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Designed for 0.26–0.70 in. diameter workpieces, SVL-2115 Multi-Stage Automated Lapping Machine provides single setup processing of hydraulic valves, sleeves, fuel system components, and other parts that are prone to distortion when honed. System accommodates workpiece lengths up to 12 times bore diameter, not to exceed 7.87 in. Spindle speed range is 100–2,000 rpm during lapping, but is... Read More
Engis Corporation, a leading provider of superabrasive finishing systems and high precision micron diamond and CBN powders, will showcase its grinding, honing, lapping and polishing products. WHEELING, Ill. - Engis Corporation will showcase its new ElectroMill(TM) diamond and cubic boron nitride (CBN) electroplated wheels for indexable milling applications at SOUTH-TECÂ® (booth #329), October... Read More
Equipped with 2,100 mm OD lapping wheel, AC-2100L microLineÂ® can process up to twenty 300 mm prime silicon wafers in one batch with sub-micron precision. It can also process up to eight 450 mm wafers. Along with independently driven inner and outer pin rings, features include automatic force calibration, in-situ wafer thickness metrology, and contactless gauges. Latter controls lapping wheel... Read More
FastLap lapping and polishing machines are available with optional FastLap Facing Device, which increases plate flatness to improve manufacturing precision and repeatability. Computer-controlled diamond tool bit reconditions lapping plates by removing top (worn) layer and machining it flat to within microns for optimal topography. Predictable and repeatable plate conditioning process maximizes... Read More
Designed to smooth die and mold surface finishes, polymer lapping product line consists of 8 tools and 2 abrasive compounds. Eight polymer tools are made in varying shapes and sizes and are used on air grinding tools, and abrasive compounds are available in 400 and 600 grits and must be used in conjunction with polymer tools. Technology aids efficiency of hand-applied micro-finishing process. Read More
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