Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...
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New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.
Read More »Ultratech Receives Multiple System, Follow-On Order for Fan-Out Wafer-Level Packaging Applications
Ultratech's AP300 Lithography Systems will be used for Next-generation, High-volume, Fan-out Wafer-level Packaging Applications SAN JOSE, Calif., June 28, 2016 - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laserÂ- processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD)...
Read More »Ultratech Receives Multiple System Order to Support Major Asian OSAT Expansion
Ultratech's AP300 Lithography Platform Chosen for Next-Generation Advanced Packaging Applications SAN JOSE, Calif.,Â- – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laserÂÂ-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it...
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Accelerating Composites Production with Dielectric Cure Monitoring
This white paper provides an in-depth explanation of how dielectric monitoring works, and why it's the best choice for any company working with advanced composite materials.
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Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel...
Read More »Ultratech and Qoniac Jointly Develop 3D Lithography APC Solution
3D Distortion Inspection and Lithography APC Leaders to Deliver Second Generation 3D Distortion Lithography APC SAN JOSE, Calif. - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBÂ- -LEDs), as well as atomic layer deposition (ALD) systems, and Qoniac GmbH of...
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Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph
Lithography stepper gains further traction in advanced packaging and flat panel markets Flanders, New JerseyÂ- - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStep® W Series Lithography system, which it will use for both fan-out and fan-in packaging approaches. Additionally, Rudolph...
Read More »Ultratech Receives Large Multiple System Order for Fan-Out Wafer-Level Packaging Application
Ultratech's AP300 Lithography Systems Chosen for Next Generation High-Volume, Fan-Out Wafer-Level Packaging Application SAN JOSE, Calif.,Â- – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laserÂÂ-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems,...
Read More »Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New JerseyÂ- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep® W2300 Advanced Packaging Lithography System for the development of...
Read More »Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their...
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Precision Fabricating with Over 40 Years of Experience
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