Electronic Sockets

Electronic Sockets

BGA Socket accommodates devices up to 6.5 mm².

Suited for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices, CSP/MicroBGA Test and Burn-In Socket accommodates up to 500,000 cycles and operates from -67 to 302°F. It offers solderless pressure mount compression spring probes which allow sockets to be mounted to and removed from burn-in-board (BIB). Unit also features pressure pad compression spring that...

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BGA Socket features 0.028 pF capacitance to ground.
Electronic Sockets

BGA Socket features 0.028 pF capacitance to ground.

Designed for processor with POP memory socketed on top, Model SG-BGA-7116 operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. It features typical contact resistance of 100 mW per pin, 5 A per pin current capacity, -40 to +100°C temperature range, and self and mutual inductance of 0.11 and 0.028 nH, respectively. Unit is constructed with high performance and low...

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BGA Sockets are developed for 0.8 mm pitch SDRAM.
Electronic Sockets

BGA Sockets are developed for 0.8 mm pitch SDRAM.

Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, SG-BGA-6252 is designed for 9 x 11 mm, 0.8 mm pitch, 60 pin BGA package while SG-BGA-6253 is designed for 9 x 13 mm, 0.8 mm pitch, 84 pin BGA package. BGA sockets dissipate up to several watts without extra heat sinking and can dissipate greater amount with custom heat sink. They feature contact resistance of 25 mW per...

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Electronic Sockets

LED Socket supports solid-state lighting.

Minimizing component count, LED Sockets permit automated high-speed pick-and-placement of LEDs and resistors. Units include heat sink and can connect with standard Edison-base, GU 24-base, or custom interfaces. Compatible with reflow solder, sockets run directly from 110 V, eliminating need for driver, transformer, or inductor.

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How to Choose the Right Adhesive Tape for Your Application
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How to Choose the Right Adhesive Tape for Your Application

With a considerable number of adhesive materials, applications and methods, there are many options to consider when choosing an adhesive tape. As NADCO® is a leading manufacturer of custom tapes and labels; we took our years of experience to create this handy selection guide on choosing the right adhesive tape for your application.

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Electronic Sockets

High-Bandwidth Socket accommodates 0.65 mm pitch LGA ICs.

Designed for 12 mm package size, XG-LGA-7000 Socket operates at bandwidths to 40 GHz with less than 1 dB of insertion loss. It dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed using elastomer with gold-plated, barbed pad connecting to IC Pad, socket offers characteristics such as 50 mW per pin (typ) contact resistance, 0.11 nH...

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Electronic Sockets

Socket is designed for 0.5 mm pitch SOIC IC.

Available with 2 mounting options, Model SG-SOIC-3000 GHz Socket provides signal integrity, and requires about 2.5 mm extra space around chip than actual chip size. Compact ZIF socket features 0.5 or 0.75 mm signal path, -35 to 100°C operating temperature, elastomeric interconnect technology, less than 1 dB signal noise at 6.5 or 10 GHz, and contact resistance of 23 mW per lead. SOIC leads...

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Electronic Sockets

Test Socket is designed for devices up to 13 sq mm.

Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, high frequency center probe test socket is suited for manual, high-speed testing of devices such as CSP, mBGA, and Flash, with pitches as low as 0.40 mm. Measuring 1.200 x .840 x .440 in., it provides minimal signal loss for higher bandwidth ability via signal path of 0.077 in. Contact forces are 16 g per contact on 0.50 mm...

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Electronic Sockets

Center Probe Test Socket handles devices up to 13 mm².

Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, socket is suited for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.40 mm. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch. Measuring 1.200 x .840 x .440 in., unit...

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Electronic Sockets

QFN Socket accommodates 0.5 mm pitch devices.

Designed for 10 mm package size, Model SG-MLF-7025 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed with low-inductance elastomer, device features temperature range of -35 to +100°C, contact resistance of 23 mW per pin, pin inductance of...

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Electronic Sockets

ZIF Sockets are suited for 1.0 mm pitch BGA.

Designed for ST Micro 35 mm and 27 mm package sizes, Models SG-BGA-6245 and SG-BGA-6246 operate at bandwidths up to 8 GHz with less than 1 dB of insertion loss, dissipate up to 4.5 W at 40°C, can handle up to 100 W with heat sink, and have 23 mW/pin of contact resistance. Constructed with low inductance elastomer, they feature temperature range of -35 to +100°C, 10.15 nH pin...

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