Epoxies

Epoxies

Epoxy Board is designed for use at temperatures to 250°F.

Ren Shape 5008 epoxy board can be machined with carbide cutters to generate molds with good edge definition, dimensional stability, and smooth surface finish. It can be used to produce intermediate-temperature models, heat-resistant thermoform tooling, and lay-up tools for composite parts. Molds may be produced for thermoforming detailed, production-quality parts from polypropylene, polystyrene,...

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Epoxy Casting Compound meets UL fire retardant specs.
Epoxies

Epoxy Casting Compound meets UL fire retardant specs.

TRA-CAST 3143 has low viscosity, long pot life, and is certified to UL 94 V-O. Epoxy system has low coefficient of thermal expansion and excellent wetting and adhesion to most electronic and aerospace-industry materials, including metals, glass products, ceramics, industrial laminates and many rigid plastics. Applications include rigid potting, laminating, transformer encapsulating, filament...

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Epoxies

Epoxy emits no VOCs.

Two component EMCAST 758 thermally conductive epoxy has moderate viscosity of 130,000 cp, glass transition temperature of 125°C, thermal conductivity of 3 W/mK, and is not electrically conductive. It is 100% solids epoxy with no solvent for zero VOCs. Epoxy is available in pre-mixed and frozen syringes or in two component kits with mix ratio of 2:1. Substrates include aluminum, stainless...

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Epoxies

Thermally Conductive Epoxy cures at room temperature.

Two component EMCAST has viscosity of 130,000 cps, specific gravity of 1.90, and glass transition temperature of 125Â-ºC. Its thermal conductivity is 3 W/mK, and it is not electrically conductive. 100% solids epoxy has no solvent for zero VOCs. Epoxy cures in 8 hours @ 25°C, 1 hour @ 65°C, and 15 minutes @ 100°C. It is available as pre-mixed and frozen syringes or in two...

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Epoxy Adhesive has low vapor pressure.
Epoxies

Epoxy Adhesive has low vapor pressure.

Two-part Tra-Bond 2116 thixotropic adhesive can be used in electronic and industrial applications where high-fill, non-sag adhesive is needed. It bonds well to many substrates including metals, glass, ceramics, wood, and plastics. Adhesive cures at room temperature, is electrical insulator, and is NASA outgassing approved. It resists chemicals and weather.

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Liquid Epoxy Encapsulant provides fast capillary flow.
Encapsulants

Liquid Epoxy Encapsulant provides fast capillary flow.

Hysol® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260°C reflow applications, FP4549FC heat cures in 30 minutes at 165°C, and meets JEDEC Level-3 260°C requirements. This high-purity, low-stress liquid epoxy encapsulant is designed for use in fine pitch...

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Epoxies

Epoxy features built-in cure indicator.

CHIPSHIELD 1455HD low-viscosity UV curable epoxy is designed to perform as chip coating both in smart cards and as a protective glob on PC surface-mounted chips. It is cured with long wave UV, 325-380 nm wavelength. Epoxy is light powder blue before cure, and faint rose to amber after cure, indicating cure has been completed. With Tg of 80° C and moisture resistance, chip is assured of...

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Epoxy Adhesive cures at low temperatures.
Epoxies

Epoxy Adhesive cures at low temperatures.

TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60° C. Epoxy contains no volatile solvents and features excellent temperature resistance, hardness and strength.

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Epoxy provides clear lamination.
Epoxies

Epoxy provides clear lamination.

TRA-BOND 2119 low-viscosity epoxy is designed for bonding to glass, plastics and ceramics. It is a high Tg, high lap shear material with room temperature cure. Semi-rigid upon cure, it is suitable for bonding between dissimilar substrates. Applications include small potting, laminating and bonding of optics and electronics.

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Epoxies

Universal Epoxy bonds well with glass ceramic.

AngstromBond AB9320 two-part, blue epoxy, low-stress adhesive will not cause fiber core cracking or fiber pistoning. This low viscosity system can be cured in 10 minutes at 100°C, and produces a glass transition temperature of over 120°C. It bonds well to glass ceramic, metals and most plastics. Heat-cured product has 90 minute working time. Designed for terminating multimode and...

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