Heat Sinks

Heat Sinks suit high power density applications.
Heat Sinks

Heat Sinks suit high power density applications.

Measuring 2.2 in. across x 1.71 in. tall, MV/MA 302 Series uses 2 internal spring clips for mounting up to four TO-247 or TO-264 devices, eliminating need for mounting holes and screws. Units are constructed of aluminum alloy 6063-T5 or equivalent with either degreased or black anodized finish. Four models are available with thermal resistance of 6.0, 5.2, 3.6, and 3.0°C/W.

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Heat Sinks feature push pin mounting.
Heat Sinks

Heat Sinks feature push pin mounting.

With integral push pin mounting system, maxiFLOW(TM) heat sinks offer accelerated, safe attachment onto BGAs and other hot components. Each heat sink comes with one pair of plastic or brass push pins that run through opposite corners of heat sinks and mount securely into 3.00 mm holes in PCB as laid out in industry standard patterns. While integral spring on each pin provides ~2 lb of retention...

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Heat Sinks

GlacialTech Invites You to be a Spectator of Technology Innovation at COMPUTEX TAIPEI 2011

Taipei, Taiwan - GlacialTech Inc., a diverse provider of cooling, power supply, and PC enclosure solutions for consumer and industrial applications, is excited to showcase the latest and greatest LED drivers & GREEN battery chargers as well as LED lighting solutions for outdoor/indoor/industrial applications at COMPUTEX 2011. At this year's COMPUTEX, GlacialTech will reveal a full range of...

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Heat Sinks

Air-Cooled Heat Sink has credit card-sized design.

Developed to fit inside notebooks, monitors, and tablets, ThinSink(TM) cools integrated circuits, semiconductors, LEDs, and other microelectronic heat generating devices. Using 40 mm diameter fan spinning at 6,000 rpm, heat sink consumes 0.031 W of electricity and provides thermal performance of 2.73°C/W. Thin, smooth fan surface eliminates pulsating sound and vibration caused by...

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Heat Sinks

Thermacore Awarded Contract Extension to Engineer and Commercialize Developmental and Active Heat Sink Technology for U.S. Department of Defense

Lancaster, PA, - Thermacore (www.thermacore.com), a leading provider of advanced thermal solutions, was awarded a $3 million Option Phase contract extension by the Defense Advanced Research Projects Agency (DARPA) to continue the development and commercialization of active heat sink technologies for Micro-technologies for Air-Cooled Exchangers (MACE). The original contract had been awarded in...

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Heat Sinks

Mushkin Announces 'Ridgeback' Heatsink for Redline!

Ridgeback(TM) RAM Cooling Technology Now Available in Redline Series ENGLEWOOD, Colo., -- Mushkin (www.mushkin.com), a global leader in high-performance computer products, announced today the release of 'Redline Ridgeback', a new variation on a heatsink that has become a staple in the high-performance and overclocking communities. Because of its aggressive yet sleek design and incredible heat...

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EMC Subrack Heatsinks ensure reliable operation.
Heat Sinks

EMC Subrack Heatsinks ensure reliable operation.

Adapted to suit 19 in. subracks, heatsinks promote reliable functioning of electronic subassemblies in EMC applications. Heatsinks have width of 84U and height that matches subrack. Able to be installed on rear or front of subrack, heatsink complies with EMC requirements and features electrically conductive surface coating and contact strips for connection to subrack chassis. Customer-specific...

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Reduce Heat by Adding the alphaCool(TM) from WITTENSTEIN
Heat Sinks

Reduce Heat by Adding the alphaCool(TM) from WITTENSTEIN

Fluid-cooled Adapter Plate Provides Significant Heat Reduction in Applications Servo motor / gearbox combinations are often limited by temperature. The higher the torque load and/or rpm, the higher the temperature. To improve performance, temperature must be lowered. This can be accomplished through better extraction of heat from the motor / gearbox combination. Significant heat removal is now...

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Heat Sink Screw is designed for GHz BGA socket.
Heat Sinks

Heat Sink Screw is designed for GHz BGA socket.

Able to dissipate up to 16 W with additional fan mounted on top, HS-SG-6002 is designed for 31 x 31 to 42.5 x 42.5 mm package size, and also serves as compression mechanism for GHz socket. Constructed with 7075 Aluminum and optimized using fin design, heat sink screw has thermal resistance of 0.530 C/W.

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Heat Sinks perform in low airflow velocity conditions.
Heat Sinks

Heat Sinks perform in low airflow velocity conditions.

Featuring spread fin array that maximizes surface area for effective convection cooling, maxiFLOW(TM) heat sinks cool ICs and other hot components in narrow packaging and low airflow velocity conditions. Standard heights are as low as 9.5 mm, and extruded aluminum fabrication minimizes thermal resistance from base to fins. Pre-assembled with ATS maxiGRIP(TM) mounting hardware, sinks meet...

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