Encapsulants

Two-Part Silicones suit potting and sealing applications.
Encapsulants

Two-Part Silicones suit potting and sealing applications.

Designed to rapidly bond dissimilar substrates, Loctite® Ultra-Clear Two-Part Silicones maintain flexibility at temperatures from -60 to 450°F. Non-corrosive products cure through large gaps and enclosed bond lines, require no primers, and offer low-odor dispensing. With elongations up to 240%, materials withstand extreme vibration, flexing, and thermal shock. Products cure to...

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Color Masterbatches target wire and cable industry.
Polymer Additives

Color Masterbatches target wire and cable industry.

Suited for coloring complex melt processable fluoropolymer resins used as plenum space jacketing materials, MPFP Color Masterbatches come in 10 color-coding formulations matched to Munsell and RAL standards. Products are available in FEP and PVDF resin systems and are expandable to include other MPFP resins as needed. They maintain inherent flame retardancy and low smoke emissions that allow...

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Encapsulants

Process Technology Offers Ceramacast 675 High Temperature Potting Compound

Process Technology, manufacturer of electric immersion heaters, inline heaters, heat exchangers and temperature controls, is now offering Ceramacast 675 for over 70% below reail value. Ceramacast 675 is a high temperature, thermally conductive, aluminum nitride filled ceramic potting compound. It is used in the production of quick response sensors such as thermocouples and resistance temperature...

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Potting Compound withstands temperature extremes.
Encapsulants

Potting Compound withstands temperature extremes.

With thermal conductivity of 25 BTU-in./hr-ft2-°F and volume resistivity of 1 x 1014 W cm, Type EP37-3FLFAN dielectric heat transfer adhesive works in temperature extremes, up to 250°F and down to 4K in cryogenic environments. Two-part thermal potting compound is formulated to cure at room temperatures and forms bonds that are resistant to shock, impact, thermal cycling, and chemicals.

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Ceramic Adhesive suits high temperature potting applications.
Repair Compounds

Ceramic Adhesive suits high temperature potting applications.

Magnesium oxide filled, water based, 2-part ceramic adhesive and coating system Ceramabond(TM) 672 can be used in assembly of high temperature catalytic converters for applications to 2,800°F. It exhibits volume resistivity of 109 W-cm, dielectric strength of 255 V/mil, tensile shear strength of 500 psi, and torque strength of 21.6 ft-lb. Adhesive contains no VOCs, does not outgas in ultra...

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Encapsulants

Polyurethane Adhesive offers moisture resistance.

Consisting of polybutadiene modified polyurethane, UR3005 features water pickup of less than 1% during immersion at 60°C. Product adheres to many plastics and metals, gels in 10-20 min, and reaches full cure in 24 hr. As medium soft encapsulant, UR3005 induces little stress on sensitive parts, such as PCB level components and associated solder joints. Two-part system has 6:1 mix ratio and...

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Encapsulants

Optical Encapsulant Gel targets high-brightness LEDs.

Curing to flexible gel for chip sealing and protection of lens-type LED devices, 2-part DOW CORNING® OE-6450 offers stress relief, moisture protection, and UV resistance. Product features penetration value of 45 for impact resistance and refractive index of 1.54 to maximize light transmittance. Gel offers minimal moisture absorption and is compatible with lead-free solder reflow...

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Re-Enterable Gel protects electrical enclosure contents.
Encapsulation Equipment

Re-Enterable Gel protects electrical enclosure contents.

Supplied in safe and self-contained bag, GELSEAL is capable of transforming standard electrical enclosures up to and beyond IP68 rating while offering re-enterabilty and protection against water, moisture, dust, and dirt. Non-toxic gel system, designed for facilitated pouring as well as optimal adhesion and dielectric properties, is suited for encapsulating, sealing, potting, insulating, and...

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Light Emitting Diodes (LED)

Dow Corning Electronics Launches Optimized Manufacturing Process Program for Cost-Competitive LED Overmolding

Equipment Partnership Program Streamlines the Integration of LED Production Processes Using Dow Corning's Silicone Materials MIDLAND, Mich., Sept. 22 -- Dow Corning Electronics' LED materials group today announced it has launched an Optimized Manufacturing Process" program, partnering with capital equipment providers to develop integrated light-emitting diode (LED) overmolding processes designed...

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Encapsulants

Adhesive cures with ultra violet light or heat.

OPTOCAST AC-3716 100% solids, low viscosity, 1-component, acrylate-based formulation can be cured almost instantly with exposure to ultra violet light in 320-380 nm wavelength range or with heat to cure shadowed areas. It cures to soft, compliant material with Shore A hardness of 60-62. OPTOCAST AC-3716 exhibits excellent adhesion to variety of metal, ceramic, and glass-filled epoxy surfaces.

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