Microelectromechanical Systems (MEMS)

Vision and Imaging Sensors / Detectors

Murata Showcases New Sensor Innovations at Sensor + Test Exhibition

Stand 12-294 SENSOR+TEST 2013 NÃ-¼rnberg, May 14-16 Hoofddorp, Netherlands – Murata today announced it will be demonstrating several new sensor technologies on its exhibition stand at the forthcoming SENSOR+TEST 2013 event in Nürnberg, Germany. One of the innovations on display will be a single optical sensor that has potential application as a touch-less gesture sensor for use with...

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Miscellaneous Switches

EXFO Launches MXS-9100 MEMS Matrix Optical Switch

QUEBEC CITY - EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announces the launch of the MXS-9100, jointly developed withÂ-  DiCon and available exclusively from EXFO. DiCon Fiberoptics' MXS-9100MEMS MxN Matrix Optical Switch is optimized for use with EXFO systems and software control, and allows any M input fibers to connect to any N output fibers in a fully non-blocking manner. Today's network...

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EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
Wafer Transfer Systems

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC...

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Multitest's Solution for 3D Packages Wins NPI Award
Microelectromechanical Systems (MEMS)

Multitest's Solution for 3D Packages Wins NPI Award

Rosenheim, Germany - Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that it has been awarded a 2013 NPI Award from Circuits Assembly magazine in the category of Test Inspection – Functional Test for its InStrip 3D. The award was presented to the company...

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PCB Fabrication Notes Guide
Sponsored

PCB Fabrication Notes Guide

The overall purpose of your fabrication notes is to enhance Design for Manufacturability for optimal PCB fabrication and assembly while maintaining applicable industry standards and regulations.

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Circuits

Single-Chip Magnetometer suits space-constrained applications.

Measuring 2 x 2 x 1 mm, 3-axis LIS3MDL offers flexibility for designers to implement movement and position detection in space-constrained products such as smartphones, tablets, and personal navigation devices. Standalone magnetometer is also suited to indoor navigation applications where it calculates dead-reckoning when no satellite signal is available. To build sensors with up to 9 DOF, chip...

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Miscellaneous Controllers

Maxim Integrated to Demonstrate a More Integrated World at Mobile World Congress

Maxim will showcase multiple differentiated and highly integrated portable equipment and communications solutions for mobile platforms. SAN JOSE, Calif. - At the 2013 Mobile World Congress in Barcelona, Spain, Maxim Integrated Products, Inc. (NASDAQ: MXIM) will showcase its unique and highly integrated portable equipment and communications solutions for mobile platforms. Maxim will host nine...

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Accelerometers

STMicroelectronics and PNI Sensors are Selected for Nintendo's Wii U

Geneva and Santa Rosa - STMicroelectronics (STM), the world’s leading MEMS manufacturer, and PNI Sensor Corporation, the U.S.- based geomagnetic-sensor manufacturer, today announced that Nintendo Co., Ltd. has adopted an advanced sensor solution for Nintendo's newly launched Wii UTM that includes sensors from ST and PNI. PNI's 3-axis geomagnetic sensor, based on proprietary magneto-inductive...

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Motion Sensors / Detectors / Transducers

Bosch Designs Application-Specific Integrated Circuits for MEMS Sensors in Dresden

Focus on automotive and consumer applications Â-· Design of Integrated Circuits for customer-specific demands · Engagement in one of the most dynamic microelectronics centers in Europe Bosch has started its ASICs (Application-Specific Integrated Circuits) design activities for micro-electromechanical systems (MEMS) sensors in Dresden, Germany. These sensors are silicon-based and...

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Implants

ISSYS Has Received Certification for Both ISO-13485:2003 and EN-13980:2002 Quality Standards

YPSILANTI, MI - Integrated Sensing Systems, Inc. (ISSYS) announced that it has received certifications for both ISO-13485:2003 and EN-13980 quality standards in addition to ISO-9001:2008. ISO-13485-2003 is an internationally recognized quality standard for the development and manufacturing of medical devices to provide harmonization of the Quality management system in the international market....

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Miscellaneous Analyzers

Xsens and STMicroelectronics Demonstrate Wearable Wireless 3D Body Motion Tracking

Enschede, the Netherlands, and Geneva, Switzerland - Xsens, the leading innovator in 3D motion tracking technology and products, and STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the world's top manufacturer of Micro-Electro-Mechanical Systems (MEMS) 1, are demonstrating the world's first wearable wireless 3D...

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