Encapsulants

Encapsulants

HRI Silicone Encapsulants optimize LED performance.

DOW CORNING® OE-6665 A/B, DOW CORNING OE-6630 A/B, and DOW CORNING OE-6635 A/B are 2-part high refractive index (HRI) silicone encapsulants that improve high-brightness LED performance and durability by preventing electrical and environmental damage while increasing light output and minimizing heat build-up. Offered in various hardnesses and viscosities to suit range of applications,...

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Encapsulants

Grote Industries Partners with Henkel for Advanced LED Lighting Solution

A pioneer in the vehicle lighting and safety market, Grote Industries recently selected a Hysol® brand Henkel potting material to enable a new automated LED lamp assembly line capable of producing over 1 million parts per year. With the automotive safety and lighting industry quickly making the transition from incandescent vehicle lamps to LED-based lighting, robust protection materials in the...

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Photovoltaic Equipment

Dow Corning Solar Solutions Introduces Three Materials to Support Photovoltaic Module Manufacturing

High-Performance Encapsulant and Potting Agents Expand Dow Corning's Industry-Leading Portfolio of Solar Products MIDLAND, Mich., Sept. 3 / -- Following the launch of its first solar feedstock material (Dow Corning® PV 1101 SoG Silicon) last year, Dow Corning's Solar Solutions Group has extended its product offerings for the global solar energy market with an encapsulant and two potting...

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Encapsulants

Epoxy Encapsulants handles large die flip chip packages.

Hysol FP4581 and FP4583 underfill systems adhere to SiN and polyimide and deliver combination of thermal mechanical characteristics to prevent delamination, bump fatigue, and UBM failure. With low CTE properties, Hysol FP4581 forms rigid, low stress seal that dissipates stress on solder joints. Hysol FP4583 contains fillers that are less than or equal to 2 microns in diameter and is formulated...

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Encapsulants

Stevens Urethane Introduces Photovoltaic Encapsulant Product Line

EASTHAMPTON, Mass., Aug. 31 -- Stevens Urethane, a division of JPS Industries, Inc. (Pink Sheets: JPST.PK), announces the launch of their new Photovoltaic (PV) Encapsulant Product line (Encapsolar(TM)). The company will introduce the product line at the 22nd European Photovoltaic Solar Energy Conference and Exhibition to be held in Milan, Italy, September 3-6, 2007. Charles R. ( Chuck") Tutterow,...

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Miscellaneous Compounds

Silicone Compound has Shore A hardness of 45.

Suitable for high performance casting, potting, and encapsulation, MasterSil 151 two component compound is designed to cure at room temperature and is resistant to vibration, impact, shock, and thermal cycling. Features include service operating temperature range of -65°F to +400°F, elongation at break of 160%, 460 V/mil dielectric strength, volume resistivity of 1 x 1,015 W cm, and...

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Repair Compounds

Underfill Material enables recovery of substrates and PCBs.

Manufactured in lead-free environments, Loctite® 3536 underfill material is designed to fill space beneath fine-pitch CSP and BGA packages. It cures at low temperature which minimizes thermal stress to other components on printed circuit board and allows for in-line curing. Product protects solder joints against mechanical strains such as shock, drop, and vibration, and offers manufacturing...

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Resins

ALH Systems Goes beyond RoHS Compliance and Offers a Non-Classifiable Polyurethane Encapsulation Resin

Polyurethane resin specialist ALH SYSTEMS LIMITED has developed the safest two-part resin system. The NP2500 resin system goes well beyond the RoHS directive and contains NO Mercury catalysts, NO Phthalate plasticisers or NO monomeric Isocyanates and is classified as NON-HAZARDOUS according to the latest EC criteria. NP2500 offers: - Superb water resistance and outstanding electrical properties....

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Encapsulants

Adhesive and Potting Compound has UV-curable formula.

Electronics-grade UV-curable adhesive and potting compound, UV Cure 60-7108, adheres to most substrates and exhibits favorable exterior durability. It self levels in and around electronic components and is formulated to maintain its clarity over time. Suitable uses include fiber optics or other optical bonding applications.

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Epoxy Resin Compound features high thermal conductivity.
Miscellaneous Compounds

Epoxy Resin Compound features high thermal conductivity.

Suitable for use in both thick/thin sectioned configurations, EP21TDC-2LO bonding, sealing, coating, and encapsulation system has thermal conductivity of 9 BTU/in./ftÂ-²/hr/°F and volume resistivity of 1,012 Wcm. With service operating temperature range of 4 K to 250°F, room temperature curable product features Shore D hardness of 36, elongation of 50%, 1:3 mix ratio by weight or...

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