Substrates

Vishay Intertechnology to Showcase Leading Vishay Electro-Films Products at 2014 SPIE Photonics West Exhibition

MALVERN, Pa.Â- – Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2014 SPIE Photonics West Exhibition, taking place from Feb. 4-6 at the Moscone Center in San Francisco. In booth 5618, products on display will include a wide range of Vishay EFI custom submounts, custom substrates with...

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Thermal Technology Ships 14 K1 Sapphire Crystal Growers to Europe

Thermal Technology Ships 14 K1 Sapphire Crystal Growers to Europe

SANTA ROSA, Calif.-Â- Thermal Technology, a leading manufacturer of crystal growth equipment and high temperature furnace systems, recently shipped 14 K1 HB LED-grade sapphire crystal growers to a customer in Europe.Â-  The K1’s large 90kg sapphire boule is optimized for 4” and 6” cores used in LED production, with 8” cores possible. “We continue to strengthen our position in...

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HexaTech Validates AlN Substrate Platform for UV-C Laser Fabrication with Record-Breaking Lasing Performance

Lasing breakthrough demonstrated in optically pumped, 264 and 280 nm lasers fabricated on HexaTech AlN substrates MORRISVILLE, N.C. - In a parallel effort to its development of UV-C light emitting diodes (LEDs), HexaTech recently demonstrated optically pumped, AlGaN-based lasers grown on highest-quality, single crystalline AlN substrates. Laser structures fabricated at HexaTech and tested in...

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Ahlstrom Achieves Registered Latex Developer Certification from HP

Ahlstrom Corporation PRESS RELEASE - Ahlstrom Corporation, a global high-performance materials company, has taken part in the HP Registered Latex Development Program and a wide number of Ahlstrom's poster papers and wallcover substrates have met the HP compatibility standard. After successful completion of the certification tests on different large-format HP Latex printers, Ahlstrom has been...

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Lead Carrier Substrate enables multi-row QFN packages.

Comprised of sintered metal array of wire bond and die attach pads delivered on temporary thin metal strip, xLC(TM) substrate enables packaging companies to produce Quad Flat No Lead (QFN) semiconductor packages with hundreds of leads and multiple rows. This direct replacement for leadframe is completely compatible with all QFN processing and enables packages to be made with as many rows as...

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Abrisa Technologies Provides Precision Bio-Tech Glass Fabrication & Thin Film Coatings for Medical Devices

Abrisa Technologies Provides Precision Bio-Tech Glass Fabrication & Thin Film Coatings for Medical Devices

Abrisa Technologies designs, manufactures, and most importantly, delivers customized precision optical glass assemblies and thin film optical coatings for medical devices and analytical instruments. Glass is often the material of choice for medical test devices and analytical instrumentation where material compatibility, durability, and transparency are required. Glass is cleanable, dimensionally...

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Ceramic Substrate suits thick-film applications.

Designed to address miniaturization and higher-power applications, DuraStrate consists of fine-grained (1.5-2.0 micron) microstructure material optimized for biaxial flexural strength, consistent thicknesses, camber flatness, and aged adhesion. Ceramic substrate material is designed for optimal performance in very thin (10-15 mil) varieties of thick-film substrates.

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PGI Introduces New Moldable Substrates for the Automotive Industry

Recyclable Material for Trunk and Wheel Well Liners Reduces Noise in Vehicles MIAMI, April 26 /- Polymer Group, Inc. (PGI) (OTC Bulletin Board: POLGA; POLGB) today introduced new substrates for moldable automotive components made from recyclable materials that improve acoustics in vehicles. Used in trunk and wheel well liners, the substrates made from recyclable polypropylene and polyethylene...

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Cree Demonstrates 100-mm Zero-Micropipe Silicon Carbide Substrates

DURHAM, N.C., MAY 23, 2007 - Cree, Inc., (Nasdaq: CREE) announced today that it has achieved another milestone in the development of silicon carbide (SiC) technology with the demonstration of 100-mm (4-.in.), Zero-Micropipe (ZMP(TM)), n-type SiC substrates. Micropipes, common crystalline defects in SiC, can not only decrease the number of usable electronic devices produced per wafer, but can also...

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