New i-line Stepper System for High-density Packaging
FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.
Read More »
New i-line Stepper System for High-density Packaging
FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.
Read More »
New Semiconductor Lithography System with Optional Through-Silicon Alignment System
FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.
Read More »
New Semiconductor Lithography System with Optional Through-Silicon Alignment System
FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.
Read More »
Metal Stamping and Forming for Your Automotive Applications
Check out this white paper to learn about the advantages of metal stamping over other forming techniques for automotive parts.
Read More »
New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates
Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.
Read More »
New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates
Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.
Read More »
Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...
Read More »
Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...
Read More »
New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.
Read More »
New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.
Read More »
Vector® Sports Training Ball Offers Visible Point of Contact
Our goal is to help every athlete derive maximum enjoyment from their sport and become a better player. We offer a line of innovative training tools that combine cutting-edge technology and out of the box thinking to deliver an unbeatable competitive advantage. The Vector® Sports Training Ball is just another example of our commitment to innovation. To learn how the Vector® is helping ballplayers everywhere, see our video.
Read More »
