Gudeng EUV Lithography Pods Made with Victrex® PEEK-ESD(TM) Offer Reduced Levels of Contamination and Increased Wafer Production Efficiency
WEST CONSHOHOCKEN, PA USA - Taiwan's Gudeng Precision Industrial Co., LTD, the world's leading photomask total solution provider, has selected VICTREX-® PEEK-ESD(TM) 101 as the key material to make its first commercialized Extreme Ultraviolet (EUV) Lithography Pod available to the market. With the comprehensive material properties of VICTREX PEEK-ESD 101, Gudeng's EUV lithography pods present...
Read More »Gudeng EUV Lithography Pods Made with Victrex-® PEEK-ESD(TM) Offer Reduced Levels of Contamination and Increased Wafer Production Efficiency
WEST CONSHOHOCKEN, PA USA - Taiwan's Gudeng Precision Industrial Co., LTD, the world's leading photomask total solution provider, has selected VICTREXÃ-® PEEK-ESD(TM) 101 as the key material to make its first commercialized Extreme Ultraviolet (EUV) Lithography Pod available to the market. With the comprehensive material properties of VICTREX PEEK-ESD 101, Gudeng's EUV lithography pods...
Read More »Asahi Kasei Orders IQ Aligner UV-NIL System from EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics
System to Include EVG's Monolithic Lens Molding (MLM) Technology to Support Production of More Compact, Higher-quality Lens Stacks CHIBA CITY, Japan - SEMICON JAPAN - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi...
Read More »Asahi Kasei Orders IQ Aligner UV-NIL System from EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics
System to Include EVG's Monolithic Lens Molding (MLM) Technology to Support Production of More Compact, Higher-quality Lens Stacks CHIBA CITY, Japan - SEMICON JAPAN - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi...
Read More »Adhesive Tapes for Biopharma Applications
Download our free eBook to learn the various applications NADCO tapes used within the healthcare sector, the many benefits they provide, and how to select the right type.
Read More »Back-End Semiconductor Lithography Tool meets 3D packaging needs.
Accommodating Through Silicon Via (TSV) and Bump process requirements, FPA-5510iV is equipped with adjustable Numerical Aperture for patterning features sized from 1-50 microns as well as small, deep, vertical holes in thick resist. Projection lens optics, variable from 0.10-0.18, expose 52 x 34 mm area, and illumination optics utilize 4.5 kW, high-intensity, Mercury lamp as light source. Tool...
Read More »Back-End Semiconductor Lithography Tool meets 3D packaging needs.
Accommodating Through Silicon Via (TSV) and Bump process requirements, FPA-5510iV is equipped with adjustable Numerical Aperture for patterning features sized from 1-50 microns as well as small, deep, vertical holes in thick resist. Projection lens optics, variable from 0.10-0.18, expose 52 x 34 mm area, and illumination optics utilize 4.5 kW, high-intensity, Mercury lamp as light source. Tool...
Read More »Best of West Finalist, MonolithIC 3D, Inc., Announces Multiple 3D IC Technologies at SemiconWest
SAN JOSE, Calif. - MonolithIC 3D, Inc., the innovator of practical monolithic 3D IC technology, has unveiled multiple 3D IC technologies that now cover most mainstream semiconductor device types. Besides logic structures, these monolithic 3D technologies include DRAM, NAND Flash and RRAM memory types, FPGA and gate arrays, as well as methods of fabricating image sensors and micro-displays. With...
Read More »Best of West Finalist, MonolithIC 3D, Inc., Announces Multiple 3D IC Technologies at SemiconWest
SAN JOSE, Calif. - MonolithIC 3D, Inc., the innovator of practical monolithic 3D IC technology, has unveiled multiple 3D IC technologies that now cover most mainstream semiconductor device types. Besides logic structures, these monolithic 3D technologies include DRAM, NAND Flash and RRAM memory types, FPGA and gate arrays, as well as methods of fabricating image sensors and micro-displays. With...
Read More »KBA Lands Major Contract at Print China in Dongguan
On the very first day of the Print China trade fair from 9 to 13 April in Guangdong province KBA-China announced that it had won a major contract from the Hengshun group's subsidiary Jiangsu Henghua Media in Zhenjiang, in the eastern province of Jiangsu. The contract, for two 16pp commercial web offset presses and four litho presses, is worth a double-digit million euro amount. The Hengshun...
Read More »KBA Lands Major Contract at Print China in Dongguan
On the very first day of the Print China trade fair from 9 to 13 April in Guangdong province KBA-China announced that it had won a major contract from the Hengshun group's subsidiary Jiangsu Henghua Media in Zhenjiang, in the eastern province of Jiangsu. The contract, for two 16pp commercial web offset presses and four litho presses, is worth a double-digit million euro amount. The Hengshun...
Read More »SRG Global Coatings Enhance Surface Durability, Efficiency, Design Flexibility
SRG Global's automotive coatings enhance the structural integrity of the finished part while also improving vehicle efficiency. Check out our video to learn more.
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