Clamshell Burn-In Socket accommodates QFN packages.
Antares Releases Its New 880 Series Under Deal With Gryphics, Inc. -- a Wholly Owned Subsidiary of Cascade Microtech, Inc. VANCOUVER, Wash., Oct. 30, 2007 -- The world's largest supplier of semiconductor test sockets, Antares Advanced Test Technologies, has released a new clamshell burn-in socket that accommodates standard QFN packages down to 0.35mm pitch -- the 880 Series -- in response to...
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Clamshell Burn-In Socket accommodates QFN packages.
Antares Releases Its New 880 Series Under Deal With Gryphics, Inc. -- a Wholly Owned Subsidiary of Cascade Microtech, Inc. VANCOUVER, Wash., Oct. 30, 2007 -- The world's largest supplier of semiconductor test sockets, Antares Advanced Test Technologies, has released a new clamshell burn-in socket that accommodates standard QFN packages down to 0.35mm pitch -- the 880 Series -- in response to...
Read More »ZIF Socket is suited for 0.4 mm pitch BGA.
ZIF Socket your 0.4mm pitch Shinko BGA package without significant performance loss BURNSVILLE, MN - September, 2007 - Ironwood Electronics has recently introduced the new high performance BGA ZIF socket for 0.4mm pitch BGA. The SG-BGA-7096 socket is designed for a Shinko 12mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to...
Read More »ZIF Socket is suited for 0.4 mm pitch BGA.
ZIF Socket your 0.4mm pitch Shinko BGA package without significant performance loss BURNSVILLE, MN - September, 2007 - Ironwood Electronics has recently introduced the new high performance BGA ZIF socket for 0.4mm pitch BGA. The SG-BGA-7096 socket is designed for a Shinko 12mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to...
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Socket accommodates 0.4 mm pitch BGA ICs.
Socket your TI 0.4mm pitch TI ZXN (S-PBGA-N209) BGA packages without significant performance loss BURNSVILLE, MN- July, 2007 - Ironwood Electronics has recently introduced the new high performance BGA socket for 0.4mm pitch BGA. The SG-BGA-7070 socket is designed for a 7mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate...
Read More »Socket accommodates 0.4 mm pitch BGA ICs.
Socket your TI 0.4mm pitch TI ZXN (S-PBGA-N209) BGA packages without significant performance loss BURNSVILLE, MN- July, 2007 - Ironwood Electronics has recently introduced the new high performance BGA socket for 0.4mm pitch BGA. The SG-BGA-7070 socket is designed for a 7mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate...
Read More »Strip-Line and Collet Sockets comply with RoHS standard.
Featuring bifurcated contacts, Series 0501 and 700 strip-line sockets are designed for mounting LCDs and other high-pin count or off-centered components. Optional spacer is available, enabling both series to be mounted on 0.300, 0.600, 0.900, 1.100, and 1.300 in. centers. Also available, Series 0518 collet sockets can be cut to specific number of pins desired to fit application. Adaptable...
Read More »Strip-Line and Collet Sockets comply with RoHS standard.
Featuring bifurcated contacts, Series 0501 and 700 strip-line sockets are designed for mounting LCDs and other high-pin count or off-centered components. Optional spacer is available, enabling both series to be mounted on 0.300, 0.600, 0.900, 1.100, and 1.300 in. centers. Also available, Series 0518 collet sockets can be cut to specific number of pins desired to fit application. Adaptable...
Read More »Socket is designed for 1.0 mm pitch BGA packages.
Able to dissipate up to several watts without extra heat sinking, SG-BGA-8000 socket is designed for 31 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It handles up to 100 W with custom heat sink and offers typ contact resistance of 23 mW per pin. Applicable for BGA pitches from 0.8-1.27 mm, socket connects all pins and optional center power pad and...
Read More »Socket is designed for 1.0 mm pitch BGA packages.
Able to dissipate up to several watts without extra heat sinking, SG-BGA-8000 socket is designed for 31 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It handles up to 100 W with custom heat sink and offers typ contact resistance of 23 mW per pin. Applicable for BGA pitches from 0.8-1.27 mm, socket connects all pins and optional center power pad and...
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Sentry Equipment Introduces New Compact Hygienic Automatic Sampler
As a leader in industrial sampling equipment at Sentry Equipment, our success is built on a history of innovation and designs that epitomize value and efficiency. The new Hygienic Automatic Sampler is another example of our dedication to developing quality engineered products. To learn how this product can streamline the sampling process for dry, free-flowing materials, see our new video.
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