Encapsulation Equipment

Fluid Dispensing System offers dual simultaneous jetting.

Suited for CSP underfill and LED silicone encapsulation, Spectrum S-920N Series uses 2 DispenseJetÂ-® valves to jet fluid, minimizing dispensing time. Dual simultaneous jetting, in conjunction with Calibrated Process Jetting Plus technology, ensures that flow rates for both DispenseJets deliver same mass per part for uniform deposition. Systems automatically compensate for fluid viscosity...

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Thomson Participates in First DVB-H Mobile Television Service in Latin America

ATV trial in Peru using Thomson encoding and delivery on air since December,commercial services to roll out in June 2008 Paris (France) and Barcelona (Spain) - 6 February 2008 - Thomson (Euronext Paris: 18453; NYSE: TMS) today announces that it is supplying a complete head-end solution to ATV, part of the pan-Latin American media group Albavision, to power a trial mobile television service in...

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Thomson's Turnkey Solution Brings Mobile TV to the Baltics

DVB-H trial by Latvian Mobile Telephone uses comprehensive Thomson Management and Encoding System Paris (France) Barcelona (Spain) - 5 February 2008 - Latvian Mobile Telephone (LMT) has established a mobile television trial, the first of its kind in the Baltics, based on an end to end solution from Thomson (Euronext Paris: 18453; NYSE: TMS). The comprehensive system from Thomson includes a...

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Encapsulation Tool deposits multi-layer ultra barrier.

Alternating deposit of polymer smoothing/planarizing layers and ceramic barrier layer to create Barix structure, Model G200E thin-film encapsulation system is used in production of OLEDs, photovoltaics, and thin-film batteries. It consists of oxide sputtering chamber and monomer deposition/UV cure chamber connected in linear fashion; substrate is transferred back and forth to produce multi-layer...

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Single-Part Epoxy System cures with UV light or heat.

Single-Part Epoxy System cures with UV light or heat.

Environmentally friendly UV15DC80, suited for bonding, sealing, coating, and potting, requires no mixing and has 100% solids formulation. Uninhibited by oxygen, chemically resistant epoxy contains no solvents or volatiles and adheres to variety of materials. For thicknesses of .010-.020 in., straight UV curing is accomplished within seconds with UV light at 365 nm with 30-40 mW/cmÂ-² of...

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Potting Process can be used with hermetic connectors.

Potting Process can be used with hermetic connectors.

Epoxy potting method, adaptable to various connector styles and wire bundles, allows connectors to pass helium leakage rate tests of 1 x 10-6-1 x 10-9. Designed to replace glass hermetic connectors with stated helium leak rate range, process is suited for military, aerospace, and industrial applications.

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Potting System produces consistent parts.

Potting System produces consistent parts.

EFD(R) 1500D dispenser fills cavities with identical amounts of epoxies, silicones and potting compounds. Tabletop unit operates on compressed air and electricity. Potting material is loaded into disposable syringe, which connects to dispenser by air line. To set, user holds syringe like a pen, inserts tip into lower part of cavity, and uses dispenser's teach function to set fill volume....

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