Encapsulation Equipment

Encapsulation Equipment

ALH SYSTEMS Obtains Ul94 V-0 Approval for Epoxy Resin System

Epoxy resin specialist ALH SYSTEMS LIMITED has received Approval to UL94 V-0 for its NP1003 encapsulation and potting resin. The low viscosity NP1003 resin system can be mixed and cured at ambient or elevated temperatures. The outstanding features of the NP1003 system are : o High gloss finish and excellent adhesion o Very good electrical strength o High thermal conductivity (0.9 W/m/°K) o Low...

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Encapsulation Equipment

ALH SYSTEMS Obtains Ul94 V-0 Approval for Epoxy Resin System

Epoxy resin specialist ALH SYSTEMS LIMITED has received Approval to UL94 V-0 for its NP1003 encapsulation and potting resin. The low viscosity NP1003 resin system can be mixed and cured at ambient or elevated temperatures. The outstanding features of the NP1003 system are : o High gloss finish and excellent adhesion o Very good electrical strength o High thermal conductivity (0.9 W/m/-°K) o Low...

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Epoxy Potting Compound withstands exposure to harsh chemicals.
Encapsulation Equipment

Epoxy Potting Compound withstands exposure to harsh chemicals.

Designed to meet UL-674 requirements for explosion-proof motors, Loctite-® E-40EXP(TM) maintains more than 85% of its compression strength following exposure to 13 harsh chemicals. Two-component compound is used to pot and seal wire conduits, isolating electric motor from hazardous vapors and chemicals that could cause explosion. Curing in approximately 2 hours at room temperature, material will...

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Epoxy Potting Compound withstands exposure to harsh chemicals.
Encapsulation Equipment

Epoxy Potting Compound withstands exposure to harsh chemicals.

Designed to meet UL-674 requirements for explosion-proof motors, LoctiteÂ-® E-40EXP(TM) maintains more than 85% of its compression strength following exposure to 13 harsh chemicals. Two-component compound is used to pot and seal wire conduits, isolating electric motor from hazardous vapors and chemicals that could cause explosion. Curing in approximately 2 hours at room temperature, material...

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Miscellaneous Compounds

Polyurethane Potting Compound protects electronic components.

Epoxies, Etc. develops a new Potting, Encapsulating, and Casting resin. The 20-2121 is a two component, low viscosity, room temperature curing system. This is an easy to use polyurethane that will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling due to its low durometer. The 20-2121 has the following features and...

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Miscellaneous Compounds

Polyurethane Potting Compound protects electronic components.

Epoxies, Etc. develops a new Potting, Encapsulating, and Casting resin. The 20-2121 is a two component, low viscosity, room temperature curing system. This is an easy to use polyurethane that will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling due to its low durometer. The 20-2121 has the following features and...

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Room Temperature Curing Flexibilized Epoxy Combines High Strength and Toughness with Chemical and Abrasion Resistance
Epoxies

Room Temperature Curing Flexibilized Epoxy Combines High Strength and Toughness with Chemical and Abrasion Resistance

HACKENSACK, NJ - Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness. This two component epoxy is ideal for high performance bonding, sealing, coating, and encapsulating applications in the electronic, electrical, computer, metalworking, optical, electro-optical and oil/chemical...

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Room Temperature Curing Flexibilized Epoxy Combines High Strength and Toughness with Chemical and Abrasion Resistance
Epoxies

Room Temperature Curing Flexibilized Epoxy Combines High Strength and Toughness with Chemical and Abrasion Resistance

HACKENSACK, NJ - Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness. This two component epoxy is ideal for high performance bonding, sealing, coating, and encapsulating applications in the electronic, electrical, computer, metalworking, optical, electro-optical and oil/chemical...

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Encapsulation Equipment

Fluid Dispensing System offers dual simultaneous jetting.

Suited for CSP underfill and LED silicone encapsulation, Spectrum S-920N Series uses 2 DispenseJet-® valves to jet fluid, minimizing dispensing time. Dual simultaneous jetting, in conjunction with Calibrated Process Jetting Plus technology, ensures that flow rates for both DispenseJets deliver same mass per part for uniform deposition. Systems automatically compensate for fluid viscosity changes...

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Encapsulation Equipment

Fluid Dispensing System offers dual simultaneous jetting.

Suited for CSP underfill and LED silicone encapsulation, Spectrum S-920N Series uses 2 DispenseJetÂ-® valves to jet fluid, minimizing dispensing time. Dual simultaneous jetting, in conjunction with Calibrated Process Jetting Plus technology, ensures that flow rates for both DispenseJets deliver same mass per part for uniform deposition. Systems automatically compensate for fluid viscosity...

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How SpinSelect Can Save You Time and Money
Sponsored

How SpinSelect Can Save You Time and Money

Thanks to the unique SpinSelect™ Multi-Pocket selectable quick change tool holder, it's time to rethink the range, complexity and volume of parts that your lathe can produce. Our Spin-Select™ tool was created to increase productivity and consistency by decreasing downtime associated with lathe cutting tool and insert setups or changeovers. This product is a game-changer for the industry and we're pleased to show you why.

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