New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates
Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.
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Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...
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New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.
Read More »Ultratech Receives Multiple System, Follow-On Order for Fan-Out Wafer-Level Packaging Applications
Ultratech's AP300 Lithography Systems will be used for Next-generation, High-volume, Fan-out Wafer-level Packaging Applications SAN JOSE, Calif., June 28, 2016 - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laserÂ- processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD)...
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The Ultimate Guide to PCB Hardware
Our eBook provides information on the different types of PCB hardware, materials, and applications that you might need to consider when selecting PCB hardware for your project.
Read More »Ultratech Receives Multiple System Order to Support Major Asian OSAT Expansion
Ultratech's AP300 Lithography Platform Chosen for Next-Generation Advanced Packaging Applications SAN JOSE, Calif.,Â- – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laserÂÂ-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it...
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Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel...
Read More »Ultratech and Qoniac Jointly Develop 3D Lithography APC Solution
3D Distortion Inspection and Lithography APC Leaders to Deliver Second Generation 3D Distortion Lithography APC SAN JOSE, Calif. - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBÂ- -LEDs), as well as atomic layer deposition (ALD) systems, and Qoniac GmbH of...
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Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph
Lithography stepper gains further traction in advanced packaging and flat panel markets Flanders, New JerseyÂ- - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStep® W Series Lithography system, which it will use for both fan-out and fan-in packaging approaches. Additionally, Rudolph...
Read More »Ultratech Receives Large Multiple System Order for Fan-Out Wafer-Level Packaging Application
Ultratech's AP300 Lithography Systems Chosen for Next Generation High-Volume, Fan-Out Wafer-Level Packaging Application SAN JOSE, Calif.,Â- – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laserÂÂ-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems,...
Read More »Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New JerseyÂ- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep® W2300 Advanced Packaging Lithography System for the development of...
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Solve Any Large-scale Water Control Problem with the Aqua Dam Flood Barrier
Aqua Dam is the ultimate solution for large-scale water control projects. It combines lightweight, large size, and portability all in one innovative product. To learn more about the uses, and applications of Aqua Dam, or to see it in action, check out our new video to get all the details.
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