 -- 3D Systems Corporation (Nasdaq:TDSC), a leading provider of 3-D Printing, Rapid Prototyping and Manufacturing solutions, announced today the availability of DuraForm® PP 100 Plastic, a new sintering material with the toughness and durability of molded...
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Laser Cutting vs. Plasma Cutting
This eBook discusses the differences between laser cutting and plasma cutting, two common thermal cutting methods.
Read More »Quickparts Offers New TangoPlus Rubber-Like Material For Rapid Prototyping
Atlanta, GA - August 26, 2008 -- Quickparts (http://www.quickparts.com), one of North America's largest providers of custom designed parts, from rapid prototyping to production parts, today announced the availability of the new TangoPlus rubber-like material for use in Rapid Prototyping. This new material offers exceptional elongation at break, excellent strength, and a high resistance to...
Read More »Silicone Sponge meets standards for flame retardance.
COHRlastic® R10400 M high-consistency rubber (HCR), closed-cell, silicone sponge meets UL 94 V-0 standard down to 1.58 mm thickness and is manufactured from blend of HCR silicone. Product has tensile strength of 100 psi, elongation of 250%, tear strength of 20 ppi, and temperature range of 100-500°F. Suited for use in equipment in outdoor communication devices, it is designed for...
Read More »Perforated Barrier blocks up to 97% of radiant heat.
Solar-SNAP(TM) Radiant Heat Barrier employs built-in spring steel battens every 24 in. to secure it in place without harming roofing components and prevent drooping. Available with 16 and 24 in. widths in 500 ft rolls, heavy-duty barrier fits effortlessly in between the trusses on underside of roof decking and can also be easily removed and reinstalled for inspection, cleaning, and repair. It...
Read More »Perfluoroelastomer Parts suit semiconductor manufacturing.
Offering low outgassing and thermal stability with maximum continuous service temperature of 325°C, Kalrez® 8900 Perfluoroelastomer Parts are suitable for static and dynamic sealing applications in thermal processes such as oxidation, diffusion furnace, metal CVD, ALD, and LPCVD. Suggested uses include quartz tube seals, plenum seals, chamber seals, and center ring seals.
Read More »Wafer Backside Coating facilitates die attach processes.
Utilizing materials deposition techniques of stencil printing, screen printing, and spin coating, Ablestik 8000(TM) Wafer Backside Coating(TM) technology allows packaging specialists to efficiently coat back of wafers with die attach materials down to 20 microns in thickness. It comes in conductive and non-conductive formulations and is engineered to address requirements of die sizes less than 3...
Read More »Perfluroinated Elastomer withstands high temperatures.
Formulated for high-purity semiconductor processing up to 608°F, Parofluor ULTRA material FF370-75 is suited for aggressive oxygen and fluorine plasma applications requiring minimal erosions and particle generation. Purity and unique properties of this opaque black, non-filled FFKM minimize potential for particle generation in oxygen- and fluorine-rich plasmas. Through unique compounding...
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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