Encapsulants

Epoxy Adhesive encapsulates sensors in harsh environments.
Encapsulants

Epoxy Adhesive encapsulates sensors in harsh environments.

Combining quartz filler and amine compound, Supreme 45HTQ is suited for bonding and encapsulating transducers, gauges, actuators, and sensors in harsh environments. Epoxy adhesive features tensile strength exceeding 8,500 psi and compressive strength greater than 20,000 psi. Resistant to chemicals, acids, oils, water, and steam, product can withstand long term exposure to 400-500°F...

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Encapsulants

Embossed Solar Encapsulant targets photovoltaic applications.

Thin gauge encapsulant Saflex® PG41 is designed to enhance solar panel throughput for solar module manufacturers that use vacuum encapsulation process. Embossing technology creates micro channels on surface of encapsulant, which facilitate quick removal of air during vacuum encapsulation process, while also reducing visual defects due to air bubbles trapped in encapsulant. Product is less...

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Potting and Encapsulating Compound has water clear formulation.
Encapsulants

Potting and Encapsulating Compound has water clear formulation.

Type 20-2621 Polyurethane is crystal clear electronic grade potting and encapsulating compound that will not yellow in outdoor applications. Formulated for applications that require electrical insulation, optimum clarity, environmental resistance, and flexibility, this polyurethane system is semi-flexible (shore A85) and will not place excess stress on electronic components during thermal cycling.

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Encapsulants

Thing-Gauge Encapsulant suits photovoltaic applications.

Designed for use by solar module manufacturers, Saflex® PA41 thin gauge polyvinyl butyral (PVB)-based encapsulant has undergone IEC and UL testing as well as natural and accelerated weathering tests. Properties promote encapsulating flow around bus bars and other critical components. With encapsulant thickness reduced to 0.76 mm, formulation helps minimize encapsulant usage while...

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Encapsulants

Momentive to Showcase New Electronics Materials at Material Japan 2010

ALBANY, N.Y., January 19, 2010 - Momentive Performance Materials will be exhibiting a range of new advanced materials for use in microelectronics applications at Material Japan 2010, taking place at Tokyo Big Sight on January 20, 2010. At Booth East 26-24, experts from Momentive will feature a number of its latest technologies for the semiconductor, LED and flat panel display (FPD) industries,...

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Clear Epoxy Encapsulant has pourable formulation.
Encapsulants

Clear Epoxy Encapsulant has pourable formulation.

Bio Clear 810(TM) is solvent free, clear epoxy used for object encapsulation (marine, electronic, and gift industries) as well as poured-on bar top and table top applications. Features include low exotherm kick, slow UV epoxy yellowing, and low viscosity, making it suited for poured applications between 1/4 and one inch thick. Bio Clear 810 has a 2:1 mix ratio.

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Potting Compound features 6 hr working life.
Encapsulation Equipment

Potting Compound features 6 hr working life.

Qualified for filament winding applications, EP29LP-1 exhibits physical strength that enhances component resistance to thermal shock. It adheres to various substrates, including optical fibers and fibrous reinforcements, and has bond strength of greater than 3,500 psi. With peak exotherm as low as 50°C, this 2-part, optically clear epoxy is resistant to chemicals and offers compound flow,...

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Encapsulants

Carus Remediation Technologies Acquires New Product Technology

Carus Corporation is pleased to announce the signing of a licensing agreement with Specialty Earth Sciences (SES) of New Albany, Indiana, for a new encapsulation technology for potassium permanganate and other solids. According to Inga Carus, CEO of Carus Corporation, this patented technology will help us provide our customers with new application options for RemOx® S ISCO Reagent and other...

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Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Miscellaneous Compounds

Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components

HACKENSACK, NJ - Sept 10, 2009 - Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various...

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One-Part Silicones cure rapidly when exposed to UV/Vis light.
Encapsulants

One-Part Silicones cure rapidly when exposed to UV/Vis light.

Comprised of 7 products, Loctite® Light Cure Silicones offer cure depths up to 2 in. and cure fully in seconds when exposed to high-powered UV or visible light. Solvent-free adhesives/sealants deliver elastic seal with optimized degradation resistance. Able to bond with silicone, plastic, and metal substrates, they exhibit weather, temperature, and moisture resistance. Uses include general...

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Solder Redefined
Sponsored

Solder Redefined

Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.

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