Heidelberg Instruments Provides Lithography Platform for Wafer Level Packaging
Heidelberg, Germany – Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from a leading Asian based semiconductor packaging group. System will be used in production of advanced semiconductor and wafer level packaging devices used in the production of consumer products such as...
Read More »Heidelberg Instruments Supplies Lithography Platform for Touchscreen Photomask Production
Heidelberg, Germany – Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from a large Asian based photomask production group. System will be used in production of advanced photomasks used in the fabrication of touch panel screens.- - Growth in the touchscreen market will be driven...
Read More »SUSS MicroTec Honored with Amkor Technology's 2013 Best of Class Equipment Award
Garching — SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, was honored with the 2013 Best of Class Equipment Award from Amkor Technology on October 18, 2013. Every year the most successful suppliers of Amkor receive this award. SUSS MicroTec was especially honored for its lithography equipment and process solutions for the...
Read More »EV Group Introduces Roll-To-Roll Nanoimprint Lithography System for Biomedical, Optical, and Flexible Electronics Applications
EVG-®570R2R developed with A*STAR IMRE's Industrial Consortium on Nanoimprint (ICON) DRESDEN, Germany – PLASTIC ELECTRONICS – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG-® 570R2R--the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool.- Jointly developed...
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Key Considerations for Medical PCB Assembly
This white paper provides an overview of key considerations for medical PCB assembly.
Read More »Molecular Imprints J-FIL Technology Has Now Demonstrated the Ability to Produce High Performance Wire Grid Polarizers for Use in Flat Panel Displays
- Large area wire grid polarizers with feature sizes of 50nm and below will increase the resolution, reduce the power consumption and lower the cost of a flat panel display AUSTIN, Texas – Molecular Imprints Inc. (MII), the market and technology leader for nanopatterning systems and solutions, today announced it has developed a roll-based Jet and Flash-® Imprint Lithography (J-FIL-®)...
Read More »Ultratech Secures Repeat AP Order Win with OSAT Customer
Major OSAT Orders Ultratech AP300W for High-volume Advanced Packaging Applications SAN JOSE, Calif. -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs) announced that it has received a repeat order from a leading outsourced semiconductor assembly and test (OSAT) company in...
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Panel Lithography System supports advanced packaging.
Capable of processing both glass and organic laminate panels in semiconductor advanced packaging market, JetStep™ features on-the-fly autofocus for thick photoresists, onboard reticle library,- and 6 second reticle change out wheel. System can utilize company's suite of software products, including ProcessWORKS-® for run-to-run control, Discover-® for yield management, and ARTIST-® for...
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Resist Processing System supports micro- and nano-electronics.
Featuring robot with dual arms for accelerated wafer swapping, EVG-®120 Automated Resist Processing System- supports coating and developing applications for- MEMS- systems, advanced packaging, and compound semiconductors. Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Accommodating wafers up to 200 mm in...
Read More »Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
• Validates commercialization of revolutionary 2X stepper total lithography solution • Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process Flanders, New Jersey- – Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and...
Read More »Molecular Imprints Ships Its Next Generation Imprint Module System Targeted for Use in Semiconductor Memory Production
Molecular Imprints will ship three of its next generation imprint systems this quarter.- Two of these systems are expected to be delivered to a leading semiconductor IDM. AUSTIN, Texas– Molecular Imprints, Inc. (MII), a technology leader in advanced semiconductor lithography and the market and technology leader for nanopatterning systems and solutions, today announced the shipment of the...
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Dies & Stamping Services with Over 25 Years of Experience
PDS is an established leader in progressive die stamping, with a reputation for providing precision and value that dates back more than half a century. Through extensive capabilities and a staff of seasoned professionals, we set the standard for quality, delivering flexible services that can meet the needs of the most challenging requirements. See our video to learn more.
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