Encapsulants

Encapsulants

Carus Remediation Technologies Acquires New Product Technology

Carus Corporation is pleased to announce the signing of a licensing agreement with Specialty Earth Sciences (SES) of New Albany, Indiana, for a new encapsulation technology for potassium permanganate and other solids. According to Inga Carus, CEO of Carus Corporation, this patented technology will help us provide our customers with new application options for RemOx® S ISCO Reagent and other...

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Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Miscellaneous Compounds

Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components

HACKENSACK, NJ - Sept 10, 2009 - Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various...

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One-Part Silicones cure rapidly when exposed to UV/Vis light.
Encapsulants

One-Part Silicones cure rapidly when exposed to UV/Vis light.

Comprised of 7 products, Loctite® Light Cure Silicones offer cure depths up to 2 in. and cure fully in seconds when exposed to high-powered UV or visible light. Solvent-free adhesives/sealants deliver elastic seal with optimized degradation resistance. Able to bond with silicone, plastic, and metal substrates, they exhibit weather, temperature, and moisture resistance. Uses include general...

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DYMAX UV Conformal Coatings and Adhesives Documented Halogen-Free
Encapsulants

DYMAX UV Conformal Coatings and Adhesives Documented Halogen-Free

DYMAX Corporation's UV conformal coatings, encapsulants, adhesives, and potting materials for electronic applications are documented by an independent laboratory to meet or exceed the halogen-free standards set forth in IEC 61249-2-21. Halogen-free declarations give users up-front confidence that materials will meet back-end requirements. Halogen-free test reports are available online at...

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Epoxy Potting Compound has low viscosity formulation.
Encapsulation Equipment

Epoxy Potting Compound has low viscosity formulation.

Formulated for electronic potting and encapsulating applications, Type 20-3060 Epoxy flows quickly in and around electronic components, self levels, releases air bubbles, and provides smooth, glasslike finish. It offers electrical insulation, chemical resistance, and protection from environment. Potting compound is available in quarts, gallons, and 5 gal pails.

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Encapsulants

High-Purity Gels exhibit minimal moisture permeability.

Available with refractive index of 1.54 and viscosities from 3,500-8,000 cP, LS-3354, LS2-3354, and LS3-3354 are designed for potting, encapsulating, backfilling, and dampening applications requiring soft gel with optical clarity. Cure can be achieved at ambient temperatures with humidity or accelerated with heat, and gels can be removed for rework if needed. Available in 1:1 mix ratio, products...

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Silicone Gel offers refractive index of 1.40.
Encapsulants

Silicone Gel offers refractive index of 1.40.

Providing protection from mechanical shock, optically clear LS-3140 is suited for use as encapsulating, embedding, or potting compound for environmental protection of electronic assemblies. Low outgassing gel handles stress during thermal cycling without cracking or delamination. To meet multitude of processing requirements, LS-3140 cures at room temperature, or cure can be accelerated with heat....

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Encapsulants

Encapsulant is used for manufacture of photovoltaic roof tile.

Offered in thicknesses from 35-60 mil, DuPont(TM) PV5300 Series encapsulant sheets are made of clear ionomer and designed to enhance impact resistance, durability, and cost-per-watt efficiency of building-integrated photovoltaic (BIPV) tiles. Properties at 23°C include refractive index value of 1.49, tensile strength of 34.5 MPa, and specific gravity of 0.95. Dielectric constant is 2.9 @...

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