TI Demonstrates 'Over-the-Air' Secure Application Downloads Over Live Wireless Networks
BARCELONA, Spain, Feb. 9 /- Building on its strategy to allow mobile operators to provide new services and improved user experience, Texas Instruments Incorporated (NYSE:TXN) (TI) is demonstrating TI's M-Shield(TM) security framework on the OMAP(TM) platform at 3GSM World Congress. TI has collaborated with Vodafone to showcase how operators can securely deploy and upgrade key applications, such...
Read More »Spreadtrum Selects Dilithium's 3G-324M Video Telephony Stack
PETALUMA, Calif.--Sept. 17, 2006--Dilithium Networks announced today that Spreadtrum, a leading wireless communication chip solution vendor with headquarters in the US and major operations in China, has licensed Dilithium's market-leading 3G-324M video telephony stack software, further consolidating their leadership in the 3G phone market. Spreadtrum develops chipset solutions for TD-SCDMA video...
Read More »Nokia Brings Advanced Developer Benefits for S60 Software
S60 3rd Edition Feature Pack 2 Supports Competitiveness in Mid-Range Market ESPOO, Finland, February 7/- Nokia today introduced a new Feature Pack for S60 on Symbian OS(TM), the market leading smartphone platform. S60 3rd Edition Feature Pack 2 is designed for innovation and significantly facilitates the creation of compelling applications and accelerates performance. S60 3rd Edition is targeted...
Read More »CEVA to Showcase Continued Leadership in Intellectual Property for Wireless Handset Applications at 3GSM World Congress 2007
Silicon-Proven Multimedia, Voice-over-IP and Audio Development Platforms Highlight CEVA's Extensive Commitment to Provide Complete One-Stop-Shop Licensable Solutions for Mobile Devices SAN JOSE, Calif., Jan. 31 /- CEVA, Inc. (NASDAQ:CEVA), a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications, will be...
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Pressure Vessels & Their Components
This white paper provides an in-depth look into custom fabricated pressure vessels and their components.
Read More »Uncompromised Beauty and Speed Combine with Rich Multimedia Experience in MOTOKRZR(TM) K3
Goodbye compromise, Hello style and high performance; Motorola delivers stylish entertainment experience on MOTOKRZR K3* BARCELONA, Spain, Feb. 12 // -- 3GSM World Congress 2007 -- Motorola, Inc. (NYSE: MOT), a global leader in wireless communications, today announced the stylish, high performance, high-speed MOTOKRZR K3 handset. Incorporating a 'no compromises' use of colour, materials and...
Read More »Goodbye Complexity, Goodbye Wires, Goodbye Boredom - HELLOMOTO(TM)
Design and innovation unite Motorola's announcements at 3GSM World Congress; showcasing compelling mobile experiences BARCELONA, Spain, Feb. 12 // -- 3GSM World Congress 2007 -- Motorola, Inc. (NYSE: MOT), a global leader in wireless communications, today delivered compelling mobile experiences with a portfolio of devices and solutions that demonstrate the company's leadership in design, music,...
Read More »MOTO Q Goes Global
Goodbye Office, Hello Liberated Lifestyle; Motorola delivers new super-slim, experience-optimized QWERTYs for HSDPA and GSM networks BARCELONA, Spain, Feb 12, 2007 // -- 3GSM World Congress 2007 -- Motorola today announced the expansion of its award-winning Q platform with the availability of MOTO Q q9 and MOTO Q gsm. Delivering power, style and ease-of-use, MOTO Q q9 and MOTO Q gsm continue to...
Read More »Motorola Renews Relationship with Freescale for Next-Generation 2G and 3G Chipset Platforms
LIBERTYVILLE, Ill. and AUSTIN, Texas, Feb. 8 // -- Motorola, Inc. (NYSE: MOT), a global leader in mobile communications and seamless mobility solutions, has reaffirmed its strategic relationship with Freescale Semiconductor by selecting the Austin-based company as a preferred supplier of 2G and 3G chipset platforms through 2009. Freescale is an important supplier of chipset solutions for several...
Read More »Spansion Announces 65nm MirrorBit® ORNAND Flash Memory Solutions for Wireless Handsets
SUNNYVALE, Calif., Jan. 18 -- Spansion Inc. (NASDAQ:SPSN), the world's largest pure-play provider of Flash memory solutions, today announced it is sampling 65 nanometer (nm) MirrorBit® ORNAND(TM) solutions, optimized for data storage in high-end, multimedia wireless handsets. Manufactured at Spansion's flagship Fab 25 facility in Austin, Texas, Spansion® 65nm MirrorBit technology is the...
Read More »Xilinx Showcases Handset Demonstration Platform with TI OMAP Processor Compatibility
Leading Converged, High-end Handset Processor Now Supported on Industry's First Programmable Handset Demonstration Platform LAS VEGAS, Jan. 8 /- At the Consumer Electronics Show (CES) today, Xilinx, Inc. (NASDAQ:XLNX), the world's leading programmable logic supplier, demonstrated its latest CoolRunner(TM)-II CPLD enabled handset demonstration platform with TI OMAP compatibility. The TI OMAP...
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Triad's Next-Gen Power Supplies Offer Increased Reliability and Reduced Noise Performance
Triad Magnetics, an established leader in power supply design and manufacturing, is proud to announce their next generation WAU AC and WDU DC Series of power supplies. These linear wall plug-ins offer minimum noise performance without sacrificing reliability or life. See our video to learn more.
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