Electronic Sockets

Electronic Sockets

QFN Sockets are suited for 0.5 mm pitch BGA 256 pin IC's.

Socket your 256 pin BGA packages without significant performance loss and with minimal increase in PC Board footprint BURNSVILLE, MN - October, 2008 - Ironwood Electronics has recently introduced a new high performance QFN socket for 0.5mm pitch BGA 256 pin IC's. The SG-BGA-7121, SG-BGA-7122 sockets are designed for an 8X8 mm package size and operates at bandwidths up to 10 GHz with less than 1dB...

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Electronic Sockets

QFN Sockets are suited for 0.5 mm pitch BGA 256 pin IC's.

Socket your 256 pin BGA packages without significant performance loss and with minimal increase in PC Board footprint BURNSVILLE, MN - October, 2008 - Ironwood Electronics has recently introduced a new high performance QFN socket for 0.5mm pitch BGA 256 pin IC's. The SG-BGA-7121, SG-BGA-7122 sockets are designed for an 8X8 mm package size and operates at bandwidths up to 10 GHz with less than 1dB...

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Test Socket Contact features self-cleaning design.
Electronic Sockets

Test Socket Contact features self-cleaning design.

Suited for testing QFNs, MLFs, and other leadless devices, Synergetix Dyno Contact(TM) features monolithic design, which scrubs across surface of device lead, penetrating contaminants through hundreds of thousands of insertions. Unit is plated with Endura Plating process, which offers resistance to intermetallic contamination. Contact provides 500,000 mechanical life cycles and contact resistance...

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Test Socket Contact features self-cleaning design.
Electronic Sockets

Test Socket Contact features self-cleaning design.

Suited for testing QFNs, MLFs, and other leadless devices, Synergetix Dyno Contact(TM) features monolithic design, which scrubs across surface of device lead, penetrating contaminants through hundreds of thousands of insertions. Unit is plated with Endura Plating process, which offers resistance to intermetallic contamination. Contact provides 500,000 mechanical life cycles and contact resistance...

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Interposers suit wafer-level chip scale package testing.
Electronic Sockets

Interposers suit wafer-level chip scale package testing.

Consisting of plastic assembly containing semiconductor probe technology, Synergetix Test Socket Interposers facilitate testing of WLCSPs in vertical probing applications. Extremely linear compression against wafer helps maximize mechanical life. Suited for high-current applications, interposers feature average cleaning cycle of every 50,000 touchdowns, and contact replacement is rarely necessary...

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Interposers suit wafer-level chip scale package testing.
Electronic Sockets

Interposers suit wafer-level chip scale package testing.

Consisting of plastic assembly containing semiconductor probe technology, Synergetix Test Socket Interposers facilitate testing of WLCSPs in vertical probing applications. Extremely linear compression against wafer helps maximize mechanical life. Suited for high-current applications, interposers feature average cleaning cycle of every 50,000 touchdowns, and contact replacement is rarely necessary...

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Electronic Sockets

Center Probe Test Socket facilitates device burn-in.

Accommodating devicea 6.5 mm or smaller, high-frequency center probe test socket is suited for use with test and dynamic burn-in of CSP/MicroBGA/DSP/LGA/SRAM/DRAM/Flash devices. Socket is comprised of compression spring probes made of heat-treated beryllium-copper alloy plated with 0.75 -µm gold per Mil-G-45204 over 0.75 µm nickel per SAE-AMS-QQ-N-290. Spring probes feature contact forces of...

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Electronic Sockets

Center Probe Test Socket facilitates device burn-in.

Accommodating devicea 6.5 mm or smaller, high-frequency center probe test socket is suited for use with test and dynamic burn-in of CSP/MicroBGA/DSP/LGA/SRAM/DRAM/Flash devices. Socket is comprised of compression spring probes made of heat-treated beryllium-copper alloy plated with 0.75 Â-µm gold per Mil-G-45204 over 0.75 µm nickel per SAE-AMS-QQ-N-290. Spring probes feature contact...

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Electronic Sockets

QFN Socket operates at bandwidths up to 40 GHz.

Ironwood Electronics has recently introduced a new high performance QFN socket for 0.5mm pitch QFN 24 pin IC's. The DG-QFN24C-01 socket is designed for a 4X4mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The...

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Electronic Sockets

QFN Socket operates at bandwidths up to 40 GHz.

Ironwood Electronics has recently introduced a new high performance QFN socket for 0.5mm pitch QFN 24 pin IC's. The DG-QFN24C-01 socket is designed for a 4X4mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The...

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