Encapsulants

Encapsulants

Potting/Encapsulating Compound has water-clear formula.

Designed for applications requiring clarity, semi-flexible 20-2620 is non-yellowing and will not place excess stress on electronic components. This 2-component polyurethane compound offers weather resistance and can be used outdoor applications without exhibiting any degradation. Compound, available in TriggerBond®, cures at room temperature and has 1:1 mix ratio.

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Silicone Material suits electronic packaging applications.
Encapsulants

Silicone Material suits electronic packaging applications.

Low outgassing, one-part material EPM-2411-2 glop-top is designed for encapsulation of chip packages in devices where outgassing-related contamination poses problem. Product exhibits low stress and wide operating temperature ranges characteristically associated with silicone-based materials. It is stored and shipped frozen in 3 and 30 cc syringes as well as 3 and 6 oz tubes.

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Ceramic Compound has compressive strength of 11,500 psi.
Encapsulants

Ceramic Compound has compressive strength of 11,500 psi.

Ceramacast(TM) 646N is hydraulic-setting, phosphate-bonded, zirconium oxide filled ceramic compound used for encapsulating and potting high temperature electrical components to 3,000Â-ºF. Supplied as dry powder, potting compound sets hydraulically in 16-24 hr at room temperature. Cured material demonstrates volume resistivity of 109 W-cm and dielectric strength of 250 V/mil.

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Encapsulants

Polyurethane Potting Compounds range from Shore A 25-90.

Suited for continuous exposure in wet environments, Series 20-2300 does not absorb any moisture and will therefore insulate electronic systems in damp or wet applications. Compounds do not impart any stress on components during cure or when thermal cycled in assemblies. They offer suitable alternative to silicone systems due to flexibility, electrical insulating properties, and ability to adhere...

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Chip Encapsulant endures bending and flexing at -20°C.
Encapsulants

Chip Encapsulant endures bending and flexing at -20°C.

DYMAX 9008 chip encapsulant forms transparent layer that protects components and leads from moisture, dust, and other contaminants. Coating cures in 10-30 seconds under 200-1,200 mW/cmÂ-² intensity lights, enabling thicknesses to 1.5 mm to cure in UV conveyor belts at speeds of 2-4 ft/min. Cure depths to ¼ in. are possible. Coating adheres to variety of surfaces including...

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Flux

Indium Corporation Features Reliability Program at Semicon West

Indium Corporation will highlight its Reliability Program at its exhibit at Semicon West on July 10-14 at the Moscone Center in San Francisco, CA. Indium's team of experts will be available at booth #8423 to answer questions and provide information. With the increasing demands for power and miniaturization driving thermal management issues as well as CSP Reliability, Indium Corporation is...

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Encapsulants

Epoxy Compound offers electrical potting and encapsulation.

Providing optimized wetting characteristics, 2-part TRA-CAST 3103 adheres to glass, ceramics, and most metals and plastics. When fully cured, product offers electrical insulator with impact and thermal shock resistance. Material can be room temperature or heat cured and exhibits ultimate Tg of 80°C. TRA-CAST 3103 is NASA outgassing approved and has passed cytotoxicity testing.

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Encapsulants

UV Curable Adhesive targets electronics manufacturing.

One-component 60-7105 adhesive, coating, and potting compound cures within seconds when exposed to UV light. With viscosity of 3,000 cps, product self-levels around intricate electronic designs, can cure in deep sections, and adheres to most substrates. Adhesive is available in pre-packaged syringes, quarts, and gallons.

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Encapsulants

Dam and Fill Encapsulants meet lead-free requirements.

Hysol® FP4451TD(TM) and FP4800(TM) meet stringent JEDEC level testing requirements and enable wirebonded cavity-down SuperBGA® and Viper(TM) BGA packages. Suited for package level applications, Hysol FP4451TD offers aspect ratio of 0.70 height-to-width and enables dam heights greater than 1 mm. Self-leveling, liquid encapsulant, Hysol FP4800 withstands solder temperatures to...

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Miscellaneous Compounds

Ceramic Compound offers high-temperature thermal insulation.

Fused silica-based Ceramacast(TM) 645N is suited for encapsulating small ceramic and metal housings used in high temperature devices such as flow meters, pressure sensors, and temperature sensors to 3,000°F. Product offers dielectric strength of 300 V/mil, compressive strength of 7,000 psi, and chemical resistance. Supplied in powder form, compound is mixed with water and sets at room...

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We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

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