Soldering Equipment & Supplies

Materials & Material Processing

Soldering/De-Soldering System comes with dual LCD displays.

Oct 11, 2017

Used in general purpose soldering and lead-free soldering applications, Soldering/De-Soldering System is operated in 160° - 480°C temperature range. Featuring high quality sensor for precise control at soldering tip, system consists of 200W soldering iron and 130W de-soldering pump. Product gets heated up to 350°C in less than 30 seconds. Unit’s LCD displays provide information of both... Read More

Materials & Material Processing

Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.

Oct 07, 2017

Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged... Read More

Adhesives & Sealants, Materials & Material Processing

High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste

Sep 16, 2017

(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force,... Read More

Materials & Material Processing

PF606-P245 Lead-free Solder Paste offers continuous high-speed printability.

Sep 14, 2017

PF606-P245 Lead-free Solder Paste is suitable for PCB designs. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.

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Materials & Material Processing

PF606-P140 Lead-free Solder Paste is suitable for PCB designs.

Sep 13, 2017

PF606-P140 Lead-free Solder Paste offers continuous high-speed printability. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.

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Materials & Material Processing

Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017

May 05, 2017

Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif.

Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF... Read More

Machinery & Machining Tools, Materials & Material Processing

SEHO Provides Complete Solutions

May 03, 2017

Innovative Technology from SEHO

SEHO is the leading global manufacturer of complete solutions, providing innovative systems for all fields of automated soldering processes, solutions for automated optical solder joint inspection, and automized production lines including board handling, creative work places and intelligent material management. At SEHO we combine innovative engineering... Read More

Materials & Material Processing

Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain

Jan 05, 2017

Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo.

Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes:

  • Are designed to provide ultra-low voiding
  • Offer great print capabilities for small and low profile components
  • Are designed to overcome... Read More

Materials & Material Processing

Universal's Flexbond Wins Global Technology Award at SMTA International

Oct 17, 2016

Unique architecture enables the first true volume solution for today’s consumer demands. Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT Packaging Global Technology Award at the 2016 SMTA International trade show in Chicago, IL as the top machine in the “Bonding Equipment” category. Winners were selected by an independent, international panel and... Read More

Machinery & Machining Tools, Materials & Material Processing

Vapor Phase Soldering System offers inline convection alternative.

Sep 20, 2016

Along with 6–9 min cycle times or less, programmable 4040 provides SMT assemblers with optimized soldering quality, instant product changeovers, and 0% risk of overheating. Design enables installation in any workspace without requiring complex ductwork and external venting, while heat transfer efficacy and gentle conditions of vapor phase process minimize exhaust generation. Other... Read More

Cleaning Products & Equipment, Materials & Material Processing, Optics & Photonics, Test & Measuring Instruments, Vision Systems

Ascentech to Exhibit Optilia Inspection, GEN3 Systems Solutions at SMTAI 2016 in Booth #219

Sep 12, 2016

Chester, Connecticut, USA – Ascentech, LLC will exhibit and demonstrate new test and process optimization instruments and solutions at the upcoming SMTA International Conference and Exhibition in Rosemont, IL, Sep. 25 - 29, 2016. Ascentech will exhibit these new products in booth #219.  Products will include the Solder Saver Solder/Dross separation tool, award-winning GENSONIC Ultra-Sonic... Read More

Materials & Material Processing

Indium Corporation Features InFORMS® Reinforced Solder Preforms at IMAPS 2016

Aug 22, 2016

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif. InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key... Read More

Materials & Material Processing

Avoid the Void(TM): Indium Corporation's Indium8.9HF Solder Paste to be Featured at SMTAI

Jul 28, 2016

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at SMTA International (SMTAI) 2016 on Sept. 27 and 28, in Rosemont, Ill. Indium8.9HF is specifically formulated to Avoid the Void™ while delivering high transfer efficiency with low variability. This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique... Read More

Materials & Material Processing

IBL Technologies Brings its Economy Vapor Phase Soldering System to the PHASE 4, Inc. Mini Show

Jul 15, 2016

BURNSVILLE, MN - July 2016 - IBL Technologies, LLC today announced plans to participate in the PHASE 4, Inc. Mini-show Technical conference, scheduled to take place August 9-11, 2016 at TechShop in Chandler, AZ. Jochen Lipp, CEO of IBL Technologies, will be available to demonstrate the redesigned SV260 Economy Vapor Phase Soldering Machine for small series and prototyping. The SV260 reflow vapor... Read More

Materials & Material Processing, Welding Equipment & Supplies

Flux-cored Wire offers high feed speed potential.

May 20, 2016

Available in 3/32 in. diameter, FabCO® 85HXP Wire optimizes deposition rates and travel speeds, particularly when welding thick materials up to 6–8 in. Gas-shielded flux-cored wire operates with 100% CO2 and has AWS classification of E70T-5CJ H4. Low hydrogen levels help mitigate cracking risks and rework. Wire is suited for flat and horizontal welding of earth moving equipment, non-alloyed... Read More

Materials & Material Processing

Resistance Soldering Tool is designed for facilitated handling.

May 16, 2016

Triton PTH (Press to Heat), or HOT LIPS, includes transformer housed in box with carry handle. This design promotes transformer mobility and stability. Using plier action to supply instant heat, handheld tool draws up to 30 A on High setting and at no load resistance. Carbon electrodes are standard, and wire electrode tips are alternatively available to reach tight areas. Weighing 4 oz,... Read More

Adhesives & Sealants, Materials & Material Processing

ECTC is 1 Month Away! Visit Yincae Booth # 506 May 31st to June 3rd

May 12, 2016

ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,... Read More

Materials & Material Processing

Henkel Solder and Thermal Innovations Earn Industry Recognition

Apr 26, 2016

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.  Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product development. ... Read More

Materials & Material Processing, Welding Equipment & Supplies

Low Manganese Wires help meet environmental regulations.

Apr 19, 2016

In addition to low manganese levels, FabCO® Element 71C and 71M offer optimized out-of-position capabilities, enabling welding operators to create quality welds regardless of joint placement. Gas-shielded flux-cored wires produce low spatter levels and have fast-freezing, easy-to-remove slag. Available in diameters of 0.045, 0.052, and 1/16 in. on 33 lb fiber spools, Element 71C is formulated... Read More

Material Handling & Storage, Materials & Material Processing

Spraying of Abrasive Soldering Paste

Apr 06, 2016

ViscoTec has proven high expertise particularly in complex dosing environments. ViscoTec's brand preeflow shows the capability to operate reliable, extremely precise and repeatable for various applications in many industries. With the help of the precision volume dispenser “eco-SPRAY” preeflow explores new paths. Soldering pastes are pasty mixtures of solder powder and flux agents, which... Read More