Encapsulation Equipment

Epoxy Potting Compound resists thermal shock and cycling.
Encapsulation Equipment

Epoxy Potting Compound resists thermal shock and cycling.

PassingÂ- Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize...

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Epoxy Potting Compound resists high temperatures.
Encapsulation Equipment

Epoxy Potting Compound resists high temperatures.

With 130°C relative temperature index rating, 50-3150RFR Black Epoxy with Catalyst 30 will survive elevated temperatures for long periods of time, which offers benefits as electronics get smaller and hotter. Compound is UL 746B listed and formulated to meet stringent non-burning requirements of UL 94 V-0. Typical applications include encapsulating power supplies, transformers, coils,...

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Conformal Coating System utilizes multi-valve technology.
Coating Equipment

Conformal Coating System utilizes multi-valve technology.

Available in conformal coating, dispensing, and/or potting platforms, Precisioncoat V features multi-valve technology that allows for application of dots, lines, fills, glob tops, and spray coat areas. Conformal coating and dispense valves move smoothly along 3-axis system, with option to add fully programmable fourth and fifth axes for tilt and rotation capabilities. With Windows®-based...

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Not Your Typical Flame Retardant
Miscellaneous Compounds

Not Your Typical Flame Retardant

CRANSTON, RI USA – You’ll Wish Every Thermally Conductive Compound Was This Easy To Use... But you won't have to... because 50-3152FR has everything you look for in a Thermally Conductive Potting Compound.Â- Ã‚  Aside from offering fast heat dissipation and stability during thermal cycling, 50-3152FR has some exceptional properties that make it stand out from the rest.  The...

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Low Viscosity, Two Component Epoxy Has an Extended Working Life and Low Exotherm
Encapsulation Equipment

Low Viscosity, Two Component Epoxy Has an Extended Working Life and Low Exotherm

Suitable for large castings, Master Bond EP21LVSP6 combines a low viscosity and low exotherm with a working life of 3-5 hours. It can also be used for bonding, sealing and coating applications in aerospace, electronic, electrical, optical and other specialty industries. This two part epoxy offers has a non-critical one to one mix ratio, by weight or volume and its processing is facilitated with...

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High Quality Potting Compound Meets Special Criteria
Miscellaneous Compounds

High Quality Potting Compound Meets Special Criteria

CRANSTON, RI USAÂ- – 50-1952, by Epoxies, Etc., is a Thermally Conductive Silicone Potting and Encapsulating Compound with outstanding properties over a broad temperature range.  Many electrical potting applications require the material transfer heat well, have good electrical properties and protect components.  The 50-1952 meets these criteria and stands out in several...

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Encapsulation Equipment

Droplet System encapsulates single cells or beads. .

Benfitting applications such as single cell analysis, screening, and PCR, Droplet System provides users with tools required to perform assays on individual cells in picolitre volume environments. System features microfluidic components and lets users load single cells or beads into droplets. Mitos P-Pump allows stirring of input fluid reservoir, providing even distribution of beads and delivering...

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Encapsulation Equipment

Does Weight Matter?

Epoxies, Etc. Develops Low Density Epoxy... 20-3035 Epoxy Syntactic Foam System The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds. This epoxy syntactic foam system utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product. This unique...

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Epoxy Potting Compound suits applications up to 365°F.
Encapsulation Equipment

Epoxy Potting Compound suits applications up to 365°F.

Intended for potting and encapsulating in electrical and electronic applications, Aremco-Bond(TM) 2315 provides flexural strength of 12,300 psi, volume resistivity of 1.0 x 1015, and dielectric strength of 480 V/mil. Black-pigmented, thermally conductive product offers resistance to acids, alkalis, organic fluids, and salts. Featuring mixed ratio of 100 parts resin to 25 parts hardener by weight,...

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Flexible Epoxy withstands cryogenic conditions.
Encapsulation Equipment

Flexible Epoxy withstands cryogenic conditions.

Serviceable over wide range of 4 K to 250°F, Polymer System EP37-3FLF cures at room temperature in 2-3 days or faster at elevated temperatures. Optically clear, 2-component epoxy offers non-critical 1:1 mix ratio and low mixed viscosity of 1,400-1,500 cps. With bond shear strength exceeding 2,000 psi and T-peel strength of 25 pli, flexible epoxy bonds to metals, glass, ceramics, rubber, and...

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Precision Machining Solutions with Over 25 Years of Experience
Sponsored

Precision Machining Solutions with Over 25 Years of Experience

Quality, customer service, and unbeatable value are the hallmarks of Hogge Precision. Since 1989 we have built a reputation as the go-to precision machining source, servicing many demanding industries. For CNC machining and screw machining, there are few manufacturers that can match our capabilities and expertise. See our video to learn more.

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