Lithography Equipment

New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates
Lithography Equipment

New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates

Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.

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New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates
Lithography Equipment

New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates

Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.

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Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Lithography Equipment

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...

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Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Lithography Equipment

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...

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New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Lithography Equipment

New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats

Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.

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New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Lithography Equipment

New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats

Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.

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Vector® Sports Training Ball Offers Visible Point of Contact
Sponsored

Vector® Sports Training Ball Offers Visible Point of Contact

Our goal is to help every athlete derive maximum enjoyment from their sport and become a better player. We offer a line of innovative training tools that combine cutting-edge technology and out of the box thinking to deliver an unbeatable competitive advantage. The Vector® Sports Training Ball is just another example of our commitment to innovation. To learn how the Vector® is helping ballplayers everywhere, see our video.

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