New i-line Stepper System for High-density Packaging
FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.
Read More »New i-line Stepper System for High-density Packaging
FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.
Read More »New Semiconductor Lithography System with Optional Through-Silicon Alignment System
FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.
Read More »New Semiconductor Lithography System with Optional Through-Silicon Alignment System
FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.
Read More »The Ultimate Guide To UV Disinfection Lighting
This white paper provides a guide to UV disinfection lighting and their benefits over alternative disinfection methods.
Read More »New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates
Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.
Read More »New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates
Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.
Read More »Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...
Read More »Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...
Read More »New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.
Read More »New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.
Read More »Oilfield Improvements® Wheeled Rod Guide® Couplings Celebrate 35th Anniversary
For over 35 years our Wheeled Rod Guide Couplings, have been at work in oil fields across the globe. Our products are engineered to extend the service life of sucker rods and tubing, delivering cutting-edge innovation that enhances oilfield operation, maximizes output, and enhancing overall operations. To learn about the advantages of using Wheeled Rod Guide Couplings in your wells, see our video.
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