Electronic Sockets

Test Sockets handle small and fragile devices.
Electronic Sockets

Test Sockets handle small and fragile devices.

Available with optional adjustable pressure pad, 27 mm CSP/MicroBGA Test and Burn-In Sockets enable 0.010 in. displacement per revolution of screw, suited for testing thin or ceramic chips without damage. Each pressure pad comes with user-adjustable washer stack in 0.001 and 0.010 in. increments that serves as hard stop to eliminate device over-compression. Contact forces are 15 g/contact on...

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BGA Socket is designed for 0.8 mm pitch BGA 289 pin ICs.
Electronic Sockets

BGA Socket is designed for 0.8 mm pitch BGA 289 pin ICs.

Suited for 15 x 15 mm package size, SG-BGA-6286 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Product can can handle up to 100 W with custom heat sink, and contact resistance is 20 mW/pin. Constructed with high performance and low inductance elastomer contactor, unit features operating temperature range between -40°C to +100°C, pin self inductance of 0.15...

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Socket holds 1,156-pin, 1 mm pitch BGA packages.
Electronic Sockets

Socket holds 1,156-pin, 1 mm pitch BGA packages.

Designed for 35 x 35 mm package size, SG-BGA-6230 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Sockets can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink, and connects all pins with 10 GHz bandwidth on all connections. Socket mounts to target PCB with no soldering and operates in temperatures from -40...

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Electronic Sockets

Socket is designed for use with SiliconDrive II USB Blade.

Vertical SBS Series SiliconBlade(TM) Socket offers USB Blade insertion and extraction while consuming less PCB space. It features high speed Edge Rate(TM) contact system, which is designed for impedance control with reduced broadside coupling. With 40-pin design, socket is capable of hosting array of interfaces offered by Blade, including USB, SD, MMC, SATA, and PCIe, and allows designer to...

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QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.
Electronic Sockets

QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.

Mountable on any existing PCB, SG-MLF-7028 is designed for 9 x 9 x 1.6 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It is designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Unit features temperature range of -40 to +100°C, pin self inductance of 0.11 nH and mutual inductance...

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Electronic Sockets

BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.

Suited for 27 x 27 mm package size, CG-BGA-4002 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. It can handle up to 100 W with custom heat sink, and has contact resistance of 20 mW/pin. Constructed with high performance and low inductance elastomer contactor, unit features temperature range of -40 to +100°C, pin self-inductance of 0.11 nH, mutual inductance...

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Transistor Sockets facilitate field insertion and removal.
Electronic Sockets

Transistor Sockets facilitate field insertion and removal.

Inside each Series 917 TO-5 and TO-100 transistor socket are precision-machined, brass alloy receptacles assembled with Mill-Max, 4-finger No. 30 contact. Featuring pin diameter acceptance range of .015-.025 in. and current rating of 3 A per position, No. 30 contact provides hi-rel mechanical and electrical connection to mated transistor lead. Both through-hole and SMT transistor sockets utilize...

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Electronic Sockets

Hybrid Socket provides test or burn-in down to 0.30 mm pitch.

CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact...

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Electronic Sockets

Burn-in Sockets are designed for devices up to 6.5 mm2.

Featuring 0.3 mm pitch, Center Probe and CSP/MicroBGA test and burn-in sockets include replaceable interposer sets and require minimal handler tooling for use in CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices for PCBs. Operating from -67 to +302°F, they also include solderless pressure mount compression spring probes, located by 2 molded plastic alignment pins and mounted with 2 SS...

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Electronic Sockets

QFN Sockets are suited for 0.5 mm pitch BGA 256 pin IC's.

Designed for 8 X 8 mm package size, SG-BGA-7121 and SG-BGA-7122 operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Sockets dissipate several Watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed with elastomer contactor, temperature range is -40°C to +100°C, pin self inductance is 0.11 nH, and mutual inductance is 0.028...

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