Heat Sinks

Heat Sinks

ATS- Digi-Key Partnership Provides Full-Range of BGA Cooling Solutions

Norwood, MA, July 17, 2007 - Advanced Thermal Solutions, Inc. (ATS) has partnered with Digi-Key, the global electronic components distributor, to offer over 380 heat sinks for cooling BGAs and other hot-running semiconductor devices. The heat sinks are available for immediate delivery when purchased through Digi-Key's Web site and printed catalogs. Design engineers can obtain individual ATS sinks...

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Heat Sinks cool 17 x 17 mm BGA packages.
Heat Sinks

Heat Sinks cool 17 x 17 mm BGA packages.

Made from black anodized, extruded aluminum, Models ATS-590 and ATS-619 RoHS compliant heat sinks maintain component case temperature at or below manufacturer's thermal specifications. Model ATS-590 measures 9.5 x 25 x 25 mm, has thermal resistance of 8.42°C/W at its base in air velocity of 200 ft/min. Measuring 22 x 24 x 16.25 mm, ATS-619 has thermal resistance of 6.11°C/W, and...

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Heat Sinks

Novel Concepts, Inc.'s Patented Thermal Superconductor Could Render Computer Fans Obsolete

LAS VEGAS, Feb. 21 -- For over a decade, Novel Concepts, Inc. (http://www.novelconceptsinc.com/) has been on the forefront of thermal management technology, with multiple patents under its belt. Today the company is again breaking ground: Novel Concepts, Inc. has announced IsoSkin(TM), a patented, thin planar thermal superconducting heat spreader with heat transfer performance 20 times greater...

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Heat Sinks

Heat Sinks help cool linear LED lighting products.

Fabricated from extruded aluminum, models ATS-486, ATS-503, and ATS-504 mitigate intensity of heat generated by high-output LEDs and ensure maintenance-free service life. These maxiFLOW(TM) heat sinks feature low-profile, spread fin array that maximizes surface area for effective convection cooling, particularly when air flow is limited. Available un-anodized or black anodized, with thermal tape...

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Heat Sink cools communications processors.
Heat Sinks

Heat Sink cools communications processors.

Designed for Freescale Semiconductor's MPC8349E PowerQUICC II Pro processors, Model ATS-552 helps ensure that junction temperatures do not exceed maximum specified value. Unit's thermal resistance is 2.7°C/W at its base in air velocity of 200 fpm. Made from black anodized aluminum, heat sink features 14 integral linear fins, 0.5 mm thick, to maximize cooling surfaces in local airflow. Unit...

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Heat Sinks

ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing

NORWOOD, Mass, October 31, 2006 - Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that maxiGRIP(TM), the company's patent-pending heat sink attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components, has passed Mil-STD-810 Shock Testing and Unpackaged Drop Testing. Shock and...

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Heat Sinks cool Freescale MPC8641D dual-core processors.
Heat Sinks

Heat Sinks cool Freescale MPC8641D dual-core processors.

Featuring integral fan that blows air through linear field of flat aluminum fins, Juneau ATS-405 Active Heat Sink delivers thermal resistance of 0.51°C/W with thermal grease. Developed to cool Freescale processors in restricted height enclosures, Anchorage ATS-474 Passive Heat Sink features maxiFLOW(TM) angled fin technology with thermal resistance of 1.05°C/W in air velocity of 100...

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Heat Sinks

Diamond Heat Spreaders provide high thermal conductivity.

Available as bare, freestanding diamond segments or in metallized form, DiaTherm(TM) Heat Spreaders are laser cut from sheets of pure diamond formed by chemical vapor deposition in dc torch reactors. They are 100% polycrystalline diamond with density of 3.5 g/cubic-cm and thermal conductivity up to 1,400 W/m-k. Spreaders are suitable mounting structures for laser diodes, laser diode arrays, LEDs...

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Heat Sinks

Heat Sinks cool condensed electronic packages.

Fabricated from lightweight extruded aluminum, maxiFLOW(TM) heat sinks are utilized for cooling BGAs and hot components inside electronic systems. Featuring low profile spread fin arrays to enable convectional air cooling within restricted/low air flow conditions, they are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at 2 mm.

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