Electronic Sockets

BGA Socket is used for testing 0.50 mm pitch devices.
Electronic Sockets

BGA Socket is used for testing 0.50 mm pitch devices.

Designed for test, debug, and validation of 0.50 mm pitch BGA devices, Mod5 Series Flip-Top(TM) BGA Socket features compact, surface mount design and installs without tooling or mounting holes in target PCB. Precision machined metallic spring probes offer contact life of 200,000 cycles min, and provide high bandwidth with low insertion loss. Measuring 20 x 27 mm, modular socket accommodates BGA...

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Burn-In and Test Sockets feature clam-shell lid design.
Electronic Sockets

Burn-In and Test Sockets feature clam-shell lid design.

Suitable for most any package type, Burn-In and Test Sockets feature floating Z-axis pressure plate that allows for tolerances in package thickness. Sockets use flat pin technology for 0.4 mm, 0.5 mm, and larger pitch devices. Highest performance pin provides bandwidth up to 30 GHz at -1 db with current capacity of 3.0 A. Built with plastic and aluminum, machined semi-custom pogo pin sockets have...

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Solderless Socket aids LED integration with light fixture.
Electronic Sockets

Solderless Socket aids LED integration with light fixture.

Solderless LED Socket, Type CM, facilitates integration of Cree XLamp® MP-L(TM) multichip LED into light fixtures. Allowing ample optical clearance for 120° beam angle, socket has snap-on connect feature for LEDIL Tyra series reflectors, which offers directional optics in 18, 30, and 50° beam angles. Solderless solution minimizes assembly time while providing repeatable and...

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Board-to-Board Socket Adapter suits 352-pin, 1 mm pitch BGA.
Electronic Sockets

Board-to-Board Socket Adapter suits 352-pin, 1 mm pitch BGA.

Board-to-board socket adapter consists of SF-BGA352B-B-42 female socket module, which can be soldered to motherboard using standard soldering methods without warping, and SF-BGA352B-B-41 male pin module that solders to upgraded daughter board. Both modules are constructed with high-temperature FR-4 substrate and come with lead or lead-free solder ball types. Physical length from top connection...

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BGA Socket holds DDR3 LRDIMM memory buffer.
Electronic Sockets

BGA Socket holds DDR3 LRDIMM memory buffer.

Featuring typical contact resistance of 20 mW per I/O, SG-BGA-7181 is designed for 13.5 x 25.2 x 1.95 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It has pin self-inductance of 0.15 nH, mutual inductance of 0.025 nH, capacitance to ground of 0.01 pF, and current capacity of 2 A per pin. Targeting 0.65 mm pitch 588 pin BGA, device operates at -35...

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Hybrid Socket offers cycle life of 5,00,000 insertions.
Electronic Sockets

Hybrid Socket offers cycle life of 5,00,000 insertions.

Thermal and functional hybrid socket has operating temperature range between -55°C to +150°C. Contactor is spring pin with 27 g actuation force/ball and cycle life of 500,000 insertions. Self inductance of contactor is 1.1 nH with 50 W matched impedance, and current capacity of each contactor is 5 A. Specific configuration of package to be tested in SS-PGA27/602A-01 is Kyocera's...

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BGA Socket is designed for 0.8 mm pitch DDR2/DDR3 packages.
Electronic Sockets

BGA Socket is designed for 0.8 mm pitch DDR2/DDR3 packages.

Accommodating any of DDR2/DDR3 package sizes ranging from 7.5-15.5 mm, SG-BGA-6292 operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss and typical contact resistance of 20 mW per pin. Socket features replaceable IC guide for each package size and is mounted on target PCB with no soldering. Constructed with low inductance elastomer contactor, unit offers temperature range of...

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SMT Sockets support Intel® Core(TM) i7 989/988 mobile processors.
Electronic Sockets

SMT Sockets support Intel® Core(TM) i7 989/988 mobile processors.

Validated to Intel design guides for high-performance and extreme mobile products, surface mount rPGA sockets feature pin count patterns of 989 or 988 contact positions to ensure proper alignment of Intel Core i7 989 and 988 mobile processors. Contacts are arranged on symmetrical grid of 1.0 x 1.0 mm spacing, and sockets, each with screw-activated cam, are equipped with solder balls for direct...

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BGA Socket targets 0.8 mm pitch BGA 194 pin ICs.
Electronic Sockets

BGA Socket targets 0.8 mm pitch BGA 194 pin ICs.

Designed for 12 x 12 mm package size, CG-BGA-4010 socket operates at bandwidths up to 6.5 GHz with less than 1 dB of insertion loss. It features clamshell lid with integrated heat sinking mechanism and is mounted on PCB using supplied hardware, with no soldering. Contact resistance and current capacity per pin are 20 mW and 2 A, respectively, while pin self inductance is 0.11 nH and mutual...

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