Electronic Sockets

Electronic Sockets

ZIF Socket is suited for 0.4 mm pitch BGA.

Accommodating 12 mm BGA body size IC packages with 28 x 28 array and 515 balls, Model SG-BGA-7096 can operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss, and can dissipate up to 100 W with custom heat sink. Socket requires only space on board for 2 mounting screw areas and 2.5 mm clearance around chip. Unit features typical contact resistance of 23 mW per pin, 10.15 nH pin...

Read More »
Electronic Sockets

Socket accommodates 0.4 mm pitch BGA ICs.

Designed for 7 mm package, Model SG-BGA-7070 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Unit dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Contact resistance is typically 23 mW per pin. Constructed with low inductance elastomer, SG-BGA-7070 features operating temperature of -35 to +85°C, pin...

Read More »
Electronic Sockets

Strip-Line and Collet Sockets comply with RoHS standard.

Featuring bifurcated contacts, Series 0501 and 700 strip-line sockets are designed for mounting LCDs and other high-pin count or off-centered components. Optional spacer is available, enabling both series to be mounted on 0.300, 0.600, 0.900, 1.100, and 1.300 in. centers. Also available, Series 0518 collet sockets can be cut to specific number of pins desired to fit application. Adaptable...

Read More »
Electronic Sockets

Socket is designed for 1.0 mm pitch BGA packages.

Able to dissipate up to several watts without extra heat sinking, SG-BGA-8000 socket is designed for 31 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It handles up to 100 W with custom heat sink and offers typ contact resistance of 23 mW per pin. Applicable for BGA pitches from 0.8-1.27 mm, socket connects all pins and optional center power pad and...

Read More »
Electronic Sockets

RF Sockets suit devices with pitches as low as 0.40 mm.

High-frequency center probe test sockets can be mounted to, and removed from, test board because of 4-point, solderless, pressure-mount compression spring probes. Sockets are offered in device packages up to 13 mmÂ-², 14-27 mm², 28-40 mm², and 41-55 mm². With -55 to +150°C operating temperature range, products are used in applications such as CSP, MicroBGA, DSP,...

Read More »
Socket suits 1.0 mm pitch BGA chips.
Electronic Sockets

Socket suits 1.0 mm pitch BGA chips.

Intended for Renesas 256 PBGA and Cypress 256 FBGA, Model SS-BGA256E-01 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It is designed to dissipate up to 7 W without extra heat sinking and can handle up to 100 W with custom heat sink. Self inductance of contactor is typically 0.62 nH per pin. Featuring temperature range of -40 to +150°C, socket is constructed with...

Read More »
Electronic Sockets

Corsair 2GB DDR2-667 SODIMM Memory Modules Bring Performance Enhancement to Notebooks and Mini-PCs

- Designed for current and upcoming Vista-ready platforms, the new ValueSelect SODIMMs provide maximum memory bandwidth to accelerate end-user experience - FREMONT, Calif., Jan. 30 -- Corsair®, a worldwide leader in high performance computer products, today unveiled production-ready 2GB DDR2-667 (PC5300) ValueSelect(TM) SODIMMs. Designed for current generation notebooks and mini-PCs, the new...

Read More »
Sockets accommodate 84- and 92-pin BCC packages.
Electronic Sockets

Sockets accommodate 84- and 92-pin BCC packages.

Designed for 0.5 mm pitch devices, Models SG-MLF-7012 and SG-MLF-7014 operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss. They dissipate up to several Watts without extra heat sinking and can handle up to 100 W with custom heat sink. Operating from -35 to +85°C, sockets feature pin inductance of 10.15 nH, contact resistance of 23 mW per pin, and capacitance to ground...

Read More »
Socket Adapters offer signal attenuation up to 3.5 GHz.
Electronic Sockets

Socket Adapters offer signal attenuation up to 3.5 GHz.

Available in 0.65 mm pitch BGA and LGA footprints, hybrid socket adapters utilize both male and female pins in interstitial pattern, and feature screw-machined terminals with multi-finger contacts in compact SMT socket. Units feature standard eutectic tin/lead solder balls or lead-free tin/silver/copper solder ball terminals for RoHS compliant applications. Alignment pins protect pin field and...

Read More »
Electronic Sockets

Aries Electronics Announces New Test and Burn-In Sockets That Accept Devices with Pitches as Low as 0.40mm

FRENCHTOWN, N.J., January 2007 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced that all sizes of its CSP/Micro BGA test and burn-in sockets can now be used with devices requiring pitches as low as 0.40mm and higher. These sockets can also be used for manual testing of DSP, LGA, SRAM, DRAM and flash devices. The...

Read More »

All Topics