New Encapsulation Equipment Products

Sunic System and Novaled in Joint Development on Thin Film Encapsualation

10/22/2007 Dresden, Germany. and Suwon, Korea, October 22nd, 2007 - Sunic System, a major producer of vacuum deposition equipment for OLED and Novaled, a leading provider of doping technology and materials for organic electronics announce a joint development. Both partners will work together to build up the next generation of Thin Film Encapsulation (TFE) tools, technologies and materials....

Encapsulation Tool deposits multi-layer ultra barrier.

Alternating deposit of polymer smoothing/planarizing layers and ceramic barrier layer to create Barix structure, Model G200E thin-film encapsulation system is used in production of OLEDs, photovoltaics, and thin-film batteries. It consists of oxide sputtering chamber and monomer deposition/UV cure chamber connected in linear fashion; substrate is transferred back and forth to produce multi-layer...

Single-Part Epoxy System cures with UV light or heat.

Environmentally friendly UV15DC80, suited for bonding, sealing, coating, and potting, requires no mixing and has 100% solids formulation. Uninhibited by oxygen, chemically resistant epoxy contains no solvents or volatiles and adheres to variety of materials. For thicknesses of .010-.020 in., straight UV curing is accomplished within seconds with UV light at 365 nm with 30-40 mW/cm-² of energy....

Epoxy suits manual or high speed production applications.

Offering 1,000 cp mixed viscosity, 20206/50013 Electrical Potting System is used for automated encapsulation of motors and electronic parts. Thermally-conductive epoxy cures at room temperature with cure cycles of 24 hr at 77-

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Potting Compound suits high-temperature applications.

Thermally conductive Aremco-Bond(TM) 2315 is black-pigmented, 100% solids epoxy compound used for electrical and electronic potting applications to 365-

Potting Process can be used with hermetic connectors.

Epoxy potting method, adaptable to various connector styles and wire bundles, allows connectors to pass helium leakage rate tests of 1 x 10-6-1 x 10-9. Designed to replace glass hermetic connectors with stated helium leak rate range, process is suited for military, aerospace, and industrial applications.

Potting System produces consistent parts.

EFD(R) 1500D dispenser fills cavities with identical amounts of epoxies, silicones and potting compounds. Tabletop unit operates on compressed air and electricity. Potting material is loaded into disposable syringe, which connects to dispenser by air line. To set, user holds syringe like a pen, inserts tip into lower part of cavity, and uses dispenser's teach function to set fill volume....

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