Electronic Sockets

Test Socket suits devices from 28 to 40 mm².
Electronic Sockets

Test Socket suits devices from 28 to 40 mm².

Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25...

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Micro Card Interfaces require minimal board area.
Electronic Sockets

Micro Card Interfaces require minimal board area.

Surface-mount, 0.025 in. pitch MEC6 Series features double row of phosphor bronze contacts to mate with standard double-sided .062 in. thick cards. Designed with vertical orientation, 7 sizes offer 10, 20, 30, 40, and 50 I/Os per side non-polarized and 50, 60, and 70 I/Os per side with keying feature to assure proper card insertion. Five right-angle styles are available with 10-40 I/Os...

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IC Sockets support dense pitch QFP devices.
Electronic Sockets

IC Sockets support dense pitch QFP devices.

With 10 GHz bandwidth, Model SG-QFE-7000 accommodates 128-pin, 14 mm, 0.4 mm pitch TI Power Pad ICs without performance loss. Unit dissipates up to several watts without extra heatsinking and can handle up to 100 W with custom heatsink. Contact resistance is typically 23 mW per pin. Constructed with low inductance elastomer, sockets feature temperature range of -35 to +85°C, pin inductance...

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Spline Sockets are made from aircraft quality steel.
Electronic Sockets

Spline Sockets are made from aircraft quality steel.

Suitable for use on spline fasteners and 4, 6, and 12 point fasteners, spline sockets line includes 55 SKUs, in Â-¼, 3/8, ½, ¾, and 1 in. drive models. Geometric profile of socket's 12 teeth offers large contact area between tool and spline fastener that allows user to apply more torque without damaging tool or fastener head. Sockets loosen partially rounded hex fasteners and...

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Electronic Sockets

Piper Plastics Manufactures Microprocessor Test Sockets Using a Ceramic-Filled Victrex® Peek® Polymer

Greenville, SC (July 18, 2006) The Semiconductor industry's demand for smaller, tight tolerance IC packages that operate at higher frequencies is making it increasingly difficult for traditional materials previously used for test socket applications. New, high performance test socket components made from a ceramic-filled VICTREX® PEEK polymer are available from Piper Plastics Inc., a...

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Memory Sockets accept 16-bit/32-bit SO-DIMM assemblies.
Electronic Sockets

Memory Sockets accept 16-bit/32-bit SO-DIMM assemblies.

Suited for communications equipment and peripheral devices, 144-position, 0.8 mm pitch Series 10062086 measures 5.2 mm tall and provides 3.3 mm separation between top surface of host board and installed module. Horizontal sockets employ mechanical voltage keying to differentiate between versions that accept 2.5 V DDR or 1.8 V DDR2 memory module assemblies. Compliant with JEDEC-defined 16b/32b...

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Memory Sockets accept very low profile DDR2 memory modules.
Electronic Sockets

Memory Sockets accept very low profile DDR2 memory modules.

Offered with through-mount leads for solder termination, 240-position Series 10052286 provides mechanical voltage keying and end latches that minimize overall profile. Nominal 18.3 mm VLP memory module installed in sockets achieves combined vertical height of less than 21.5 mm. Solder tail options support use on .062-.093 in. thick motherboards. Applications include blade servers, sub-1U routers,...

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BGA Socket suits 1.00 mm pitch devices.
Electronic Sockets

BGA Socket suits 1.00 mm pitch devices.

Designed for development, test, and validation of BGA and LGA devices at speeds up to 2.6 GHz, Flip-Top(TM) BGA Socket requires no soldering of IC and needs no external hold-downs or tooling holes in PCB board. It features single-ended insertion loss of -.060 dB at 2.6 GHz and differential insertion loss of -2.80 dB at 5.0 GHz. Available for thru-hole or surface mount applications, unit includes...

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Electronic Sockets

BGA Socket accommodates 1.0 mm pitch ICs.

Intended for 23 mm, 22X22 array ICs, 10 GHz Model SS-BGA324J-02-01 dissipates up to 7 W without extra heatsinking and can handle up to 60 W with custom heatsink. Contact resistance is typically 30 mOhm per ball. Constructed with spring pins rated at 500,000 actuations, socket operates from -40 to +150°C. Pin inductance is 1.3 nH and mutual inductance is 0.62 nH typically. Capacitance to...

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Processor Socket enables PCI Express® signaling.
Electronic Sockets

Processor Socket enables PCI Express® signaling.

Lead-free, 775-position Model LGA775 enables use of microprocessors that support PCI Express signaling in desktop PCs. Utilizing BGA technology for motherboard attachment and LGA interface to microprocessor, socket performs with less than 4 nH inductance and less than 1 pF capacitance pin-to-pin. Pickup cover facilitates placement using pick-and-place equipment, while BGA termination allows...

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