BGA Socket accommodates devices up to 6.5 mm².
Bristol, Pa - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has just released its new CSP/MicroBGA test and burn-in socket that accommodates devices of up to 6.5 mm squared and is ideal for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices. The socket offers solderless pressure mount compression...
Read More »BGA Socket accommodates devices up to 6.5 mm-².
Bristol, Pa - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has just released its new CSP/MicroBGA test and burn-in socket that accommodates devices of up to 6.5 mm squared and is ideal for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices. The socket offers solderless pressure mount compression...
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BGA Socket features 0.028 pF capacitance to ground.
Ironwood Electronics has recently introduced the new high performance socket for processor with a POP memory socketed on top. The SG-BGA-7116 sockets is made for socketing a 0.4mm BGA IC, 12X12mm Body with 28X28 ball array to the target PCB and then in addition socket a POP memory on top with 12x12mm, 0.5mm pitch, 23x23 array) and Samsung 12x12mm 168 ball fine pitch ball grid array package. The...
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BGA Socket features 0.028 pF capacitance to ground.
Ironwood Electronics has recently introduced the new high performance socket for processor with a POP memory socketed on top. The SG-BGA-7116 sockets is made for socketing a 0.4mm BGA IC, 12X12mm Body with 28X28 ball array to the target PCB and then in addition socket a POP memory on top with 12x12mm, 0.5mm pitch, 23x23 array) and Samsung 12x12mm 168 ball fine pitch ball grid array package. The...
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A Complete Guide to Fabricating Custom Components
This white paper provides an in-depth guide to fabricating custom components.
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BGA Sockets are developed for 0.8 mm pitch SDRAM.
Socket your SDRAM without significant performance loss and with minimal increase in PC Board footprint BURNSVILLE, MN - May, 2008 - Ironwood Electronics has recently introduced the new high performance BGA socket for 0.8mm pitch SDRAM. The SG-BGA-6252 socket is designed for a 9mmx11mm, 0.8mm pitch 60 pin BGA package and SG-BGA-6253 socket is designed for a 9mmx13mm, 0.8mm pitch 84 pin BGA...
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BGA Sockets are developed for 0.8 mm pitch SDRAM.
Socket your SDRAM without significant performance loss and with minimal increase in PC Board footprint BURNSVILLE, MN - May, 2008 - Ironwood Electronics has recently introduced the new high performance BGA socket for 0.8mm pitch SDRAM. The SG-BGA-6252 socket is designed for a 9mmx11mm, 0.8mm pitch 60 pin BGA package and SG-BGA-6253 socket is designed for a 9mmx13mm, 0.8mm pitch 84 pin BGA...
Read More »LED Socket supports solid-state lighting.
Minimizing component count, LED Sockets permit automated high-speed pick-and-placement of LEDs and resistors. Units include heat sink and can connect with standard Edison-base, GU 24-base, or custom interfaces. Compatible with reflow solder, sockets run directly from 110 V, eliminating need for driver, transformer, or inductor.
Read More »LED Socket supports solid-state lighting.
Minimizing component count, LED Sockets permit automated high-speed pick-and-placement of LEDs and resistors. Units include heat sink and can connect with standard Edison-base, GU 24-base, or custom interfaces. Compatible with reflow solder, sockets run directly from 110 V, eliminating need for driver, transformer, or inductor.
Read More »High-Bandwidth Socket accommodates 0.65 mm pitch LGA ICs.
Designed for 12 mm package size, XG-LGA-7000 Socket operates at bandwidths to 40 GHz with less than 1 dB of insertion loss. It dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed using elastomer with gold-plated, barbed pad connecting to IC Pad, socket offers characteristics such as 50 mW per pin (typ) contact resistance, 0.11 nH...
Read More »High-Bandwidth Socket accommodates 0.65 mm pitch LGA ICs.
Designed for 12 mm package size, XG-LGA-7000 Socket operates at bandwidths to 40 GHz with less than 1 dB of insertion loss. It dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed using elastomer with gold-plated, barbed pad connecting to IC Pad, socket offers characteristics such as 50 mW per pin (typ) contact resistance, 0.11 nH...
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Optimize Your Workforce with Weavix™ by PK Industrial
The Weavix™ platform takes productivity, quality, and visibility to a new level by providing better communication and real-time KPIs. Check out the video to learn more!
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