Electronic Sockets

Electronic Sockets

High-Temperature BGA Socket has contactor with 500,000 cycle life.

Model CBT-BGA-6014 is suited for testing 13 x 13 mm BGA with 1 mm pitch and 144 pins. It features stamped spring pin contactor with 19 g actuation force/ball and inductance of 0.93 nH, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Current capacity of each contactor is 8 A at 80°C temperature rise, and socket temperature range is -55 to +180°C....

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Electronic Sockets

BGA Socket accommodates 0.4 mm pitch BG221.

Intended for 0.4 mm pitch 221 ball BGA, SG-BGA7162 socket is used to verify function of IC in development system with superior electrical performance. It operates at up to 10 GHz with less than 1 dB insertion loss and mounts on PCB without any soldering. All pins are connected with 10 GHz bandwidth on all connections, and contact resistance is 20 mW typ per I/O. Quick insertion method accelerates...

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Electronic Sockets

WLCSP Socket verifies IC function in development systems.

Operating at bandwidths up to 10 GHz with less than 1 dB insertion loss, SG-BGA-7203 allows testing of 2 different WLCSPs - 0.5 mm pitch, 40-ball WLCSP and 0.4 mm pitch, 30-ball - in one socket, side by side. Contact resistance is 20 mW typ per I/O, and socket connects all pins with 10 GHz bandwidth on all connections. Mounted without soldering on target PCB using supplied hardware, socket...

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Solderless LED Socket complies with UL-1977 specifications.
Electronic Sockets

Solderless LED Socket complies with UL-1977 specifications.

Designed for use with Philips Lumileds LUXEON(TM) S LED, Type LS Socket utilizes insulation displacement technology to facilitate termination of 24 AWG wires to socket. Plastic frame locator enables positioning of LED on heat sink, while integral stainless steel spring makes sure uniform and adequate normal force is applied to LED for optimum thermal performance. Designed to maximize optical...

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Electronic Sockets

IC Test Adapter supports 0.8 mm pitch, 96-position BGA ICs.

Model PA-BGA96C-Z-01 probing and prototyping adapter for testing clock driver ICs includes GHz BGA socket. It features pin self-inductance of 0.11 nH and mutual inductance of 0.028 nH, while capacitance to ground is 0.028 pF and current capacity is 2 A/pin. Operating over temperature range of -35 to +100°C, unit is mounted on PCB which interfaces BGA socket to 0.100 in. center pin grid array on...

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BGA Socket addresses burn-in characterization requirements.
Electronic Sockets

BGA Socket addresses burn-in characterization requirements.

Featuring floating guide for precise ball to pin alignment, Model CBT-BGA-6011 supports 9 x 12 mm, 1 mm pitch, 48-position, 9 x 11 ball array configuration. Contactor delivers 0.93 nH self inductance, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Current capacity for each contactor is 8 A at 80°C temperature rise. Operating from -55 to +180°C, socket...

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Electronic Sockets

Spring Pin BGA Socket tests digital camera processors.

Configured to test 13 x 13 mm, 0.65 mm pitch, 293 position, 19 x 19 ball array, CBT-BGA-7005 features contactor with stamped spring pin, 26 g actuation force per ball, and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. Designed with floating guide for precise ball to pin alignment, socket...

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Spring Pin Socket helps test power management devices.
Electronic Sockets

Spring Pin Socket helps test power management devices.

Model SSK-QFN-7000 includes contactor that is spring pin with offset plunger, which allows 2 spring pins to contact one device lead or pad. Featuring current capacity of 2.8 A at 80°C temperature rise, each contactor has self inductance of 0.97 nH, insertion loss of less than 1 dB at 11.2 GHz, and capacitance 0.58 pF. Kelvin spring pins have 28 g actuation force per ball and cycle life of...

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Electronic Sockets

Viking Modular Solutions(TM) Uses Patent-Pending Technology to Deliver High-Density DDR3 DRAM Modules

DDR3 Stacking Technology Enables 8GB VLP DIMM and 16GB LR-DIMM for Demanding Environments SAN JOSE, Calif.- Viking Modular Solutions(TM), a division of Sanmina-SCI Corporation (Nasdaq: SANM), and leading manufacturer of innovative DRAM modules and Solid State Drive (SSD) solutions, today announced its DDR3 8GB Very Low Profile (VLP) Registered DIMM is available for immediate qualification....

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BGA Package Converter speeds system board development.
Electronic Sockets

BGA Package Converter speeds system board development.

Model PC-BGA256B/BGA256E-B-01 is designed to receive 23 x 23 mm BGA, 16 x 16 array, 1.27 mm pitch on top and converts 1:1 pin mapping to 17 x 17 mm BGA, 16 x 16 array, 1 mm pitch on bottom, allowing new development system board to be tested with previous version of BGA device. Convertor can also be reversed by removing solder balls from 1 mm pitch side and adding them on 1.27 mm pitch side, and...

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