Epoxies

Epoxy Adhesive has low vapor pressure.
Epoxies

Epoxy Adhesive has low vapor pressure.

Two-part Tra-Bond 2116 thixotropic adhesive can be used in electronic and industrial applications where high-fill, non-sag adhesive is needed. It bonds well to many substrates including metals, glass, ceramics, wood, and plastics. Adhesive cures at room temperature, is electrical insulator, and is NASA outgassing approved. It resists chemicals and weather.

Read More »
Liquid Epoxy Encapsulant provides fast capillary flow.
Encapsulants

Liquid Epoxy Encapsulant provides fast capillary flow.

Hysol® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260°C reflow applications, FP4549FC heat cures in 30 minutes at 165°C, and meets JEDEC Level-3 260°C requirements. This high-purity, low-stress liquid epoxy encapsulant is designed for use in fine pitch...

Read More »
Epoxies

Epoxy features built-in cure indicator.

CHIPSHIELD 1455HD low-viscosity UV curable epoxy is designed to perform as chip coating both in smart cards and as a protective glob on PC surface-mounted chips. It is cured with long wave UV, 325-380 nm wavelength. Epoxy is light powder blue before cure, and faint rose to amber after cure, indicating cure has been completed. With Tg of 80° C and moisture resistance, chip is assured of...

Read More »
Epoxy Adhesive cures at low temperatures.
Epoxies

Epoxy Adhesive cures at low temperatures.

TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60° C. Epoxy contains no volatile solvents and features excellent temperature resistance, hardness and strength.

Read More »
Distillation 101: A Guide to Distillation and Separation Technologies
Sponsored

Distillation 101: A Guide to Distillation and Separation Technologies

Distillation is a separation unit operation that involves multiple countercurrent-stage steps, separating two or more volatile components. This results in the contact of liquid and vapor most generally in counterflow. Distillation 101: A Guide to Distillation and Separation Technologies provides an in-depth look at everything you need to know about distillation, including: Design procedures Equipment components Applications

Read More »
Epoxy provides clear lamination.
Epoxies

Epoxy provides clear lamination.

TRA-BOND 2119 low-viscosity epoxy is designed for bonding to glass, plastics and ceramics. It is a high Tg, high lap shear material with room temperature cure. Semi-rigid upon cure, it is suitable for bonding between dissimilar substrates. Applications include small potting, laminating and bonding of optics and electronics.

Read More »
Epoxies

Universal Epoxy bonds well with glass ceramic.

AngstromBond AB9320 two-part, blue epoxy, low-stress adhesive will not cause fiber core cracking or fiber pistoning. This low viscosity system can be cured in 10 minutes at 100°C, and produces a glass transition temperature of over 120°C. It bonds well to glass ceramic, metals and most plastics. Heat-cured product has 90 minute working time. Designed for terminating multimode and...

Read More »
Locon Sensors Withstand Extreme Temperatures
Sponsored

Locon Sensors Withstand Extreme Temperatures

Locon Sensor Systems offer robust sensor solutions for even the most severe environmental conditions. Their line of high-temp inductive sensors and their cylindrical photoelectric series can operate in temperatures up to 250 degrees Celsius. See our video to learn more.

Read More »

All Topics

COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

COVID-19 Response Suppliers