Encapsulants

Encapsulants

Stevens Urethane Introduces Photovoltaic Encapsulant Product Line

EASTHAMPTON, Mass., Aug. 31 -- Stevens Urethane, a division of JPS Industries, Inc. (Pink Sheets: JPST.PK), announces the launch of their new Photovoltaic (PV) Encapsulant Product line (Encapsolar(TM)). The company will introduce the product line at the 22nd European Photovoltaic Solar Energy Conference and Exhibition to be held in Milan, Italy, September 3-6, 2007. Charles R. ( Chuck") Tutterow,...

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Miscellaneous Compounds

Silicone Compound has Shore A hardness of 45.

Suitable for high performance casting, potting, and encapsulation, MasterSil 151 two component compound is designed to cure at room temperature and is resistant to vibration, impact, shock, and thermal cycling. Features include service operating temperature range of -65°F to +400°F, elongation at break of 160%, 460 V/mil dielectric strength, volume resistivity of 1 x 1,015 W cm, and...

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Repair Compounds

Underfill Material enables recovery of substrates and PCBs.

Manufactured in lead-free environments, Loctite® 3536 underfill material is designed to fill space beneath fine-pitch CSP and BGA packages. It cures at low temperature which minimizes thermal stress to other components on printed circuit board and allows for in-line curing. Product protects solder joints against mechanical strains such as shock, drop, and vibration, and offers manufacturing...

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Resins

ALH Systems Goes beyond RoHS Compliance and Offers a Non-Classifiable Polyurethane Encapsulation Resin

Polyurethane resin specialist ALH SYSTEMS LIMITED has developed the safest two-part resin system. The NP2500 resin system goes well beyond the RoHS directive and contains NO Mercury catalysts, NO Phthalate plasticisers or NO monomeric Isocyanates and is classified as NON-HAZARDOUS according to the latest EC criteria. NP2500 offers: - Superb water resistance and outstanding electrical properties....

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Encapsulants

Adhesive and Potting Compound has UV-curable formula.

Electronics-grade UV-curable adhesive and potting compound, UV Cure 60-7108, adheres to most substrates and exhibits favorable exterior durability. It self levels in and around electronic components and is formulated to maintain its clarity over time. Suitable uses include fiber optics or other optical bonding applications.

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Epoxy Resin Compound features high thermal conductivity.
Miscellaneous Compounds

Epoxy Resin Compound features high thermal conductivity.

Suitable for use in both thick/thin sectioned configurations, EP21TDC-2LO bonding, sealing, coating, and encapsulation system has thermal conductivity of 9 BTU/in./ftÂ-²/hr/°F and volume resistivity of 1,012 Wcm. With service operating temperature range of 4 K to 250°F, room temperature curable product features Shore D hardness of 36, elongation of 50%, 1:3 mix ratio by weight or...

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Silicone Elastomer features electrical insulation properties.
Encapsulants

Silicone Elastomer features electrical insulation properties.

Suited for sealing and joining of metals, plastics, electrical insulations, protective coatings, and formed-in-place gaskets, Master Sil 700 silicone elastomer compound has dielectric strength of 530 V/mil and 400% elongation. Silicone adhesive/sealant features paste consistency and does not sag, slump, or run off surfaces. It cures at ambient temperatures to a flexible rubbery solid when exposed...

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Thermally Conductive Epoxy is Exceptionally Flexible
Resins

Thermally Conductive Epoxy is Exceptionally Flexible

Master Bond Inc. announces the successful culmination of in use trial testing for EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating, and encapsulation. The cured compound exhibits a high, 31% elongation, truly exceptional for a thermal conductive epoxy where the conductivity is a robust 2.6 W/mo°K (18...

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Encapsulants

Potting/Encapsulating Compound has water-clear formula.

Designed for applications requiring clarity, semi-flexible 20-2620 is non-yellowing and will not place excess stress on electronic components. This 2-component polyurethane compound offers weather resistance and can be used outdoor applications without exhibiting any degradation. Compound, available in TriggerBond®, cures at room temperature and has 1:1 mix ratio.

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Silicone Material suits electronic packaging applications.
Encapsulants

Silicone Material suits electronic packaging applications.

Low outgassing, one-part material EPM-2411-2 glop-top is designed for encapsulation of chip packages in devices where outgassing-related contamination poses problem. Product exhibits low stress and wide operating temperature ranges characteristically associated with silicone-based materials. It is stored and shipped frozen in 3 and 30 cc syringes as well as 3 and 6 oz tubes.

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