Electronic Packages

Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices.
Electronic Packages

Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices.

Norwood, MA - Remtec, a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors - MOSFETs and eGAN transistors amongst others - in the form of interposers and hermetic packages for...

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Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices.
Electronic Packages

Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices.

Norwood, MA - Remtec, a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors - MOSFETs and eGAN transistors amongst others - in the form of interposers and hermetic packages for...

Read More »
Electronic Packages

FlipChip International and Fujikura Ltd. Announce ChipletT(TM)/ ChipsetT(TM) Ultra Thin 3D Packages

PHOENIX, -- FlipChip International, LLC USA (FCI) and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT(TM) and ChipsetT(TM) embedded die packages for single die or multi-die semiconductor packaging applications. ChipletT and ChipsetT package products are based on Fujikura's flex-based laminate embedded die technology WABE Technology(TM)" and will provide breakthrough...

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Electronic Packages

FlipChip International and Fujikura Ltd. Announce ChipletT(TM)/ ChipsetT(TM) Ultra Thin 3D Packages

PHOENIX, -- FlipChip International, LLC USA (FCI) and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT(TM) and ChipsetT(TM) embedded die packages for single die or multi-die semiconductor packaging applications. ChipletT and ChipsetT package products are based on Fujikura's flex-based laminate embedded die technology WABE Technology(TM)" and will provide breakthrough...

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Electronic Packages

Hermetic SMT Transistor/Diode Package is qualified to DLA.

Suited for power transistors and diodes, U4 package is 70% percent smaller than U3 and offers Defense Logistics Agency (DLA) qualification for range of products. Devices assembled as vehicles for this package qualification included medium-power NPN and PNP bipolar transistors. With typical power rating of 5-15 W @ Tc=25C, package is constructed with aluminum nitride ceramic that optimizes heat...

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Electronic Packages

Hermetic SMT Transistor/Diode Package is qualified to DLA.

Suited for power transistors and diodes, U4 package is 70% percent smaller than U3 and offers Defense Logistics Agency (DLA) qualification for range of products. Devices assembled as vehicles for this package qualification included medium-power NPN and PNP bipolar transistors. With typical power rating of 5-15 W @ Tc=25C, package is constructed with aluminum nitride ceramic that optimizes heat...

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Remtec Adds New Gold-Tin Plating Line for Economic Production of High Quality Laser Diode Submounts and Semiconductor Packaging
Contract Manufacturing Services

Remtec Adds New Gold-Tin Plating Line for Economic Production of High Quality Laser Diode Submounts and Semiconductor Packaging

Norwood, MA. Remtec Inc., a leader in custom and semi-custom ceramic packaging based on Plated Copper & Thick Film (PCTF) technology has completed the installation of a new state-of-the-art gold-tin plating line and associated process control and quality assurance equipment. The contemporary new line provides Remtec with a completely integrated in-house capability to economically produce high...

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Remtec Adds New Gold-Tin Plating Line for Economic Production of High Quality Laser Diode Submounts and Semiconductor Packaging
Contract Manufacturing Services

Remtec Adds New Gold-Tin Plating Line for Economic Production of High Quality Laser Diode Submounts and Semiconductor Packaging

Norwood, MA. Remtec Inc., a leader in custom and semi-custom ceramic packaging based on Plated Copper & Thick Film (PCTF) technology has completed the installation of a new state-of-the-art gold-tin plating line and associated process control and quality assurance equipment. The contemporary new line provides Remtec with a completely integrated in-house capability to economically produce high...

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Packaging Materials

RF Micro Devices® Awarded $1.5 Million Navy Contract for GaN RF Power Technology

R&D Contract Backlog Over Next Six Quarters Increases to $5 Million GREENSBORO, N.C. -- RF Micro Devices (Nasdaq:RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced today that it has been awarded a $1.5 million R&D contract by the Office of Naval Research (ONR) related to gallium nitride (GaN)...

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Packaging Materials

RF Micro Devices-® Awarded $1.5 Million Navy Contract for GaN RF Power Technology

R&D Contract Backlog Over Next Six Quarters Increases to $5 Million GREENSBORO, N.C. -- RF Micro Devices (Nasdaq:RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced today that it has been awarded a $1.5 million R&D contract by the Office of Naval Research (ONR) related to gallium nitride (GaN)...

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