Anritsu VectorStar Part of Technical Workshop Conducted by DuPont Circuit & Packaging Materials and Rogers Corporation at DesignCon 2014
Technical Program to Help Engineers Gain Better Understanding of Measurements to Determine Properties of Low-loss Materials in High-frequency Applications SANTA CLARA, Calif.Ã- – Anritsu Company (DesignCon booth #501) announces its VectorStar™ Vector Network Analyzer (VNA) will be part of a workshop conducted by DuPont Circuit & Packaging Materials (DuPont) (booth #719) and Rogers...
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Plastic Transistor Packages replace ceramic in RF applications.
Intended high-frequency, high-power applications, STAC plastic air-cavity packages feature junction-to-case thermal resistance (RTH) of 0.28Ã-
Read More »AdTech Ceramics to Exhibit at Electronica 2008
Chattanooga, TN, USA - AdTech Ceramics will participate in Electronica 2008 with sister company Statek Corporation of Orange, California this year In Area B6, Booth 456. AdTech Ceramics produces custom multilayer co-fire ceramic packages in 92% alumina (HTCC), Aluminum Nitride (AlN) and LTCC materials. In addition, ceramic/metal package assemblies are also available. A new HD Alumina system has...
Read More »Infineon Lays Foundation for New Industry Standard Package Technology
Technology Media November 12, 2007 Neubiberg, Germany, and Kaohsiung, Taiwan, November 12, 2007 - Infineon Technologies, a leading supplier of semiconductor and system solutions, and Advanced Semiconductor Engineering Inc. (ASE), the world's largest semiconductor packaging and test company, today announced a partnership to introduce semiconductor packages with a higher integration level of...
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Adhesive Tapes for Biopharma Applications
Download our free eBook to learn the various applications NADCO tapes used within the healthcare sector, the many benefits they provide, and how to select the right type.
Read More »Jacket Micro Devices Receives SEMICON West 2007 Technology Innovation Showcase Award
ATLANTA - MAY 8, 2007 - Jacket Micro Devices, Inc. (JMD) announced that its patented Multi-Layer organic (MLO) technology has been selected for the SEMI Technology Innovation Showcase award. SEMI's Technology Innovation Showcase is designed to highlight innovative technologies with new applications to current challenges in semiconductor manufacturing test and assembly. JMD's packaging technology...
Read More »Aimia Foods Launches Its New Galaxy-® Hot Chocolate Bliss Drink Mix in Sonoco Sono-Wrap-® Pack
CHICAGO, Oct. 31 -- Pack Expo 2006 -- Being the first in a new package is bliss for Aimia Foods, which recently introduced Galaxy-® Hot Chocolate Bliss, a traditional hot chocolate drink, in Sonoco's Sono-Wrap-® single-wrap paperboard package, Europe's first use of the innovative rectangle-shaped can for hot chocolate. Sonoco is supplying Aimia Foods with a 103 x 99 x 155mm (400 gram) Sono-...
Read More »Altera and White Electronic Designs Partner on Specialized Mil/Aero FPGA Packaging
First With Secure, Small Form-Factor Options for Military Applications San Jose, CA and Phoenix, AZ, Nov. 20, 2006-Altera Corporation (NASDAQ: ALTR) and White Electronic Designs Corporation (NASDAQ: WEDC) today announced a partnership that will enable military and aerospace customers access to a broad variety of packaging options for FPGAs that meet the rigorous requirements of defense...
Read More »Asymtek Wins 2006 Global Technology Award for Dual-Lane Dispensing System
Carlsbad, CA - October 17, 2006 -Asymtek, leader in dispensing technology and pioneer in jetting technology, announced it received a 2006 Global Technology Award from Global SMT & Packaging magazine for its Axiom X-1022 high-volume dual-lane dispensing system. This is the second consecutive year that Asymtek has won this award. The Global Technology Awards recognize the best new innovations in...
Read More »Memory Solution features space-saving stacked design.
Designed for mobile phone applications, Package-on-Package (PoP) memory solution is available in 12 x 12 mm (128 balls) and 14 x 14 mm (152 balls) sizes, with 0.65 mm ball pitch. Bottom PoP package features array of metallic balls on underside and array of footprints (lands) on top surface to receive mating Top BGA package. Technique allows devices to be assembled in vertical stacks consisting of...
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Ball Grid Array Package Design prevents content piracy.
CHC Series high-speed digital termination ball grid array (BGA) package is designed to prevent signal theft in consumer electronics devices. BGA termination network is constructed with no exposed conductors, and all termination balls and circuitry lay on bottom of device to eliminate any possibility of top side probing. Termination network is constructed with TaNFilmÃ-® process, which...
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Solve Any Large-scale Water Control Problem with the Aqua Dam Flood Barrier
Aqua Dam is the ultimate solution for large-scale water control projects. It combines lightweight, large size, and portability all in one innovative product. To learn more about the uses, and applications of Aqua Dam, or to see it in action, check out our new video to get all the details.
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