New i-line Stepper System for High-density Packaging
FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.
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New Semiconductor Lithography System with Optional Through-Silicon Alignment System
FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.
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New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates
Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.
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Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...
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7 Steps to Optimize Your Spring Design for Your Next Project
This white paper provides an in-depth overview into how to optimize a compression spring design in seven steps.
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New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.
Read More »Ultratech Receives Multiple System, Follow-On Order for Fan-Out Wafer-Level Packaging Applications
Ultratech's AP300 Lithography Systems will be used for Next-generation, High-volume, Fan-out Wafer-level Packaging Applications SAN JOSE, Calif., June 28, 2016 - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser- processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems,...
Read More »Ultratech Receives Multiple System Order to Support Major Asian OSAT Expansion
Ultratech's AP300 Lithography Platform Chosen for Next-Generation Advanced Packaging Applications SAN JOSE, Calif.,- – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser--processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received a...
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Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep-® Lithography System for the semiconductor advanced packaging industry’s first panel manufacturing line....
Read More »Ultratech and Qoniac Jointly Develop 3D Lithography APC Solution
3D Distortion Inspection and Lithography APC Leaders to Deliver Second Generation 3D Distortion Lithography APC SAN JOSE, Calif. - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB- -LEDs), as well as atomic layer deposition (ALD) systems, and Qoniac GmbH of Dresden,...
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Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph
Lithography stepper gains further traction in advanced packaging and flat panel markets Flanders, New Jersey- - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStep-® W Series Lithography system, which it will use for both fan-out and fan-in packaging approaches. Additionally, Rudolph received...
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High or Low Volume Custom Crates and Boxes Available from Reid Packaging
Reid provides mil-spec crates and corrugated boxes in custom dimensions from single to triple wall and will even package them on-site. Check out the video to learn more.
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