Retention Mechanism protects graphics card.
Board-level retention mechanism for PCI Express graphics cards protects against electrical interrupts and mechanical damage caused by system-level shocks and vibration. Flexible arm extends away from slot and includes molded post that snaps into notch on bottom of add-in card. Device solders to motherboard adjacent to x16 PCI Express card edge connector, and engages with hockey stick shaped hook...
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Retention Mechanism protects graphics card.
Board-level retention mechanism for PCI Express graphics cards protects against electrical interrupts and mechanical damage caused by system-level shocks and vibration. Flexible arm extends away from slot and includes molded post that snaps into notch on bottom of add-in card. Device solders to motherboard adjacent to x16 PCI Express card edge connector, and engages with hockey stick shaped hook...
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SMT Socket offers current rating of 7 A.
Able to accommodate power or signal connection, SMT Bottom Entry, Through Board Socket is suited for high density applications and demanding environments. Mating pin sizes include 0.025 in. square and 0.027-0.032 in. diameter round pins. Material is 0.0005 in. thick beryllium copper with bright tin finish over copper. Socket is available in tape and reel in standard tape pocket format, allowing...
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SMT Socket offers current rating of 7 A.
Able to accommodate power or signal connection, SMT Bottom Entry, Through Board Socket is suited for high density applications and demanding environments. Mating pin sizes include 0.025 in. square and 0.027-0.032 in. diameter round pins. Material is 0.0005 in. thick beryllium copper with bright tin finish over copper. Socket is available in tape and reel in standard tape pocket format, allowing...
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Advantages of VPSA Technology for Your Application
VPSA technology uses different equipment than PSA and requires significantly less energy, resulting in an average cost savings of one-third to one-half in comparison to PSA systems.
Read More »Sockets accommodate BGA, LGA, and CSP devices to 27 mm².
Molded from high-temperature thermoplastic, 1.00 mm pitch BGA Sockets in precision molded wafers exhibit coplanarity within .006 in. and feature screw-machined terminals with multifinger contacts and gold plating. Full grid wafers are pin loaded to any footprint specific pattern up to 26 x 26 rows. Surface mount sockets utilize eutectic solder ball terminals, and thru-hole models are available...
Read More »Sockets accommodate BGA, LGA, and CSP devices to 27 mm-².
Molded from high-temperature thermoplastic, 1.00 mm pitch BGA Sockets in precision molded wafers exhibit coplanarity within .006 in. and feature screw-machined terminals with multifinger contacts and gold plating. Full grid wafers are pin loaded to any footprint specific pattern up to 26 x 26 rows. Surface mount sockets utilize eutectic solder ball terminals, and thru-hole models are available...
Read More »Test Socket tests devices from 14 to 27 mm² wide.
Frenchtown, NJ, October 2003 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a new high frequency test socket for devices from 14 to 27 mm² wide. The new socket is ideal for manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 10 GHz, such as CSP, MicroBGA, MLF, QFN, DSP,...
Read More »Test Socket tests devices from 14 to 27 mm-² wide.
Frenchtown, NJ, October 2003 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a new high frequency test socket for devices from 14 to 27 mm-² wide. The new socket is ideal for manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 10 GHz, such as CSP, MicroBGA, MLF, QFN, DSP,...
Read More »Test and Burn-In Socket suits applications under 1 GHz.
Frenchtown, NJ, September 2003 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has released a new CSP/MicroBGA test and burn-in socket for devices from 14 to 27 mm², in applications under 1 GHz. The new pressure-mounted socket requires no soldering and is ideal for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash...
Read More »Test and Burn-In Socket suits applications under 1 GHz.
Frenchtown, NJ, September 2003 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has released a new CSP/MicroBGA test and burn-in socket for devices from 14 to 27 mm-², in applications under 1 GHz. The new pressure-mounted socket requires no soldering and is ideal for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash...
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Custom Fabrication & Machining Services with Over 30 Years of Experience
As a trusted manufacturer to customers across a broad range of industries, Key Gas Components is a premier provider of CNC machining and tube fabrication. Our entire organization is quality driven and customer-centric, with broad-based manufacturing capabilities that can accommodate the most challenging requirements. See our video to learn more.
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