Epoxies

Epoxy adheres to glass, polycarbonates, and acrylics.
Epoxies

Epoxy adheres to glass, polycarbonates, and acrylics.

Suited for bonding, sealing, coating, encapsulation, and casting, EP30P transparent, 2-component epoxy system cures at room temperature, which can be accelerated by use of heat. Electrically insulating, 100% reactive system contains no solvents or diluents and exhibits minimal linear shrinkage upon cure. With tensile strength that exceeds 9,500 psi, product has mixed viscosity of 1,200-1,400 cps...

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Epoxy provides high thermal conductivity.
Epoxies

Epoxy provides high thermal conductivity.

Type EP34AN room temperature cure, 2-component epoxy adhesive/sealant, with thermal conductivity of 22-24 BTU/in/ftÂ-²/hr/°F, maintains physical properties after prolonged exposure to temperatures from 400-450°F. It exhibits dimensional stability and electrical insulation properties and can be applied without sagging or dripping. Able to bond to various substrates, 100% reactive...

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Room Temperature Curing Epoxy withstands sterilization.
Epoxies

Room Temperature Curing Epoxy withstands sterilization.

Dual-component EP42HT-2 epoxy adhesive, sealant, coating, and casting material withstands repeated sterilizations, including radiation, ethylene oxide, chemical sterilants, and steam. Featuring service operating temperature range of -60 to +450°F, product exhibits chemical resistance and Shore D hardness greater than 75. Properties include mixed viscosity of 3,500 cps and tensile strength...

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Miscellaneous Compounds

Epoxy Mold Compound suits SIP applications.

Hysol® GR9810 is used as overmold on laminate-based molded array packages including SIP and flip-chip packages. Flat nature of product allows entire package to be processed in non-warped state. Non-antimony, non-bromine, non-phosphorous compound can also underfill small ICs and passive components. It is capable of achieving JEDEC Level 2 requirements at 260°C reflow temperature.

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Epoxy Adhesive/Encapsulant is flame retardant.
Encapsulants

Epoxy Adhesive/Encapsulant is flame retardant.

Self-extinguishing, 5 Minute® Epoxy FR fills gaps and bonds rigid substrates such as metals, glass, ceramics, concrete, and wood. Mixed as dispensed, product has 115,000 cps viscosity, 3-5 min working time, 10-15 min fixture time, and 2-3 hr functional cure time. Once cured, it offers tensile shear strength of 2,800 psi on cold-rolled steel and dielectric strength of 490 V/mil. Bonds...

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Epoxy Adhesive/Sealant resists temperatures up to 600°F.
Epoxies

Epoxy Adhesive/Sealant resists temperatures up to 600°F.

One-component, heat-curing, EP17 offers service operating range of -300 to +600°F and cures in 60-90 min at 300-350°F. Product bonds to metals, glass, ceramics, vulcanized rubbers, and plastics. Chemical-resistant EP17 has Shore D hardness greater than 90, compressive strength greater than 13,000 psi, and tensile strength of 8,700 psi. Flowable paste is 100% reactive, does not contain...

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Epoxies

Epoxy Syntactics feature rapid setting times.

Formulated in light blue, black, orange, and gray, Epocast 1633 epoxy syntactic materials are self-extinguishing and halogen-free. They have 2-5 min work life, are extrudable, and permit insert handling in less than 1 hr at room temperature. After gelling at 77°F and curing for 5 hr @ 120°F, or 2 hr @ 150°F, products exhibits compressive strength of 6,500 psi, lap shear strength...

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Repair Epoxy provides 450°F machinable instant metal. Cotronics Corp.
Epoxies

Repair Epoxy provides 450°F machinable instant metal. Cotronics Corp.

Bond-It(TM) 7056AL is filled with activated, aluminum metal creating fast-set, machinable, repair epoxy. With 1:1 mixing ratio, product is dispensed, mixed, and troweled on without running, dripping, or sagging. It cures at room temperature without objectionable or sulphur odors and hardens in 4-8 min. Bond-It 7056AL adheres to smooth, rough, or porous surfaces, including most plastics, metals,...

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Epoxies

High-Temperature Epoxy bonds to wide range of substrates.

TRABOND 2248 thixotropic, all-liquid system applies at room temperature, but requires high-temperature cure. It bonds to metals, glass, ceramics, and plastics. Ultimate glass transition temperature is 109°C. TRA-BOND 2248 complies with specification ASTM E-595-90 for NASA Outgassing acceptability. It is recommended for applications where good mechanical properties are required at high and...

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Potting/Encapsulation Compound resists thermal shock.
Miscellaneous Compounds

Potting/Encapsulation Compound resists thermal shock.

Two-component, epoxy-sealing EP110F6, for potting, encapsulation, and casting, has 1-2 mix ratio by weight and cures upon exposure to elevated temperatures. It provides electrical insulation and resists thermal cycling and shock. Medium-viscosity liquid passes Navy Hex Bar Test, MILI-16923C, consisting of 10 cycles from -55 to +155°C. It resists chemicals and adheres to wide range of...

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