Measuring Equipment

Dynamometers

Medical Handgrip Dynamometer features digital display.

Constructed with lightweight molded body, microFET utilizes precision electronic load cells to eliminate possibility of oil leakage that can occur with hydraulic units.- Bluetooth technology allows for wireless use with clinical or data collection research software to optimize accuracy and accessibility.

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Dynamometers

Medical Handgrip Dynamometer features digital display.

Constructed with lightweight molded body, microFET utilizes precision electronic load cells to eliminate possibility of oil leakage that can occur with hydraulic units.Â- Bluetooth technology allows for wireless use with clinical or data collection research software to optimize accuracy and accessibility.

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Semiconductors

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SAN FRANCISCO- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for...

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Semiconductors

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SAN FRANCISCOÂ- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount...

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Sponsored

6 Challenges Faced by Supply Chain Leaders in Discrete Manufacturing and How Analytics Solves Them

This eBook describes the challenges faced by Supply Chain Leaders in Discrete Manufacturing. From consumer electronics to automotive manufacturing, most of the global economy's largest industries rely on discrete manufacturing. Manufacturers in these industries face several unique challenges. The COVID-19 pandemic, followed by war, created major disruptions in supply chains worldwide, stressing the need for more integrated, transparent systems that would facilitate proactive management and faster decision-making. With supply chain issues expected to continue in 2022 and beyond, this ebook will help describe to supply chain leaders ways to prepare for certain global challenges.

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Measuring Equipment

General Peeling Jig measures lid strength.

Middleboro, MA – Brookfield Engineering introduces the TA-GPJ  – General Peeling Jig was developed to measure the force required to peel the lid off a sealed container.  A strong adhesive bond is critical to preventing contamination and spoilage, but ease and consistency when opening is equally important to consumers. Manufacturers understand that finding the right lid strength is one more...

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Measuring Equipment

General Peeling Jig measures lid strength.

Middleboro, MA – Brookfield Engineering introduces the TA-GPJ-  – General Peeling Jig was developed to measure the force required to peel the lid off a sealed container.  A strong adhesive bond is critical to preventing contamination and spoilage, but ease and consistency when opening is equally important to consumers. Manufacturers understand that finding the right lid strength is one...

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Measuring Equipment

Automated Measurement System aids image sensor manufacturing.

Featuring seamless software integration with GEMINI-® FB fusion wafer bonding system, EVG®40NT supports manufacture of 3D-integrated CMOS image sensors. Automated system performs non-destructive, top-to-bottom side alignment accuracy measurements on double-sided structured wafers or bond interfaces as well as critical dimension and box-in-box measurements of single- and double-sided...

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Measuring Equipment

Automated Measurement System aids image sensor manufacturing.

Featuring seamless software integration with GEMINIÂ-® FB fusion wafer bonding system, EVG®40NT supports manufacture of 3D-integrated CMOS image sensors. Automated system performs non-destructive, top-to-bottom side alignment accuracy measurements on double-sided structured wafers or bond interfaces as well as critical dimension and box-in-box measurements of single- and...

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Lico 690 and 620 Colorimeter
Comparators

Lico 690 and 620 Colorimeter

Lico® 690 Colorimeter is a high performance Spectro-Photometer for professional color measurements of clear, transparent liquids with reference beam technology. Exact color calculations which conform to several DIN-ISO-ASTM standards or AOCS Methods are done with only one measurement. Traditional visual color values like the iodine color value, Hazen or Gardner are displayed as well as modern...

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Lico 690 and 620 Colorimeter
Comparators

Lico 690 and 620 Colorimeter

Lico-® 690 Colorimeter is a high performance Spectro-Photometer for professional color measurements of clear, transparent liquids with reference beam technology. Exact color calculations which conform to several DIN-ISO-ASTM standards or AOCS Methods are done with only one measurement. Traditional visual color values like the iodine color value, Hazen or Gardner are displayed as well as modern...

Read More »

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