Material Processing

Converters

On-Site GTL System can transform wasted flare gas into fuels.

Applicable to scales as small as 350 barrels per day, small-scale gas-to-liquids (GTL) system transforms formerly wasted or stranded flared gas into liquid products directly on-site.- Proprietary STG+ process converts 1 MMBtu of natural gas directly into ~5 gal of liquid fuels. Portability, scalability, flexibility, and modularity fosters use in remote locations as well as integration with...

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Converters

On-Site GTL System can transform wasted flare gas into fuels.

Applicable to scales as small as 350 barrels per day, small-scale gas-to-liquids (GTL) system transforms formerly wasted or stranded flared gas into liquid products directly on-site.Â- Proprietary STG+ process converts 1 MMBtu of natural gas directly into ~5 gal of liquid fuels. Portability, scalability, flexibility, and modularity fosters use in remote locations as well as integration...

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Miscellaneous Processors

Communications Processors foster connection between devices, car.

With integrated Wi-FiÂ-®, Bluetooth®, Bluetooth low energy, and GPS/GNSS technologies, WiLink™ 8Q series delivers complete wireless connectivity experience for automotive infotainment systems via all-in-one AEC-Q100 qualified chip. Automotive-grade wireless connectivity devices work with range of infotainment processors and support advanced multimedia use cases while...

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Semiconductor Processing Equipment

Electron Beam Metallization System suits 100 and 150 mm wafers.

Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping...

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Semiconductor Processing Equipment

Electron Beam Metallization System suits 100 and 150 mm wafers.

Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping...

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Miscellaneous Processors

Apical's Assertive Display is Now Available on the Latest Marvell Mobile Communication Processor Chipsets

LONDON,- – Apical Ltd announces that Marvell's latest ARMADA mobile communication processors will become the first devices to address the low cost but high performance volume market featuring Apical's Assertive Display for an enhanced multimedia experience at lower power. Assertive Display enables mobile devices to deliver unprecedented display quality under all conditions. It does so by...

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Transistors

ANSYS and Intel Collaborate to Deliver Power, EM and Reliability Sign-Off Reference Flow for Customers of Intel Custom Foundry

Collaboration Enables 14nm Design Platform for Mobile and Cloud Market Segment PITTSBURGH and SANTA CLARA, Calif. -- ANSYS, Inc. (NASDAQ: ANSS), and Intel Corporation, a world leader in computing innovation, today announced the availability of a production-proven reference flow for power, EM and reliability sign-off using ANSYS simulation solutions for Intel's 14nm Tri-Gate process. This...

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