Encapsulants

Encapsulants

Reflow Encapsulant suits flip chip-on-flex applications.

SE-CURE® 9110 series consists of single-component materials that perform as epoxy-based flux and underfill encapsulants. Series uses compression-flow technique and enables concurrent processing of typical surface-mount components with flip chips in single reflow profile. Resin system provides eutectic and lead-free assembly solution in one material that offers protection from mechanical...

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Encapsulants

Sealant/Encapsulant cures with heat or UV light.

EMCAST 4100, 100% solids, single-component, epoxy-based adhesive can be cured by exposure to ultra violet light in 320-380 nm wavelength range and/or with heat above 110°C to cure shadowed areas. Medium-viscosity product cures to rigid material with Shore D hardness of 92, CTE of 25 ppm/°C, and 150°C Tg. It adheres to various metals and ceramic surfaces and does not need to be...

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Potting Compound handles temperatures to 2800°F.
Encapsulants

Potting Compound handles temperatures to 2800°F.

Grade H-115 thermally conductive, electrically insulating ceramic cement resists thermal shock, withstands rapid heating or cooling at wide temperature fluctuations, and prevents vibration-loosening of components. Supplied as single-component, dry, white powder, compound sets by chemical reaction, forming near impervious ceramic within 16 hr. Compound does not contain asbestos or other fibers and...

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Potting Compound seals connectors, wires, and cables.
Encapsulants

Potting Compound seals connectors, wires, and cables.

Type DE43874 ceramic potting compound is suitable for applications up to 500°F. It is fire resistant, self-extinguishing, and may be approved for explosion proof applications by UL and other certifying organizations. Viscosity permits penetration of small cavities. Product bonds to aluminum, steel, and copper alloys, enabling non-elastomeric sealing designs. Applications include feedthrus...

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Molding/Potting Compound is used to produce burner nozzles.
Miscellaneous Compounds

Molding/Potting Compound is used to produce burner nozzles.

Thermally conductive, silicon carbide-based Ceramacast(TM) 673N can be used in applications with temperatures to 2,450°F. Chemical setting, ceramic compound is formulated as two-part, powder base and hydrophobic liquid binder system. Product is fully hardened by air setting for 8 hr then step curing for 1-2 hr at 200 and 250°F, respectively. Cured material demonstrates shrinkage of...

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Epoxy Compound cures at room temperature.
Encapsulants

Epoxy Compound cures at room temperature.

General-purpose casting compound LX30007, suited for underfill and encapsulating applications, produces strong bonds, with lap shears of over 2,000 psi. With glass transition temperature of 78°C, 2-part epoxy offers viscosity of 7,600 cps and cures at room temperature.

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Potting Compound cures at room temperature.
Encapsulants

Potting Compound cures at room temperature.

Type LX20111 2-part epoxy develops strong bonds to variety of substrates and can achieve lap shears of 2,900 psi. When cured, substance resists many organic and inorganic compounds and is thermally and electrically insulating. LX20111 reaches glass transition temperature of 64°C and is suitable for applications requiring lightweight material.

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Potting Compound cures quickly in thick applications.
Encapsulants

Potting Compound cures quickly in thick applications.

Trigger Cure(TM) compound cures at room temperature to depths of 1 in. or more, and in areas under components where light does not reach. Two-part compound is applied with typical disposable-tip, static mix dispensers. Exposure to long-wave UV light cures product to depth of 1/4 inch in 20 seconds or less; remaining liquid resin gels in 7 to 20 minutes. Full cure is achieved in 24 hours at room...

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Coating/Potting Compound coats structural steel columns.
Encapsulants

Coating/Potting Compound coats structural steel columns.

Ceramacast(TM) 589 2-part, silicon-dioxide based, silicate-bonded, chemically-setting ceramic compound is suitable for applications to 2400°F. Dielectric strength and volume resistivity are 100 V/mil and 109 ohm-cm, respectively. Compressive strength is 4,500 psi and coefficient of thermal expansion is 5.5 in./in./°F. Ceramacast(TM) 589 is pneumatically dispensed and reaches full cure...

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Epoxy Encapsulant is flame retardant.
Encapsulants

Epoxy Encapsulant is flame retardant.

TRA-CAST 9182A medium-viscosity electrical insulator is UL-94 V-O approved. Semi-rigid material adheres to electronic and aerospace-industry materials such as metal, glass, ceramic, industrial laminates, and plastics. It is suited for potting, laminating, transformer encapsulating, filament binding, and coil-embedding applications where stress relief matched with fire retardancy is required.

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