Electronic Sockets

Retention Mechanism protects graphics card.
Electronic Sockets

Retention Mechanism protects graphics card.

Board-level retention mechanism for PCI Express graphics cards protects against electrical interrupts and mechanical damage caused by system-level shocks and vibration. Flexible arm extends away from slot and includes molded post that snaps into notch on bottom of add-in card. Device solders to motherboard adjacent to x16 PCI Express card edge connector, and engages with hockey stick shaped hook...

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SMT Socket offers current rating of 7 A.
Electronic Sockets

SMT Socket offers current rating of 7 A.

Able to accommodate power or signal connection, SMT Bottom Entry, Through Board Socket is suited for high density applications and demanding environments. Mating pin sizes include 0.025 in. square and 0.027-0.032 in. diameter round pins. Material is 0.0005 in. thick beryllium copper with bright tin finish over copper. Socket is available in tape and reel in standard tape pocket format, allowing...

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Electronic Sockets

Sockets accommodate BGA, LGA, and CSP devices to 27 mm².

Molded from high-temperature thermoplastic, 1.00 mm pitch BGA Sockets in precision molded wafers exhibit coplanarity within .006 in. and feature screw-machined terminals with multifinger contacts and gold plating. Full grid wafers are pin loaded to any footprint specific pattern up to 26 x 26 rows. Surface mount sockets utilize eutectic solder ball terminals, and thru-hole models are available...

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Electronic Sockets

Test Socket tests devices from 14 to 27 mm² wide.

RF Center Probe Test Socket provides manual testing of devices with pitches down to 0.50 mm in applications with speeds from 1-10 GHz. Four-point spring probe crown ensures scrub on solder ball oxides. With signal path of .077 in., socket provides minimal signal loss. Solderless, pressure-mount, compression spring probes are accurately located by 2 molded plastic alignment pins and secured with 4...

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Electronic Sockets

Test and Burn-In Socket suits applications under 1 GHz.

Designed for use with devices from 14-27 mmÂ-², CSP/MicroBGA pressure-mounted socket requires no soldering and incorporates spring probe contacts, integral plastic alignment posts, and 4-point crown that ensures scrub on solder oxides. Signal path during test is 0.077 in. and operating temperature is -67 to +302°F. Based on device with 0.50 mm pitch, pin inductance is 0.75 nH Max,...

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Electronic Sockets

Center Probe Test Socket suits devices to 13 mm².

RF test socket incorporates solderless, pressure-mount compression spring probes located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Suited for devices with pitches of 0.50 mm and higher in applications with speeds from 1-10+ GHz, signal path during test is .077 in. Center probe contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per...

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Low-Profile Socket simplifies board assembly.
Electronic Sockets

Low-Profile Socket simplifies board assembly.

Low-profile socket facilitates high-density, side-by-side panel or PCB mounting of IS Series SMARTSWITCH(TM) LCD pushbuttons. SMARTSWITCH(TM) pushbuttons feature high-visibility LCD that can be programmed to display graphics and alphanumeric characters. They can also display animation sequences that prompt operators through series of error-free actuations. Backlighting can be programmed to flash,...

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Electronic Sockets

Center Probe Test Socket has floating guide plate.

Machined from Torlon 4203 or 5530, RF center probe socket features floating guide plate with built-in hard stop. Product can be used for packages with 0.50 mm pitch or higher for devices up to 55 mm wide in applications with speeds from 1-10+ GHz. Decoupling pockets can be placed within 1.0 mm of product's solderless, pressure-mount, compression spring probes. Contacts have cycle life of over...

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Electronic Sockets

Test/Burn-In Socket accommodates devices up to 13 mm².

Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact...

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Electronic Sockets

BGA Socket is side stackable to increase packaging density.

Offered in 2- and 4-bolt hold-down styles, Pin-Ball Socket may be soldered side-by-side, directly to existing footprint of PC board. Surface-mount BGA and LGA socket provides 2 mm clearance for end components. It can be used for 1.00 mm and 1.27 mm pitch packages up to 50 mm in any footprint, on any size board. Socket incorporates spring-probe technology with spring force of 17 g at .025 in....

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Simple Connection MGB with EtherNet/IP

The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.

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