Material Processing

Hanger Machine cleans and prepares odd-shaped work pieces.

Hanger Machine cleans and prepares odd-shaped work pieces.

Self-contained Smartline(TM) Y Track Spinner Hanger Machine consists of blast cabinet built from welded steel frame with internal lining of Â-¼ in. manganese steel plating on blast side and opposing wall. Vertical bucket elevator, driven by 1.5 hp gear motor, transfers abrasive media from lower hopper. Two trolley hangers, which can each handle loads of 1,100 lb, allow for one trolley to load...

Read More »

Filter Bag Removal Tool facilitates change-out process.

Operated by cordless drill, pneumatic wrench, or hand tool, Grapoid(TM) facilitates removal of top loading snap-in pleated and felt bags in baghouses. Device allows one user to break bag's seal without effort, resulting in removal rates of 10 sec/bag and avoiding damage to bags to ensure their reusability. This method of bag removal also eliminates bags being dropped into hopper, avoiding...

Read More »

Fan Tray features cross-flow cooling technique.

Baffled fan tray utilizes cross-flow cooling fan and features adjustable depth as well as local and remote alarms. Due to its unique configuration, tray requires only 75 cfm. This low-wattage (6 W), 19 in. rack-mount fan tray assembly is CSA-, NEBS-, and UL-compliant. Applications include cooling of rack- and cabinet-mounted electronic equipment in telecommunications, commercial, military, and...

Read More »
Added Flexibility in Soldering and Desoldering

Added Flexibility in Soldering and Desoldering

OK International announces four new soldering/desoldering equipment packages as additions to its MFR Series. Setting new standards for flexibility, capability, reliability and value in high-performance rework equipment. Unique design features, state-of-the-art tools and a range of upgrade options. The MFR Soldering/Desoldering Systems are the latest range of soldering/desoldering equipment from...

Read More »
Granulator reduces size of rubber bales.

Granulator reduces size of rubber bales.

Model KM30 has low friction cutting design that reduces whole bales of natural and synthetic rubber to small bits. This 150 hp unit features large throat and split clam shell design that allows for maintenance of cutters and screens. Design minimizes heat rise so no cooling systems is needed. Optional features include automatic controller, infeed and discharge conveying system, pneumatic...

Read More »

Surface Engineering Platform uniformly coats substrates.

Using liquid precursor which is atomized and sprayed into plasma jet, PlasmaStream(TM) coats surfaces to provide characteristics such as adhesion, waterproofing, low-friction slickness, or anti-microbial properties. Suitable for manufacturers of 3D, rigid, or molded parts, platform eliminates need for drying and curing; works at room temperature; requires no solvents, surfactants, or water; and...

Read More »
Filter Bags suit liquid filtration applications.

Filter Bags suit liquid filtration applications.

Available in polypropylene and polyester materials, needled felt DURAGAF(TM) Filter Bags feature all welded construction to eliminate process media bypass, which can occur in sewn filter bags. Fabric welding technology produces seam that stands up to demanding applications without failure. Pressure-actuated SENTINELÂ-® Seal Ring maximizes seal as differential pressure increases.

Read More »
Surface Cleaner handles up to 17,298 sq ft/hr.

Surface Cleaner handles up to 17,298 sq ft/hr.

Model ANT3C Contractor Hydro TwisterÂ-® Surface Cleaner features corrosion resistant stainless steel construction, heavy duty swivel, and 3 permanently lubricated sealed bearings. Two nozzles rotate at up to 2,000 rpm, while SIX-SHOOTER gum/spot nozzle, which can be mounted on either right or left side with zero tolerance offset, blasts stubborn spots or embedded gum. Integrated water broom...

Read More »

New Tools from DEK Enable 25 Micron Backside Wafer Coating at High-Speed

Fueled by the need for faster processing times and smaller device footprints, DEK has developed a next-generation equipment and tooling package that enables the coating of wafers with ultra-thin die attach materials down to 25 microns in thickness. Traditional dispensing methods and paste die attach processes have manufacturing challenges such as the inability to achieve emerging UPH (units per...

Read More »

All Topics