Electronic Components & Devices

Circus LED Lens Magnifier features auto shut off system.
Magnifiers

Circus LED Lens Magnifier features auto shut off system.

Delivering 90 CRI and 4000°K color temperature, Circus LED Lens Magnifiers are available in 3.5 or 5-diopter white crown glass lens. Featuring 6.5 in. diameter optical lens and die cast aluminum housing, units can be positioned vertically, horizontally and laterally with 45 in. spring-balanced arm. Designed with 10W circular LED module, units eliminate shadows. Offering secondary magnification...

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Processors

Eurocom Upgrades Mobile Supercomputer Laptops with Kaby Lake Desktop Processors up to Intel Core i7 7700K

Eurocom is upgrading the line of high-performance Mobile Supercomputer laptops with Intel Kaby Lake Desktop class processors. The EUROCOM Sky X9E2, X7E2, X4E2 and Tornado F5 Mobile Supercomputers will all receive the Intel Kaby lake Intel Core i7 desktop class processor upgrade. “Customers can now come to Eurocom for a potent combination of upgradeable Kaby Lake Intel Core i7 processors and...

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Millimeter-Wave Assemblies are fully integrated.
Converters

Millimeter-Wave Assemblies are fully integrated.

Being compact at 4 in. x 4 in. x 1.5 in., Upconverter and Downconverter Millimeter-Wave Assemblies can be customized up to 120GHz frequency. Used in advanced millimeter-wave test and telemetry equipment, product integrates amplification, mixing and filtering functions along with complete connections needed for installation. BUC Upconverters offer 25-40dB Gain over 4-10GHz of bandwidth while...

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Chip Sets

MT2533D Chipset delivers DMNR technology using DSP.

Used in wireless headphones, in-vehicle hands-free systems and stand-alone earpieces, MT2533D Chipset supports ARM Cortex-M4 architecture to provide high performance and low power consumption. MT2533D is combination of audio AFE, DSP, ARM Cortex-M4 processor, 4MB PSRAM and flash and dual-mode Bluetooth radio. Chipset supports A2DP, HFP, advanced wireless stereo and MP3 local playback and also...

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Processors

Snapdragon offers hybrid autofocus.

Integrating X16 LTE modem, Wave 2 Wi-Fi and Bluetooth® 5 and Multi-gigabit connectivity, Snapdragon™ 835 Processor is designed to deliver exceptionally long battery life, with VR and AR designs and cutting-edge camera capabilities. Featuring Adreno 540 GPU, Multi-gigabit Wi-Fi and Hexagon 682 DSP with HVX, unit is fabricated on 10 nm FinFET technology. Supporting aptX™ and aptX HD Bluetooth...

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Electrical Connectors

USB-C Connector enables USB Power Delivery for charging.

Based on EZ-PD™ USB-C controllers, USB-C Connector allows solution for smart phones, tablets and cameras for directly connecting to HDMI enabled sources. Used in connecting for all HD and 4k televisions with HDMI connections, unit supports for audio, video and data protocols. Delivering up to 100W of power and measures 2.4 mm thickness, connector enables for slim designs and is able to transmit...

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CSRF2043 Current Sense Chip Resistor uses foil on ceramic carrier technology.
Resistors

CSRF2043 Current Sense Chip Resistor uses foil on ceramic carrier technology.

Available in resistances ranging from 10 to 20 milliohm with 1% and 5% tolerance, CSRF2043 Current Sense Chip Resistors feature terminations on longer edge and has 50 ppm TCR. Operating up to 170 degree temperature, units are rated for 6 watts of power. Unit's foil on ceramic carrier technology provides reliable sense resistors and are used in conversion, power management, laser controls, bus...

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Armor

Hesco Launches Next Gen Law Enforcement Plates

ABERDEEN, Washington, Jan. 5, 2017 - Hesco is a leader in the design and manufacturing of American-made, thinner, lighter and concealable ballistic resistant body armor and at SHOT Show 2017, Las Vegas, Hesco will launch the next stage in the armor evolution. Working alongside manufacturers and national distributors, engineers at Hesco are able to better serve federal, state and local law...

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Modems

Qualcomm Cutting-Edge Automotive Solutions Power Next Generation Infotainment for Volkswagen Vehicles

--Upcoming Volkswagen AG Vehicles to Feature Snapdragon 820A Processor, and Snapdragon X12 and X5 LTE Modems, to Deliver Compelling In-car Experiences-- LAS VEGAS, Jan. 3, 2017 - At CES® 2017 today, Qualcomm Technologies, Inc. (QTI), a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), announced the integration of Qualcomm Technologies chipsets in the next-generation of Volkswagen AG vehicles....

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