Indium

Indium Corporation Features InFORMS® at PCIM
Indium

Indium Corporation Features InFORMS® at PCIM

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at PCIM Europe, May 19-21 in Nuremberg, Germany. InFORMS are patented fabrications in which braided, woven, or random-fiber metal substrate materials are embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate. InFORMS create solder joints...

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Indium Corporation Features High-Purity Indium at SVC
Indium

Indium Corporation Features High-Purity Indium at SVC

Indium Corporation will feature its high-purity indium at the Society of Vacuum Coaters 58th Annual Technical Conference (SVC TechCon) April 25-30 in Santa Clara, Calif. High-purity indium is refined using advanced processes that are controlled with rigorous quality standards. Purity is verified using advanced analytical instrumentation such as inductively coupled plasma (ICP) and glow discharge...

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Indium Corporation Features Indium, Gallium, and Germanium Materials at SVC Technical Conference
Indium

Indium Corporation Features Indium, Gallium, and Germanium Materials at SVC Technical Conference

Indium Corporation will feature their indium, gallium and germanium metals and compounds at the SVC Technical Conference May 6-7 in Chicago, IL. Indium Corporation supplies high-purity indium, gallium, and germanium metal. These metals are used in the production of alkaline dry cell batteries, flat-panel liquid crystal displays (LCDs), optical fibers, photovoltaic devices, III-V compound...

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Simple Connection MGB with EtherNet/IP

The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.

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