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Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged... Read More
(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force,... Read More
PF606-P245 Lead-free Solder Paste is suitable for PCB designs. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.Read More
PF606-P140 Lead-free Solder Paste offers continuous high-speed printability. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.Read More
Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017May 05, 2017
Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif.
Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF... Read More
Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo.
Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes:
- Are designed to provide ultra-low voiding
- Offer great print capabilities for small and low profile components
- Are designed to overcome... Read More
Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMSÂ®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif. InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key... Read More
Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at SMTA International (SMTAI) 2016 on Sept. 27 and 28, in Rosemont, Ill. Indium8.9HF is specifically formulated to Avoid the Void™ while delivering high transfer efficiency with low variability. This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique... Read More
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Available in 3/32 in. diameter, FabCOÂ® 85HXP Wire optimizes deposition rates and travel speeds, particularly when welding thick materials up to 6–8 in. Gas-shielded flux-cored wire operates with 100% CO2 and has AWS classification of E70T-5CJ H4. Low hydrogen levels help mitigate cracking risks and rework. Wire is suited for flat and horizontal welding of earth moving equipment, non-alloyed... Read More
Triton PTH (Press to Heat), or HOT LIPS,Â includes transformer housed in box withÂ carry handle. This design promotes transformer mobility and stability. Using plier action to supply instant heat, handheld tool draws up to 30 A on High setting and at no load resistance. Carbon electrodes are standard, and wire electrode tips are alternatively available to reach tight areas. WeighingÂ 4 oz,... Read More
ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,... Read More
Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Â Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its LoctiteÂ® GC 3W and Gap PadÂ® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product development.Â ... Read More
In addition to low manganese levels, FabCOÂ® Element 71C and 71M offer optimized out-of-position capabilities, enabling welding operators to create quality welds regardless of joint placement. Gas-shielded flux-cored wires produce low spatter levels and have fast-freezing, easy-to-remove slag. Available in diameters of 0.045, 0.052, and 1/16 in. on 33 lb fiber spools, Element 71C is formulated... Read More
ViscoTec has proven high expertise particularly in complex dosing environments. ViscoTec's brand preeflow shows the capability to operate reliable, extremely precise and repeatable for various applications in many industries. With the help of the precision volume dispenser “eco-SPRAY” preeflow explores new paths. Soldering pastes are pasty mixtures of solder powder and flux agents, which... Read More
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut two additional new products at the 2016 IPC APEX EXPO. A new McDry Cabinet and Eightech reflow soldering system will be introduced at the show. The McDry (HM-1001BNF) with Automatic N2 Flow Rate Control allows nitrogen to flow in at up to 20 L/min until the oxygen level... Read More
GARDEN GROVE, CA - Metcal has announced that it is a premier sponsor of the fifth annual IPC APEX EXPOÂ® Hand Soldering World Championship, scheduled to take place March 16-17, 2016 at the Las Vegas Convention Center during the IPC APEX EXPO. Competitors from around the world will compete for a cash prize of $1,000 presented by the IPC. Jerry Simmons, Marketing Manager, commented, “Metcal is... Read More
GARDEN GROVE, CA - Metcal today announced plans to exhibit in Booth #3412 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will show the Metcal USF-1000 Solder Wire Feed System for the first time, along with Metcal's proven rework and repair equipment, including the Scarab Site Cleaning System, Scorpion Rework... Read More
Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.Â In addition toÂ minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack over... Read More
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev. Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved... Read More
Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016Jan 11, 2016
Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical. Gold-based solder has a high melting point, ranging from 280Â°C to 1064Â°C (depending on the alloy), making it compatible with subsequent reflow... Read More