Lithography Equipment

Brewer Science Presents New Materials, Processes, and Equipment Innovation at SEMICON China and CSTIC

Brewer Science, the inventor of ARC-® anti-reflective coatings that have enabled the progress of advanced lithography, continues to deliver diverse technology solutions for FEOL and BEOL device fabrication which will be presented at the China Semiconductor Technology International Conference (CSTIC) and at SEMICON China, 19-21 March 2013, in Shanghai, China. Brewer Science will share...

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Owens Design Collaborates with Leading Nanoimprint Provider to Deliver Advanced, Production-Ready Lithography Tool

FREMONT, Calif. - Owens Design Inc. today announced the completion of a collaborative tool development effort with a leading innovator in the field of nanoimprint technology. The two companies worked closely together to develop and manufacture a production-ready advanced nanoimprint lithography tool that has the ability to process a variety of wafer and substrates sizes. By working with Owens...

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Molecular Imprints, Inc. (MII) Delivers Industry's First 450mm Advanced Lithography System to a Leading Semiconductor Manufacturer in Support of the Global 450mm Initiative

Molecular Imprints, Inc. (MII) Delivers Industry's First 450mm Advanced Lithography System to a Leading Semiconductor Manufacturer in Support of the Global 450mm Initiative

MII's J-FIL(TM) Technology Accelerating the Semiconductor Industry's Adoption to 450mm Manufacturing by 2 Years AUSTIN, Texas- Molecular Imprints, Inc., a technology leader in advanced semiconductor lithography, today announced the delivery of the first advanced lithography platform capable of patterning 450mm silicon wafer substrates. The Imprio(-®) 450, was accepted by a leading semiconductor...

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Complete Lithography System meets advanced packaging needs.

Accommodating needs of semiconductor advanced packaging market, JetStep™ total lithography system- delivers full, closed-loop control. Components include JetStep 2X reduction stepper integrated with Rudolph equipment automation and fault detection software; NSX-® inspection tool for CD overlay measurements; ProcessWORKS-® APC run-to-run control system software; ARTIST-® fault detection and...

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Danish Packaging Group Takes Drupa Press

Danish packaging group takes Drupa press The Rapida 145, the litho press with the largest sheet format at Drupa, will ship to Schur Pack Denmark in Horsens after the show. The plinth-mounted six-colour press with SFC coater (sleeves and simultaneous coating-forme change), pile logistics and a raft of automation modules has redefined the global benchmarks in sheetfed technology and will...

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Gudeng EUV Lithography Pods Made with Victrex® PEEK-ESD(TM) Offer Reduced Levels of Contamination and Increased Wafer Production Efficiency

Gudeng EUV Lithography Pods Made with Victrex® PEEK-ESD(TM) Offer Reduced Levels of Contamination and Increased Wafer Production Efficiency

WEST CONSHOHOCKEN, PA USA - Taiwan's Gudeng Precision Industrial Co., LTD, the world's leading photomask total solution provider, has selected VICTREX-® PEEK-ESD(TM) 101 as the key material to make its first commercialized Extreme Ultraviolet (EUV) Lithography Pod available to the market. With the comprehensive material properties of VICTREX PEEK-ESD 101, Gudeng's EUV lithography pods present...

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Asahi Kasei Orders IQ Aligner UV-NIL System from EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics

System to Include EVG's Monolithic Lens Molding (MLM) Technology to Support Production of More Compact, Higher-quality Lens Stacks CHIBA CITY, Japan - SEMICON JAPAN - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi...

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Back-End Semiconductor Lithography Tool meets 3D packaging needs.

Accommodating Through Silicon Via (TSV) and Bump process requirements, FPA-5510iV is equipped with adjustable Numerical Aperture for patterning features sized from 1-50 microns as well as small, deep, vertical holes in thick resist. Projection lens optics, variable from 0.10-0.18, expose 52 x 34 mm area, and illumination optics utilize 4.5 kW, high-intensity, Mercury lamp as light source. Tool...

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Best of West Finalist, MonolithIC 3D, Inc., Announces Multiple 3D IC Technologies at SemiconWest

SAN JOSE, Calif. - MonolithIC 3D, Inc., the innovator of practical monolithic 3D IC technology, has unveiled multiple 3D IC technologies that now cover most mainstream semiconductor device types. Besides logic structures, these monolithic 3D technologies include DRAM, NAND Flash and RRAM memory types, FPGA and gate arrays, as well as methods of fabricating image sensors and micro-displays. With...

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KBA Lands Major Contract at Print China in Dongguan

On the very first day of the Print China trade fair from 9 to 13 April in Guangdong province KBA-China announced that it had won a major contract from the Hengshun group's subsidiary Jiangsu Henghua Media in Zhenjiang, in the eastern province of Jiangsu. The contract, for two 16pp commercial web offset presses and four litho presses, is worth a double-digit million euro amount. The Hengshun...

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