Machinery

Speedline Technologies Announces New Chemical Isolation Option for Its Popular ACCEL MicroCel S2 Centrifugal Cleaning System

FRANKLIN, Mass., Aug. 3 / - Speedline Technologies today announced the availability of a new chemical isolation option for the ACCEL MicroCel S2 centrifugal cleaning system. This platform enhancement improves existing zero-discharge systems and extends the life of mixed-bed deionizing resins. The MicroCel S2 open programming platform and superior interface make this chemical isolation option a...

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Universal Instruments Enhances Package-on-Package Flexibility

Universal Instruments Enhances Package-on-Package Flexibility

In response to rising demand for Package-on-Package (PoP) applications, Universal has developed new hardware and process technology to accommodate effective flux dipping and soldering for enhanced manufacturing flexibility. Demand for PoP technology is certainly growing, rendering continual innovation in hardware and process technology absolutely vital for successful implementation industry-wide,...

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Tool Presetter comes with laser edge finder.

Tool Presetter comes with laser edge finder.

Suited for use as standby units for smaller manufacturers, ECO210 MVII Microset presetter features rotating tool adapter with ISO 40 and 50 tapers as well as HSK taper sizes. Ergonomic unit, offering one-hand operation of co-ordinate slides, has toolholder capacity of 415 mm dia x 465 mm length. In addition to sealed keyboard and Metric/English conversion switch, unit employs CCD camera with 20:1...

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Defect Removal System targets potato processing industry.

Designed to detect and cut out defects in potato strips at rates to 16,200 lb/hr, ADRÂ-® 5 integrates inspection capabilities of G6 electro-optical platform with modular vision engine and trichromatic cameras. Components include Hi-Res Vis/IR cameras, belt conveyor, rotary cutter, and Iso-FloÂ-® vibratory conveyors, combined to facilitate process of aligning, isolating, inspecting, and...

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Universal Instruments AdVantis-Lightning Chip Placement Solution on Display at NEPCON

Universal Instruments AdVantis-Lightning Chip Placement Solution on Display at NEPCON

At Nepcon 2006 Universal Instruments will be displaying the AdVantis Lightning, a high speed modular system featuring Universal's acclaimed Lightning head. The AdVantis Lightning Platform combines the throughput of Universal's revolutionary rotary Lightning head with the flexibility and value driven performance of the acclaimed AdVantis platform. With its ability to deliver high utilization for...

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Wilmington Machinery Working With Industry Experts to Improve the Surface Finish of Structural Foamed Parts

Wilmington, NORTH CAROLINA ---Wilmington Machinery, a recognized leader in specialty process and non-conventional injection molding systems, is currently working with other industry experts to improve the surface finish of structural foamed parts. Structural foam serves many industries with a variety of parts including: recreational products, yard sheds, electrical junction boxes, utility boxes,...

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Load Transfer Stations offer various positioning abilities.

Load Transfer Stations are available with multiple load positioning capabilities that enable transfer of loads that need to be inset, overhung, or flush with edge of go-to pallet. Addition provides inset or overhang up to 1.5 in., enabling users to keep loads centered during pallet exchange. Offered on any stand-alone or fully integrated pallet exchange system, capabilities help optimize lift...

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Deduster detaches dust particles from tablets and capsules.

Helping pharmaceutical packagers meet FDA cleaning requirements, vito Deduster features cleaning chamber based on helicoidally shaped brush with conductive hairs and core. Vertical movement and gentle brush scuffing action liberate attached dust particles from product. Electrically charged ion airflow neutralizes dust particles, preventing them from sticking to other products. Deduster discharges...

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Chip Placement System offers rates up to 57,000 cph.

Combining 2 placement heads on platform machine, Genesis-Lightning chip placement system places devices such as CSP, WSP, uBGA, and Melfs. Lightning heads address components from 01005s to 30 x 30 mm. Other features include large board capability, dual lane manufacturing functionality, and proprietary dual linear drive positioning.

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