Flaw Sensors / Detectors

Flaw Sensors / Detectors

JPSA to Collaborate with University of Delaware, and MIT for SunShot Initiative

Manchester, New Hampshire, USA - J. P. Sercel Associates (JPSA) announces they are partnering with SunShot Initiative F-PACE awardee University of Delaware (UD), along with Massachusetts Institute of Technology (MIT). The F-PACE award is sponsored by the Department of Energy's (DOE) SunShot Initiative program, with a goal of lowering the cost of crystalline silicon solar cells to $0.50/Wp module...

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Flaw Sensors / Detectors

Wafer Defect Review System is designed for 20 nm node.

Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation...

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Wafer Inspection System incorporates deep UV illumination.
Flaw Sensors / Detectors

Wafer Inspection System incorporates deep UV illumination.

Leveraging DUV wavelength, special apertures, and multiple illumination and collection channels, Surfscan SP3 addresses stringent 28 nm node requirements for defect detection and classification on blanket films at production speeds. System helps manufacture substrates for 28 nm devices and below that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids, or...

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NVision Now Offering Product Defect Analysis
Flaw Sensors / Detectors

NVision Now Offering Product Defect Analysis

NVision, Inc.'s Engineering Service Division is now offering product defect analysis, which can potentially be introduced in product liability litigation to prove a manufacturer innocent of producing a defective or harmful product. The company has partnered with Materials Analysis, a Dallas-based engineering firm specializing in litigation support, to provide this service. Each year, thousands of...

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Automated Macro Defect Inspection System suits TSV processes.
Flaw Sensors / Detectors

Automated Macro Defect Inspection System suits TSV processes.

Designed for packaging processes that use through silicon vias (TSV) to connect multiple die in one package, NSX® 320 provides inspection capabilities for edge trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames, and other processes. Incorporated XSoft(TM) system software capabilities include high-speed staging and on-the-fly image capture as well as...

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Flaw Sensors / Detectors

Defect Analysis System is suited for PV cell manufacturers.

FabVision(TM) Solar utilizes ICOS® PVI-6 data through range of analysis and monitoring features, captures wafer/cell images and data from PVI-6, and allows navigation that simplifies image review. Users can review in-line data at any point, and reports are generated automatically with optical inspection measurement results from multiple inspection modules across multiple manufacturing...

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Phased Array Flaw Detector features 10.4 in. touchscreen.
Flaw Sensors / Detectors

Phased Array Flaw Detector features 10.4 in. touchscreen.

With optimized data storage capacity and transfer rate, OmniScan MX2 provides inspection capabilities for manual and automated phased array applications. Integral 10.4 in. LCD touchscreen facilitates navigation, text input, and parameter setup, while SD card and USB interfaces provide connectivity. Fully compatible with phased array modules already in field, modular instrument comes with all...

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Renishaw Wins Fourteenth Queen's Award for Laser-based Tool Recognition System
Flaw Sensors / Detectors

Renishaw Wins Fourteenth Queen's Award for Laser-based Tool Recognition System

Renishaw plc, a global engineering technologies company, is pleased to announce that it has received a Queen's Award for Enterprise 2011 in the Innovations category, the company's fourteenth Queen's Award since its formation in 1973, and its fifth in just eight years. This Award has been granted for the development of the highly innovative TRS2 laser-based non-contact broken tool detection system...

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Flaw Sensors / Detectors

Avago Technologies Selects Automated Inspection and Metrology Solution from Rudolph for Advanced Optoelectronic Devices

NSX inspection systems play key role in Avago's efforts to enhance process yields Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announces orders for its NSX® Series from Avago Technologies Manufacturing (Singapore) Pte. Ltd. Avago will use the NSX System...

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Flaw Sensors / Detectors

Rudolph Technologies Expands into LED Market

Leading HB-LED manufacturers worldwide add inspection systems and software to improve process yields and reduce manufacturing costs FLANDERS, NJ - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software that is designed to improve yield for the microelectronics and solar manufacturing industries, announced today that it has expanded into...

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Cut and Bevel Pipe up to 63" Diameter with a Single Lightweight, Portable Machine
Sponsored

Cut and Bevel Pipe up to 63" Diameter with a Single Lightweight, Portable Machine

CS Unitec is a leader in power tools designed for industrial applications, with products that set the standard for robust performance and industry-leading reliability. Adding to our long list of innovation is a new line of pipe cutting machines. For cutting and beveling pipe up to 2" in thickness and diameters from 12" to 63", no other cutting system comes close. See our video to learn more.

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