Encapsulants

Potting Compound dispenses from disposable static mixers.
Encapsulants

Potting Compound dispenses from disposable static mixers.

Following dispensing, Trigger Cure(TM) 9-20675 A/B 2-part potting compound forms Â-¼ in., UV-cured layer on top in 20 seconds or less that provides protection and integrity to surface. Interior gels within 15-20 minutes at room temperature to depths of 1 in. or more. Optimum properties are achieved in 48 hours at room temperature. With no exotherm, soft, rubbery encapsulant protects and...

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Encapsulants

Polyurethane Potting Compound protects electronic SMT parts.

Flexible polyurethane potting and encapsulating resin system 20-2353 imparts no stress on delicate/sensitive electronic surface mount components during cure or when thermal cycled in electronic assemblies. Suited for continuous exposure in wet environments, it does not absorb any moisture and maintains flexibility down to -70°C. Product offered as alternative to Silicone systems due to its...

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Encapsulants

Reflow Encapsulant provides single-pass curing.

With blue color to aid visual inspection, SE-CURE® 9126 single-pass reflow encapsulant is suited for mounting eutectic tin/lead flip chip and fine-pitch chip-scale packaging (CSP) components to rigid substrates. Single-component, liquid, epoxy-based flux and underfill encapsulant may be used in high humidity and temperature environments where dwell time between material dispense and chip...

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Encapsulants

Reflow Encapsulant suits flip chip-on-flex applications.

SE-CURE® 9110 series consists of single-component materials that perform as epoxy-based flux and underfill encapsulants. Series uses compression-flow technique and enables concurrent processing of typical surface-mount components with flip chips in single reflow profile. Resin system provides eutectic and lead-free assembly solution in one material that offers protection from mechanical...

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Encapsulants

Sealant/Encapsulant cures with heat or UV light.

EMCAST 4100, 100% solids, single-component, epoxy-based adhesive can be cured by exposure to ultra violet light in 320-380 nm wavelength range and/or with heat above 110°C to cure shadowed areas. Medium-viscosity product cures to rigid material with Shore D hardness of 92, CTE of 25 ppm/°C, and 150°C Tg. It adheres to various metals and ceramic surfaces and does not need to be...

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Potting Compound handles temperatures to 2800°F.
Encapsulants

Potting Compound handles temperatures to 2800°F.

Grade H-115 thermally conductive, electrically insulating ceramic cement resists thermal shock, withstands rapid heating or cooling at wide temperature fluctuations, and prevents vibration-loosening of components. Supplied as single-component, dry, white powder, compound sets by chemical reaction, forming near impervious ceramic within 16 hr. Compound does not contain asbestos or other fibers and...

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Potting Compound seals connectors, wires, and cables.
Encapsulants

Potting Compound seals connectors, wires, and cables.

Type DE43874 ceramic potting compound is suitable for applications up to 500°F. It is fire resistant, self-extinguishing, and may be approved for explosion proof applications by UL and other certifying organizations. Viscosity permits penetration of small cavities. Product bonds to aluminum, steel, and copper alloys, enabling non-elastomeric sealing designs. Applications include feedthrus...

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Molding/Potting Compound is used to produce burner nozzles.
Miscellaneous Compounds

Molding/Potting Compound is used to produce burner nozzles.

Thermally conductive, silicon carbide-based Ceramacast(TM) 673N can be used in applications with temperatures to 2,450°F. Chemical setting, ceramic compound is formulated as two-part, powder base and hydrophobic liquid binder system. Product is fully hardened by air setting for 8 hr then step curing for 1-2 hr at 200 and 250°F, respectively. Cured material demonstrates shrinkage of...

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Epoxy Compound cures at room temperature.
Encapsulants

Epoxy Compound cures at room temperature.

General-purpose casting compound LX30007, suited for underfill and encapsulating applications, produces strong bonds, with lap shears of over 2,000 psi. With glass transition temperature of 78°C, 2-part epoxy offers viscosity of 7,600 cps and cures at room temperature.

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Potting Compound cures at room temperature.
Encapsulants

Potting Compound cures at room temperature.

Type LX20111 2-part epoxy develops strong bonds to variety of substrates and can achieve lap shears of 2,900 psi. When cured, substance resists many organic and inorganic compounds and is thermally and electrically insulating. LX20111 reaches glass transition temperature of 64°C and is suitable for applications requiring lightweight material.

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