Electronic Sockets

SMT LGA Socket accommodates Intel Core i7 and Xeon 5 CPUs.
Electronic Sockets

SMT LGA Socket accommodates Intel Core i7 and Xeon 5 CPUs.

Validated to Intel-® design guides, SMT LGA 2011 socket is designed for Intel® Core(TM) i7 and Xeon 5 CPUs. Contacts include solder balls for surface mounting onto PCB, and hex-ball array promotes housing strength while minimizing occupied space. Integrated lever mechanism generates Z-axis compression load, and bolster plate limits PCB bowing during compression. Product is available with...

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SMT LGA Socket accommodates Intel Core i7 and Xeon 5 CPUs.
Electronic Sockets

SMT LGA Socket accommodates Intel Core i7 and Xeon 5 CPUs.

Validated to Intel-® design guides, SMT LGA 2011 socket is designed for Intel® Core(TM) i7 and Xeon 5 CPUs. Contacts include solder balls for surface mounting onto PCB, and hex-ball array promotes housing strength while minimizing occupied space. Integrated lever mechanism generates Z-axis compression load, and bolster plate limits PCB bowing during compression. Product is available with...

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Electronic Sockets

Extreme Temperature Test Socket handles 4.5 x 4.5 mm QFN devices.

BURNSVILLE, MN - Ironwood Electronics recently introduced a new Etched spring pin socket addressing high performance requirements for testing ASE's 32 lead QFN - CBT-QFN-7008. The contactor is an etched spring pin with 34 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.95 nH, insertion loss < 1 dB at 7 GHz and capacitance 0.097pF. The...

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Electronic Sockets

Extreme Temperature Test Socket handles 4.5 x 4.5 mm QFN devices.

BURNSVILLE, MN - Ironwood Electronics recently introduced a new Etched spring pin socket addressing high performance requirements for testing ASE's 32 lead QFN - CBT-QFN-7008. The contactor is an etched spring pin with 34 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.95 nH, insertion loss < 1 dB at 7 GHz and capacitance 0.097pF. The...

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Shrink DIP .070 in. Pitch Strips come in right-angle options.
Electronic Sockets

Shrink DIP .070 in. Pitch Strips come in right-angle options.

Single-row, right-angle sockets and headers can be combined with vertical .070 in. pitch connectors for various interconnect configurations. Right-angle header and socket pair suit board edge daisy chain applications or mix-and-match with vertical sockets and headers for perpendicular mating of boards. With 871 series, sockets accept device leads as well as mate with 870 header series. Sockets...

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Shrink DIP .070 in. Pitch Strips come in right-angle options.
Electronic Sockets

Shrink DIP .070 in. Pitch Strips come in right-angle options.

Single-row, right-angle sockets and headers can be combined with vertical .070 in. pitch connectors for various interconnect configurations. Right-angle header and socket pair suit board edge daisy chain applications or mix-and-match with vertical sockets and headers for perpendicular mating of boards. With 871 series, sockets accept device leads as well as mate with 870 header series. Sockets...

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BGA IC Socket is designed for 27 x 27 mm package size.
Electronic Sockets

BGA IC Socket is designed for 27 x 27 mm package size.

Designed to socket 27 x 27 mm, 1 mm pitch, 616-pin BGA ICs on any PCB, SG-BGA-6346 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket dissipates 4.5 W with passive heat sinking and 40 W with active. Contact resistance is 20 mohms typ per pin, and mounting to target PCB is accomplished without any soldering. Socket is constructed with shoulder screw and swivel lid, which...

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BGA IC Socket is designed for 27 x 27 mm package size.
Electronic Sockets

BGA IC Socket is designed for 27 x 27 mm package size.

Designed to socket 27 x 27 mm, 1 mm pitch, 616-pin BGA ICs on any PCB, SG-BGA-6346 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket dissipates 4.5 W with passive heat sinking and 40 W with active. Contact resistance is 20 mohms typ per pin, and mounting to target PCB is accomplished without any soldering. Socket is constructed with shoulder screw and swivel lid, which...

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BGA Socket supports LTE femtocell SoCs.
Electronic Sockets

BGA Socket supports LTE femtocell SoCs.

Suited for hand test and temperature characterization as well as debugging in femtocell development, Model CBT-BGA-6015 has stamped spring pin contactor with 19 g actuation force per ball and cycle life of 500,000 insertions. Contactor features self inductance of 0.93 nH, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Specific configuration of package to...

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BGA Socket supports LTE femtocell SoCs.
Electronic Sockets

BGA Socket supports LTE femtocell SoCs.

Suited for hand test and temperature characterization as well as debugging in femtocell development, Model CBT-BGA-6015 has stamped spring pin contactor with 19 g actuation force per ball and cycle life of 500,000 insertions. Contactor features self inductance of 0.93 nH, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Specific configuration of package to...

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