
QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.
10 GHz Epoxy Mount Socket for 0.5mm Pitch QFN Packages Socket your 64 pin QFN packages on any PCB without significant performance loss and with no soldering and no mounting hardware or screws BURNSVILLE, MN - February, 2009 - Ironwood Electronics has recently introduced a new high performance QFN socket for 0.5mm pitch QFN 64 pin IC's. The SG-MLF-7028 socket is designed for an 9X9X1.6 mm package...
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QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.
10 GHz Epoxy Mount Socket for 0.5mm Pitch QFN Packages Socket your 64 pin QFN packages on any PCB without significant performance loss and with no soldering and no mounting hardware or screws BURNSVILLE, MN - February, 2009 - Ironwood Electronics has recently introduced a new high performance QFN socket for 0.5mm pitch QFN 64 pin IC's. The SG-MLF-7028 socket is designed for an 9X9X1.6 mm package...
Read More »BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.
Socket your 676 pin BGA packages without significant performance loss and with minimal increase in PC Board footprint BURNSVILLE, MN - January, 2009 - Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch BGA 676 pin IC's. The CG-BGA-4002 socket is designed for an 27X27 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion...
Read More »BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.
Socket your 676 pin BGA packages without significant performance loss and with minimal increase in PC Board footprint BURNSVILLE, MN - January, 2009 - Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch BGA 676 pin IC's. The CG-BGA-4002 socket is designed for an 27X27 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion...
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Introduction to Optical Replication
To learn more about the optical replication process, and how to avoid complications, download this white paper now.
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Transistor Sockets facilitate field insertion and removal.
Inside each Series 917 TO-5 and TO-100 transistor socket are precision-machined, brass alloy receptacles assembled with Mill-Max, 4-finger No. 30 contact. Featuring pin diameter acceptance range of .015-.025 in. and current rating of 3 A per position, No. 30 contact provides hi-rel mechanical and electrical connection to mated transistor lead. Both through-hole and SMT transistor sockets utilize...
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Transistor Sockets facilitate field insertion and removal.
Inside each Series 917 TO-5 and TO-100 transistor socket are precision-machined, brass alloy receptacles assembled with Mill-Max, 4-finger No. 30 contact. Featuring pin diameter acceptance range of .015-.025 in. and current rating of 3 A per position, No. 30 contact provides hi-rel mechanical and electrical connection to mated transistor lead. Both through-hole and SMT transistor sockets utilize...
Read More »Hybrid Socket provides test or burn-in down to 0.30 mm pitch.
Bristol, Pa. January 2009 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new patented CSP/BallNest Hybrid Socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices. The socket, which features a lid that nests each ball...
Read More »Hybrid Socket provides test or burn-in down to 0.30 mm pitch.
Bristol, Pa. January 2009 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new patented CSP/BallNest Hybrid Socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices. The socket, which features a lid that nests each ball...
Read More »Burn-in Sockets are designed for devices up to 6.5 mm2.
November 7, 2008 Bristol, Pa. - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers its high frequency Center Probe and CSP/MicroBGA test and burn-in sockets in sizes up to 6.5 mm2 with pitches down to 0.3 mm. The reduced socket pitch meets the growing need to test smaller components while increasing reliability. The...
Read More »Burn-in Sockets are designed for devices up to 6.5 mm2.
November 7, 2008 Bristol, Pa. - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers its high frequency Center Probe and CSP/MicroBGA test and burn-in sockets in sizes up to 6.5 mm2 with pitches down to 0.3 mm. The reduced socket pitch meets the growing need to test smaller components while increasing reliability. The...
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DoorKing Releases Advanced Long Range Card Reader System with Frequency Hopping Technology
The DoorKing DKS AVI system is at the cutting edge of automotive security technology and represents a leap forward in engineering innovation. When it comes to long-range passive card readers, we lead the industry and set the standard for quality and performance. To find out why the DoorKing DKS AVI system is taking the automotive security industry by storm, see our video.
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