Ultratech Receives Large Multiple System Order for Fan-Out Wafer-Level Packaging Application
Ultratech's AP300 Lithography Systems Chosen for Next Generation High-Volume, Fan-Out Wafer-Level Packaging Application SAN JOSE, Calif.,- – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser--processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced...Read More »
Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New Jersey- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep-® W2300 Advanced Packaging Lithography System for the development of next-generation...Read More »
Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep-® Advanced Packaging Lithography System and multiple NSX-® Inspection Systems for use in their planned capacity...Read More »
Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications
Tool to be used for development of copper pillar bumping and TSV processes Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep-® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through...Read More »
Guide To Swageless Fittings
Electroline specializes in innovative, easy-to-install swageless fittings. The following guide will highlight everything you need to know about swageless fittings.Read More »
Media Alert: Cadence to Showcase Computational Lithography and Design for Manufacturing Solutions at SPIE 2015
SAN JOSE, Calif. - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it plans to exhibit its latest Design for Manufacturing (DFM) Physical Signoff and Computational Lithography technologies at this year's SPIE Advanced Lithography Exhibition at booth 227 from February 22 to 26, 2015, in San Jose, CA. To register for the conference, visit http://www.cadence.com/news/spie. WHAT: The...Read More »
Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
Overall market growth drives semiconductor processing ramp and increased demand for Rudolph’s JetStep Advanced Packaging Lithography System. Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has shipped the JetStep-® Advanced Packaging Lithography System to a leading outsourced assembly and test (OSAT) facility. This new customer will use the JetStep W...Read More »
Nanoimprint Lithography Process aids photonic device production.
Available on NIL platforms, including mask aligners as well as EVG-®720 and EVG7200 UV-NIL systems, SmartNIL™ large-area nanoimprint lithography (NIL) process provides large-area, high-volume-manufacturing solution for photonic-based devices. Room-temperature process offers full-field imprint area up to 200 mm and full-substrate UV-NIL solution for high-volume-manufacturing applications at >40...Read More »
Photoresist Processing System suits high volume manufacturing.
Intended for high-volume logic and memory manufacturing, 300 mm EVG-®150XT features 9 process modules that can operate simultaneously for multi-parallel wafer processing. System incorporates smart scheduling software for throughput-optimized handling sequences, along with pumps and dispense systems tailored for thick film applications. With in-line metrology module, variety of process...Read More »
Rudolph Technologies Wins Multiple Lithography Orders
Systems sold into advanced packaging and flat panel display markets Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today it has received two orders for its lithography systems, totaling more than $11 million. Purchase orders include a repeat order for the JetStep™ Lithography System for advanced packaging (AP) applications and a repeat order for a PanelPrinter™...Read More »
Lithography System offers soft template replication.
Providing full-field imprint lithography with integrated soft stamp/template fabrication capability, EVG-®720 Automated UV Nanoimprint Lithography System enables throughputs of more than 60 wafers/hr. System can print nanostructures as small as 40 nm in diameter over large area in volume production. Designed to work with wide variety of resist materials, EVG720 is suited for manufacturing...Read More »
Innovative Dampney Coating Systems Suit Even the Most Specialized Applications
Dampney's high performance coating systems provide protection against extreme weather, chemicals, and corrosive environments for atmospheric, immersion, and underground applications. Check out the video to learn more.Read More »