Microelectromechanical Systems (MEMS)

Vision and Imaging Sensors / Detectors

Murata Showcases New Sensor Innovations at Sensor + Test Exhibition

Stand 12-294 SENSOR+TEST 2013 NÃ-¼rnberg, May 14-16 Hoofddorp, Netherlands – Murata today announced it will be demonstrating several new sensor technologies on its exhibition stand at the forthcoming SENSOR+TEST 2013 event in Nürnberg, Germany. One of the innovations on display will be a single optical sensor that has potential application as a touch-less gesture sensor for use with...

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Miscellaneous Switches

EXFO Launches MXS-9100 MEMS Matrix Optical Switch

QUEBEC CITY - EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announces the launch of the MXS-9100, jointly developed withÂ-  DiCon and available exclusively from EXFO. DiCon Fiberoptics' MXS-9100MEMS MxN Matrix Optical Switch is optimized for use with EXFO systems and software control, and allows any M input fibers to connect to any N output fibers in a fully non-blocking manner. Today's network...

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EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
Wafer Transfer Systems

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC...

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Multitest's Solution for 3D Packages Wins NPI Award
Microelectromechanical Systems (MEMS)

Multitest's Solution for 3D Packages Wins NPI Award

Rosenheim, Germany - Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that it has been awarded a 2013 NPI Award from Circuits Assembly magazine in the category of Test Inspection – Functional Test for its InStrip 3D. The award was presented to the company...

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Circuits

Single-Chip Magnetometer suits space-constrained applications.

Measuring 2 x 2 x 1 mm, 3-axis LIS3MDL offers flexibility for designers to implement movement and position detection in space-constrained products such as smartphones, tablets, and personal navigation devices. Standalone magnetometer is also suited to indoor navigation applications where it calculates dead-reckoning when no satellite signal is available. To build sensors with up to 9 DOF, chip...

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Miscellaneous Controllers

Maxim Integrated to Demonstrate a More Integrated World at Mobile World Congress

Maxim will showcase multiple differentiated and highly integrated portable equipment and communications solutions for mobile platforms. SAN JOSE, Calif. - At the 2013 Mobile World Congress in Barcelona, Spain, Maxim Integrated Products, Inc. (NASDAQ: MXIM) will showcase its unique and highly integrated portable equipment and communications solutions for mobile platforms. Maxim will host nine...

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Accelerometers

STMicroelectronics and PNI Sensors are Selected for Nintendo's Wii U

Geneva and Santa Rosa - STMicroelectronics (STM), the world’s leading MEMS manufacturer, and PNI Sensor Corporation, the U.S.- based geomagnetic-sensor manufacturer, today announced that Nintendo Co., Ltd. has adopted an advanced sensor solution for Nintendo's newly launched Wii UTM that includes sensors from ST and PNI. PNI's 3-axis geomagnetic sensor, based on proprietary magneto-inductive...

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Motion Sensors / Detectors / Transducers

Bosch Designs Application-Specific Integrated Circuits for MEMS Sensors in Dresden

Focus on automotive and consumer applications Â-· Design of Integrated Circuits for customer-specific demands · Engagement in one of the most dynamic microelectronics centers in Europe Bosch has started its ASICs (Application-Specific Integrated Circuits) design activities for micro-electromechanical systems (MEMS) sensors in Dresden, Germany. These sensors are silicon-based and...

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Implants

ISSYS Has Received Certification for Both ISO-13485:2003 and EN-13980:2002 Quality Standards

YPSILANTI, MI - Integrated Sensing Systems, Inc. (ISSYS) announced that it has received certifications for both ISO-13485:2003 and EN-13980 quality standards in addition to ISO-9001:2008. ISO-13485-2003 is an internationally recognized quality standard for the development and manufacturing of medical devices to provide harmonization of the Quality management system in the international market....

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Miscellaneous Analyzers

Xsens and STMicroelectronics Demonstrate Wearable Wireless 3D Body Motion Tracking

Enschede, the Netherlands, and Geneva, Switzerland - Xsens, the leading innovator in 3D motion tracking technology and products, and STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the world's top manufacturer of Micro-Electro-Mechanical Systems (MEMS) 1, are demonstrating the world's first wearable wireless 3D...

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